Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/622
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)
Description: Processes wherein there are plural levels of metal forming electrical contact material, the levels being separated by intervening dielectric material except at designated openings therethrough.










Sub-classes under this class:

Class Number Class Name Patents
438/625 At least one metallization level formed of diverse conductive layers 510
438/631 Having planarization step 759
438/623 Including organic insulating material between metal levels 951
438/636 Including use of antireflective layer 456
438/635 Insulator formed by reaction with conductor (e.g., oxidation, etc.) 222
438/641 Selective deposition 223
438/624 Separating insulating layer is laminate or composite of plural insulating materials 1,572
438/637 With formation of opening (i.e., viahole) in insulative layer 3,347


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
7781328 Multilayer substrate Aug. 24, 2010
7781327 Resputtering process for eliminating dielectric damage Aug. 24, 2010
7781326 Formation of a tantalum-nitride layer Aug. 24, 2010
7781320 Method for fabricating a semiconductor device by considering the extinction coefficient during etching of an interlayer insulating film Aug. 24, 2010
RE41538 Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby Aug. 17, 2010
7776739 Semiconductor device interconnection contact and fabrication method Aug. 17, 2010
7776737 Reliability of wide interconnects Aug. 17, 2010
7776736 Substrate for electronic device capable of suppressing fluorine atoms exposed at the surface of insulating film from reacting with water and method for processing same Aug. 17, 2010
7772706 Air-gap ILD with unlanded vias Aug. 10, 2010
7772111 Substrate processing method and fabrication process of a semiconductor device Aug. 10, 2010
7772109 Manufacturing method of multilayer wiring substrate Aug. 10, 2010
7772106 Method of forming an inductor on a semiconductor wafer Aug. 10, 2010
7772028 CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom Aug. 10, 2010
7767576 Wafer level package having floated metal line and method thereof Aug. 3, 2010
7767570 Dummy vias for damascene process Aug. 3, 2010
7767262 Nitrogen profile engineering in nitrided high dielectric constant films Aug. 3, 2010
7763969 Structure with semiconductor chips embeded therein Jul. 27, 2010
7763968 Semiconductor device featuring large reinforcing elements in pad area Jul. 27, 2010
7763539 Method for manufacturing semiconductor device Jul. 27, 2010
7763537 Metal interconnection of semiconductor device and method for forming the same Jul. 27, 2010
7759243 Method for forming an on-chip high frequency electro-static discharge device Jul. 20, 2010
7759242 Method of fabricating an integrated circuit Jul. 20, 2010
7759241 Group II element alloys for protecting metal interconnects Jul. 20, 2010
7754599 Structure for reducing stress for vias and fabricating method thereof Jul. 13, 2010
7754598 Method for manufacturing coreless packaging substrate Jul. 13, 2010
7754574 Optimum padset for wire bonding RF technologies with high-Q inductors Jul. 13, 2010
7754538 Packaging substrate structure with electronic components embedded therein and method for manufacturing the same Jul. 13, 2010
7749894 Integrated circuit processing system Jul. 6, 2010
7749893 Methods and systems for low interfacial oxide contact between barrier and copper metallization Jul. 6, 2010
7749892 Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices Jul. 6, 2010
7749891 Method and fabricating semiconductor device and semiconductor device Jul. 6, 2010
7749809 Methods and systems for packaging integrated circuits Jul. 6, 2010
7745327 Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime Jun. 29, 2010
7745326 Semiconductor device having multiple wiring layers and method of producing the same Jun. 29, 2010
7745325 Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memo Jun. 29, 2010
7745324 Interconnect with recessed dielectric adjacent a noble metal cap Jun. 29, 2010
7745323 Metal interconnection of a semiconductor device and method of fabricating the same Jun. 29, 2010
7745282 Interconnect structure with bi-layer metal cap Jun. 29, 2010
7741717 Metal line of semiconductor device and method of fabricating the same Jun. 22, 2010
7741696 Semiconductor integrated circuit including metal mesh structure Jun. 22, 2010
7741213 Semiconductor device, DRAM integrated circuit device, and method of producing the same Jun. 22, 2010
7741210 Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry Jun. 22, 2010
7741209 Contact structure of semiconductor device and method for fabricating the same Jun. 22, 2010
7741162 Method for manufacturing high-frequency module device Jun. 22, 2010
7737026 Structure and method for low resistance interconnections Jun. 15, 2010
7737022 Contact formation Jun. 15, 2010
7737021 Resist trim process to define small openings in dielectric layers Jun. 15, 2010
7732926 Semiconductor device having a through electrode with a low resistance and method of manufacturing the same Jun. 8, 2010
7732349 Manufacturing method of insulating film and semiconductor device Jun. 8, 2010
7732321 Method for shielding integrated circuits Jun. 8, 2010

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
System and method for enhancing buyer and seller interaction during a group-buying sale
Process for preparing soybean curd using micronized solution of soybean curd
Administrable compositions
Methods and apparatus for ultrasonic cleaning
Methods and systems for distributing broadcast messages on various networks
Electronic device including predicted frequency error estimation of a voltage controlled oscillator and related methods
Methods and apparatus to perform time zone determination by a mobile station
  Randomly Featured Patents
Web feeder with controlled electrostatic force and method
Dog collar with feathers
Tow bar protection device
Automatic plate feeding apparatus for embossing machines
One piece, non-welded holdown
Ink for changeable color applications
Dust collector
Flat display panel comprising an envelope including a substrate having terminal-receiving grooves
Cam for shifting a transfer device and a cleaning device
Computer-assisted surgical system