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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6809024 Method to fabricate high-performance NPN transistors in a BiCMOS process Oct. 26, 2004
6809023 Method of manufacturing semiconductor device having uniform crystal grains in a crystalline semiconductor film Oct. 26, 2004
6806161 Process for preparing insulating material having low dielectric constant Oct. 19, 2004
6806182 Method for eliminating via resistance shift in organic ILD Oct. 19, 2004
6803327 Cost effective polymide process to solve passivation extrusion or damage and SOG delminates Oct. 12, 2004
6803326 Porous silicon oxycarbide integrated circuit insulator Oct. 12, 2004
6799907 Plasma enhanced method for increasing silicon-containing photoresist selectivity Oct. 5, 2004
6800547 Integrated circuit dielectric and method Oct. 5, 2004
6800546 Film forming method by radiating a plasma on a surface of a low dielectric constant film Oct. 5, 2004
6797605 Method to improve adhesion of dielectric films in damascene interconnects Sep. 28, 2004
6797643 Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power Sep. 28, 2004
6797983 Method of fabrication LCOS structure Sep. 28, 2004
6797607 Contact planarization using nanoporous silica materials Sep. 28, 2004
6794283 Semiconductor device and fabrication method thereof Sep. 21, 2004
6790766 Method of fabricating semiconductor device having low dielectric constant insulator film Sep. 14, 2004
6787445 Method for fabricating semiconductor device Sep. 7, 2004
6787446 Fabrication method of semiconductor integrated circuit device Sep. 7, 2004
6784092 Method of forming insulating film and method of manufacturing semiconductor device Aug. 31, 2004
6783862 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures Aug. 31, 2004
6784017 Method of creating a high performance organic semiconductor device Aug. 31, 2004
6780755 Gas dome dielectric system for ULSI interconnects Aug. 24, 2004
6780757 Semiconductor integrated circuit device and method for making the same Aug. 24, 2004
6777321 Method of forming buried wiring Aug. 17, 2004
6774040 Apparatus and method for surface finishing a silicon film Aug. 10, 2004
6770556 Method of depositing a low dielectric with organo silane Aug. 3, 2004
6767807 Method for producing organic thin film device and transfer material used therein Jul. 27, 2004
6764774 Structures with improved adhesion to Si and C containing dielectrics and method for preparing the same Jul. 20, 2004
6762498 Ball grid array package for high speed devices Jul. 13, 2004
6759318 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process Jul. 6, 2004
6759321 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation Jul. 6, 2004
6759317 Method of manufacturing semiconductor device having passivation film and buffer coating film Jul. 6, 2004
6756295 Chip structure and process for forming the same Jun. 29, 2004
6753247 Method(s) facilitating formation of memory cell(s) and patterned conductive Jun. 22, 2004
6750138 Semiconductor device of multi-wiring structure and method of manufacturing the same Jun. 15, 2004
6746969 Method of manufacturing semiconductor device Jun. 8, 2004
6746951 Bond pad of semiconductor device and method of fabricating the same Jun. 8, 2004
6747355 Semiconductor device and method for manufacturing the same Jun. 8, 2004
6740579 Method of making a semiconductor device that includes a dual damascene interconnect May. 25, 2004
6737345 Scheme to define laser fuse in dual damascene CU process May. 18, 2004
6734561 Semiconductor device and a method of producing the same May. 11, 2004
6730982 FBEOL process for Cu metallizations free from Al-wirebond pads May. 4, 2004
6730591 Method of using silicon rich carbide as a barrier material for fluorinated materials May. 4, 2004
6723633 Method for forming multi-layer wiring structure Apr. 20, 2004
6723634 Method of forming interconnects with improved barrier layer adhesion Apr. 20, 2004
6720240 Silicon based nanospheres and nanowires Apr. 13, 2004
6716741 Method of patterning dielectric layer with low dielectric constant Apr. 6, 2004
6716742 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics Apr. 6, 2004
6716740 Method for depositing silicon oxide incorporating an outgassing step Apr. 6, 2004
6713364 Method for forming an insulator having a low dielectric constant on a semiconductor substrate Mar. 30, 2004
6713382 Vapor treatment for repairing damage of low-k dielectric Mar. 30, 2004

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