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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5382544 |
Manufacturing method of a semiconductor device utilizing thin metal film |
Jan. 17, 1995 |
| 5376574 |
Capped modular microwave integrated circuit and method of making same |
Dec. 27, 1994 |
| 5376586 |
Method of curing thin films of organic dielectric material |
Dec. 27, 1994 |
| 5371047 |
Chip interconnection having a breathable etch stop layer |
Dec. 6, 1994 |
| 5354713 |
Contact manufacturing method of a multi-layered metal line structure |
Oct. 11, 1994 |
| 5305519 |
Multilevel interconnect structure and method of manufacturing the same |
Apr. 26, 1994 |
| 5302548 |
Semiconductor device manufacturing method |
Apr. 12, 1994 |
| 5284801 |
Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric |
Feb. 8, 1994 |
| 5282922 |
Hybrid circuit structures and methods of fabrication |
Feb. 1, 1994 |
| 5283208 |
Method of making a submicrometer local structure using an organic mandrel |
Feb. 1, 1994 |
| 5275973 |
Method for forming metallization in an integrated circuit |
Jan. 4, 1994 |
| 5270259 |
Method for fabricating an insulating film from a silicone resin using O.sub . |
Dec. 14, 1993 |
| 5266446 |
Method of making a multilayer thin film structure |
Nov. 30, 1993 |
| 5200300 |
Methods for forming high density multi-chip carriers |
Apr. 6, 1993 |
| 5194928 |
Passivation of metal in metal/polyimide structure |
Mar. 16, 1993 |
| 5194924 |
Semiconductor device of an LDD structure having a floating gate |
Mar. 16, 1993 |
| 5171713 |
Process for forming planarized, air-bridge interconnects on a semiconductor substrate |
Dec. 15, 1992 |
| 5141896 |
Process for the production of crossing points for interconnections of semiconductor devices |
Aug. 25, 1992 |
| 5128279 |
Charge neutralization using silicon-enriched oxide layer |
Jul. 7, 1992 |
| 5114757 |
Enhancement of polyimide adhesion on reactive metals |
May. 19, 1992 |
| 5114754 |
Passivation of metal in metal/polyimide structures |
May. 19, 1992 |
| 5112448 |
Self-aligned process for fabrication of interconnect structures in semiconductor applications |
May. 12, 1992 |
| 5110712 |
Incorporation of dielectric layers in a semiconductor |
May. 5, 1992 |
| 5109267 |
Method for producing an integrated circuit structure with a dense multilayer metallization pattern |
Apr. 28, 1992 |
| 5103288 |
Semiconductor device having multilayered wiring structure with a small parasitic capacitance |
Apr. 7, 1992 |
| 5091339 |
Trenching techniques for forming vias and channels in multilayer electrical interconnects |
Feb. 25, 1992 |
| 5091289 |
Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
Feb. 25, 1992 |
| 5024969 |
Hybrid circuit structure fabrication methods using high energy electron beam curing |
Jun. 18, 1991 |
| 5023205 |
Method of fabricating hybrid circuit structures |
Jun. 11, 1991 |
| 4963512 |
Method for forming conductor layers and method for fabricating multilayer substrates |
Oct. 16, 1990 |
| 4874721 |
Method of manufacturing a multichip package with increased adhesive strength |
Oct. 17, 1989 |
| 4857481 |
Method of fabricating airbridge metal interconnects |
Aug. 15, 1989 |
| 4843034 |
Fabrication of interlayer conductive paths in integrated circuits |
Jun. 27, 1989 |
| 4840923 |
Simultaneous multiple level interconnection process |
Jun. 20, 1989 |
| 4837183 |
Semiconductor device metallization process |
Jun. 6, 1989 |
| 4816115 |
Process of making via holes in a double-layer insulation |
Mar. 28, 1989 |
| 4803177 |
Method of forming interconnections and crossings between metallization levels of an integrated circuit |
Feb. 7, 1989 |
| 4801507 |
Arylsiloxane/silicate compositions useful as interlayer dielectric films |
Jan. 31, 1989 |
| 4743568 |
Multilevel interconnect transfer process |
May. 10, 1988 |
| 4721689 |
Method for simultaneously forming an interconnection level and via studs |
Jan. 26, 1988 |
| 4699803 |
Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers |
Oct. 13, 1987 |
| 4670967 |
Forming multilayer interconnections for a semiconductor device by vapor phase growth process |
Jun. 9, 1987 |
| H274 |
Method of manufacturing an integrated circuit chip and integrated circuit chip produced thereby |
May. 5, 1987 |
| 4656050 |
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers |
Apr. 7, 1987 |
| 4654113 |
Process for fabricating a semiconductor device |
Mar. 31, 1987 |
| 4654223 |
Method for forming a film of dielectric material on an electric component |
Mar. 31, 1987 |
| 4639277 |
Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material |
Jan. 27, 1987 |
| 4618878 |
Semiconductor device having a multilayer wiring structure using a polyimide resin |
Oct. 21, 1986 |
| 4569876 |
Multi-layered substrate having a fine wiring structure for LSI or VLSI circuits |
Feb. 11, 1986 |
| 4536951 |
Method of producing a layered structure |
Aug. 27, 1985 |
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