Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/622
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)
Description: Processes wherein there are plural levels of metal forming electrical contact material, the levels being separated by intervening dielectric material except at designated openings therethrough.










Sub-classes under this class:

Class Number Class Name Patents
438/625 At least one metallization level formed of diverse conductive layers 510
438/631 Having planarization step 759
438/623 Including organic insulating material between metal levels 951
438/636 Including use of antireflective layer 456
438/635 Insulator formed by reaction with conductor (e.g., oxidation, etc.) 222
438/641 Selective deposition 223
438/624 Separating insulating layer is laminate or composite of plural insulating materials 1,572
438/637 With formation of opening (i.e., viahole) in insulative layer 3,347


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
7595269 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Sep. 29, 2009
7592252 Versatile system for charge dissipation in the formation of semiconductor device structures Sep. 22, 2009
7592250 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device Sep. 22, 2009
7592248 Method of forming semiconductor device having nanotube structures Sep. 22, 2009
7589014 Semiconductor device having multiple wiring layers and method of producing the same Sep. 15, 2009
7589013 Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same Sep. 15, 2009
7589011 Semiconductor device and method of forming intermetal dielectric layer Sep. 15, 2009
7589008 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods Sep. 15, 2009
7588950 Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same Sep. 15, 2009
7586194 Semiconductor device having exposed heat dissipating metal plate Sep. 8, 2009
7586175 Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface Sep. 8, 2009
7585763 Methods of fabricating integrated circuit devices using anti-reflective coating as implant blocking layer Sep. 8, 2009
7585758 Interconnect layers without electromigration Sep. 8, 2009
7579278 Topography directed patterning Aug. 25, 2009
7579270 Method for manufacturing a semiconductor device Aug. 25, 2009
7576405 Semiconductor integrated circuit for reducing leak current through MOS transistors Aug. 18, 2009
7576382 Semiconductor integrated device and method of providing shield interconnection therein Aug. 18, 2009
7575999 Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies Aug. 18, 2009
7575995 Method of forming fine metal pattern and method of forming metal line using the same Aug. 18, 2009
7575981 Method for fabricating isolation layer in semiconductor device Aug. 18, 2009
7572710 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects Aug. 11, 2009
7569845 Phase-change memory and fabrication method thereof Aug. 4, 2009
7569477 Method for fabricating fine pattern in semiconductor device Aug. 4, 2009
7569476 Semiconductor integrated circuit device and a method of manufacturing the same Aug. 4, 2009
7566650 Integrated circuit solder bumping system Jul. 28, 2009
7563730 Hafnium lanthanide oxynitride films Jul. 21, 2009
7563728 Methods of modifying interlayer adhesion Jul. 21, 2009
7563705 Manufacturing method of semiconductor device Jul. 21, 2009
7563704 Method of forming an interconnect including a dielectric cap having a tensile stress Jul. 21, 2009
7563701 Self-aligned contacts for transistors Jul. 21, 2009
7560376 Method for adjoining adjacent coatings on a processing element Jul. 14, 2009
7560375 Gas dielectric structure forming methods Jul. 14, 2009
7560307 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Jul. 14, 2009
7557447 Semiconductor device and method for manufacturing same Jul. 7, 2009
7557025 Method of etching a dielectric layer to form a contact hole and a via hole and damascene method Jul. 7, 2009
7554176 Integrated circuits having a multi-layer structure with a seal ring Jun. 30, 2009
7554145 Magnetic memory cells and manufacturing methods Jun. 30, 2009
7553756 Process for producing semiconductor integrated circuit device Jun. 30, 2009
7553755 Method for symmetric deposition of metal layer Jun. 30, 2009
7553703 Methods of forming an interconnect structure Jun. 30, 2009
7550376 Semiconductor device capable of suppressing current concentration in pad and its manufacture method Jun. 23, 2009
7550325 Method of manufacturing an active matrix display device Jun. 23, 2009
7547627 Method for manufacturing semiconductor device Jun. 16, 2009
7545034 Thermal energy removal structure and method Jun. 9, 2009
7544605 Method of making a contact on a backside of a die Jun. 9, 2009
7544604 Tantalum lanthanide oxynitride films Jun. 9, 2009
7544603 Method of fabricating silicon nitride layer and method of fabricating semiconductor device Jun. 9, 2009
7544569 Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing Jun. 9, 2009
7541278 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment Jun. 2, 2009
7541277 Stress relaxation, selective nitride phase removal Jun. 2, 2009

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
Use of Lactobacillus for liver protection
Method and system for placing an emergency call
Imaging lens with three lens elements, and electronic apparatus having the same
Dihydronaphthyridinyl(organo)methanone analogs as positive allosteric mGluR5 modulators
Push-up bar
Portable stand for computer
Bipolar junction transistor with a self-aligned emitter and base
  Randomly Featured Patents
Roller sunshade for mounting on car roof
Method and apparatus for transmitting real-time data in multi-access systems
Lighting fixture
Solar power generation assembly
Coal liquefaction and hydroprocessing of petroleum oils
Waste compaction and lift gate mechanism
Deactivation hydraulic valve lifter
Multi-frequency capacitance sensor
Method and apparatus for the freeform growth of three-dimensional structures using pressurized precursor flows and growth rate control
Electronic assay device and method