Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
6589882 Copper post-etch cleaning process Jul. 8, 2003
6589862 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices Jul. 8, 2003
6586325 Process for making an electronic device having a multilevel structure Jul. 1, 2003
6583049 Semiconductor integrated circuit device and method for making the same Jun. 24, 2003
6583048 Organosilicon precursors for interlayer dielectric films with low dielectric constants Jun. 24, 2003
6583047 Method for eliminating reaction between photoresist and OSG Jun. 24, 2003
6580143 Thin-film circuit substrate and method of producing same Jun. 17, 2003
6576545 Semiconductor devices with dual nature capping/ARC layers on fluorine doped silica glass inter-layer dielectrics and method of forming capping/ARC layers Jun. 10, 2003
6566244 Process for improving mechanical strength of layers of low k dielectric material May. 20, 2003
6566242 Dual damascene copper interconnect to a damascene tungsten wiring level May. 20, 2003
6562710 Semiconductor device and method for fabricating the same May. 13, 2003
6559076 Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device May. 6, 2003
6559045 Fabrication of integrated circuits with borderless vias May. 6, 2003
6559070 Mesoporous silica films with mobile ion gettering and accelerated processing May. 6, 2003
6559033 Processing for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines May. 6, 2003
6552438 Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same Apr. 22, 2003
6551921 Method of polishing a stack of dielectric layers including a fluorine containing silicon oxide layer Apr. 22, 2003
6548107 Methods of forming an insulating material proximate a substrate, and methods of forming an insulating material between components of an integrated circuit Apr. 15, 2003
6548400 Method of fabricating interlevel connectors using only one photomask step Apr. 15, 2003
6541396 Method of manufacturing a semiconductor device using a low dielectric constant organic film grown in a vacuum above an inlaid interconnection layer Apr. 1, 2003
6541368 Metal lines of semiconductor devices and methods for forming Apr. 1, 2003
6541286 Imaging of integrated circuit interconnects Apr. 1, 2003
6541367 Very low dielectric constant plasma-enhanced CVD films Apr. 1, 2003
6537908 Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask Mar. 25, 2003
6537904 Method for manufacturing a semiconductor device having a fluorine containing carbon inter-layer dielectric film Mar. 25, 2003
6537923 Process for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines Mar. 25, 2003
6531389 Method for forming incompletely landed via with attenuated contact resistance Mar. 11, 2003
6528349 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability Mar. 4, 2003
6524944 Low k ILD process by removable ILD Feb. 25, 2003
6524948 Semiconductor device and method for fabricating the same Feb. 25, 2003
6524973 Method for forming low dielectric constant layer Feb. 25, 2003
6521533 Method for producing a copper connection Feb. 18, 2003
6521524 Via filled dual damascene structure with middle stop layer and method for making the same Feb. 18, 2003
6521548 Method of forming a spin-on-passivation layer Feb. 18, 2003
6522008 Subtractive metallization structure with low dielectric constant insulating layers Feb. 18, 2003
6518170 Method of manufacturing a semiconductor device Feb. 11, 2003
6518168 Self-assembled monolayer directed patterning of surfaces Feb. 11, 2003
6518169 Semiconductor device and method for fabricating the same Feb. 11, 2003
6518166 Liquid phase deposition of a silicon oxide layer for use as a liner on the surface of a dual damascene opening in a low dielectric constant layer Feb. 11, 2003
6514860 Integration of organic fill for dual damascene process Feb. 4, 2003
6514850 Interface with dielectric layer and method of making Feb. 4, 2003
6514872 Method of manufacturing a semiconductor device Feb. 4, 2003
6511916 Method for removing the photoresist layer in the damascene process Jan. 28, 2003
6511909 Method of depositing a low K dielectric with organo silane Jan. 28, 2003
6511904 Reverse mask and nitride layer deposition for reduction of vertical capacitance variation in multi-layer metallization systems Jan. 28, 2003
6511903 Method of depositing a low k dielectric with organo silane Jan. 28, 2003
6509623 Microelectronic air-gap structures and methods of forming the same Jan. 21, 2003
6509259 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices Jan. 21, 2003
6506673 Method of forming a reverse gate structure with a spin on glass process Jan. 14, 2003
6507045 LCD with increased pixel opening sizes Jan. 14, 2003

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20










 
 
  Recently Added Patents
Automatic population of feature capabilities on a communication device
Event handling in an integrated execution environment
Preserving user applied markings made to a hardcopy original document
Newly identified human rhinovirus of HRV-C and methods and kits for detecting HRV-Cs
Managing multiple web services on a single device
Image forming apparatus with static elimination
Image forming apparatus, information processing method, and storage medium for generating screen information
  Randomly Featured Patents
Automotive vehicle power-steering system and method
Skull pot for melting or refining inorganic substances
Method for the installation and removal of a cylinder of a printing machine and device for this purpose
Re-terminable LC connector assembly and cam termination tool
Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package
Wood putter head
Head fixation assemblies for medical procedures
Universal combined milling and boring machine
Photosensitive material for use in electrophotography with a poly alkyl or benzyl glutamate
High conductivity energy-saving clamping device