| |
 |
|
Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611986 |
Dual damascene patterning method |
Nov. 3, 2009 |
| 7601631 |
Very low dielectric constant plasma-enhanced CVD films |
Oct. 13, 2009 |
| 7598166 |
Dielectric layers for metal lines in semiconductor chips |
Oct. 6, 2009 |
| 7598173 |
Electro-optic displays, and components for use therein |
Oct. 6, 2009 |
| 7592249 |
Method for manufacturing a semiconductor device |
Sep. 22, 2009 |
| 7582555 |
CVD flowable gap fill |
Sep. 1, 2009 |
| 7579647 |
Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
Aug. 25, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575981 |
Method for fabricating isolation layer in semiconductor device |
Aug. 18, 2009 |
| 7572723 |
Micropad for bonding and a method therefor |
Aug. 11, 2009 |
| 7572710 |
Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
Aug. 11, 2009 |
| 7563706 |
Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
Jul. 21, 2009 |
| 7563707 |
Laser process for reliable and low-resistance electrical contacts |
Jul. 21, 2009 |
| 7563728 |
Methods of modifying interlayer adhesion |
Jul. 21, 2009 |
| 7560307 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
Jul. 14, 2009 |
| 7560377 |
Plasma processes for depositing low dielectric constant films |
Jul. 14, 2009 |
| 7554176 |
Integrated circuits having a multi-layer structure with a seal ring |
Jun. 30, 2009 |
| 7553707 |
Method for manufacturing a Liquid crystal display device |
Jun. 30, 2009 |
| 7541277 |
Stress relaxation, selective nitride phase removal |
Jun. 2, 2009 |
| 7537964 |
Method of fabricating a miniature silicon condenser microphone |
May. 26, 2009 |
| 7534717 |
Method of manufacturing semiconductor device |
May. 19, 2009 |
| 7534721 |
Semiconductor device manufacturing device |
May. 19, 2009 |
| 7534718 |
Post passivation interconnection schemes on top of IC chips |
May. 19, 2009 |
| 7531432 |
Block-molded semiconductor device singulation methods and systems |
May. 12, 2009 |
| 7531444 |
Method to create air gaps using non-plasma processes to damage ILD materials |
May. 12, 2009 |
| 7524759 |
Post passivation interconnection schemes on top of IC chip |
Apr. 28, 2009 |
| 7521354 |
Low k interlevel dielectric layer fabrication methods |
Apr. 21, 2009 |
| 7521353 |
Method for reducing dielectric overetch when making contact to conductive features |
Apr. 21, 2009 |
| 7514371 |
Semiconductor substrate surface protection method |
Apr. 7, 2009 |
| 7510959 |
Method of manufacturing a semiconductor device having damascene structures with air gaps |
Mar. 31, 2009 |
| 7504719 |
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same |
Mar. 17, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7501339 |
Methods for making dual-damascene dielectric structures |
Mar. 10, 2009 |
| 7491658 |
Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality |
Feb. 17, 2009 |
| 7485569 |
Printed circuit board including embedded chips and method of fabricating the same |
Feb. 3, 2009 |
| 7482259 |
Chip structure and process for forming the same |
Jan. 27, 2009 |
| 7482263 |
Semiconductor device and method for manufacturing the same |
Jan. 27, 2009 |
| 7482286 |
Method for forming dielectric or metallic films |
Jan. 27, 2009 |
| 7482687 |
Etch stop in a damascene interconnect structure |
Jan. 27, 2009 |
| 7479450 |
Post passivation interconnection schemes on top of the IC chips |
Jan. 20, 2009 |
| 7476609 |
Forming of a cavity in an insulating layer |
Jan. 13, 2009 |
| 7473652 |
Organic polymers, electronic devices, and methods |
Jan. 6, 2009 |
| 7470610 |
Method of fabricating organic electroluminescent devices |
Dec. 30, 2008 |
| 7456067 |
Method with high gapfill capability for semiconductor devices |
Nov. 25, 2008 |
| 7452795 |
Semiconductor device and method for fabricating the same |
Nov. 18, 2008 |
| 7452802 |
Method of forming metal wiring for high voltage element |
Nov. 18, 2008 |
| 7449408 |
Method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7446030 |
Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
Nov. 4, 2008 |
| 7446031 |
Post passivation interconnection schemes on top of IC chips |
Nov. 4, 2008 |
| 7446035 |
Post passivation interconnection schemes on top of IC chips |
Nov. 4, 2008 |
|
|
|
