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Class Information
Number: 438/622
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)
Description: Processes wherein there are plural levels of metal forming electrical contact material, the levels being separated by intervening dielectric material except at designated openings therethrough.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619310 |
Semiconductor interconnect and method of making same |
Nov. 17, 2009 |
| 7618887 |
Semiconductor device with a metal line and method of forming the same |
Nov. 17, 2009 |
| 7615481 |
Method of manufacturing multilevel interconnect structure and multilevel interconnect structure |
Nov. 10, 2009 |
| 7615480 |
Methods of post-contact back end of the line through-hole via integration |
Nov. 10, 2009 |
| 7611982 |
Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
Nov. 3, 2009 |
| 7601632 |
Method of forming a metal line of a semiconductor device |
Oct. 13, 2009 |
| 7601631 |
Very low dielectric constant plasma-enhanced CVD films |
Oct. 13, 2009 |
| 7601577 |
Work function control of metals |
Oct. 13, 2009 |
| 7598174 |
Feature patterning methods |
Oct. 6, 2009 |
| 7598167 |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures |
Oct. 6, 2009 |
| 7598166 |
Dielectric layers for metal lines in semiconductor chips |
Oct. 6, 2009 |
| 7598165 |
Methods for forming a multiplexer of a memory device |
Oct. 6, 2009 |
| 7595269 |
Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer |
Sep. 29, 2009 |
| 7592252 |
Versatile system for charge dissipation in the formation of semiconductor device structures |
Sep. 22, 2009 |
| 7592250 |
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
Sep. 22, 2009 |
| 7592248 |
Method of forming semiconductor device having nanotube structures |
Sep. 22, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7589013 |
Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same |
Sep. 15, 2009 |
| 7589011 |
Semiconductor device and method of forming intermetal dielectric layer |
Sep. 15, 2009 |
| 7589008 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
Sep. 15, 2009 |
| 7588950 |
Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same |
Sep. 15, 2009 |
| 7586194 |
Semiconductor device having exposed heat dissipating metal plate |
Sep. 8, 2009 |
| 7586175 |
Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface |
Sep. 8, 2009 |
| 7585763 |
Methods of fabricating integrated circuit devices using anti-reflective coating as implant blocking layer |
Sep. 8, 2009 |
| 7585758 |
Interconnect layers without electromigration |
Sep. 8, 2009 |
| 7579278 |
Topography directed patterning |
Aug. 25, 2009 |
| 7579270 |
Method for manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7576405 |
Semiconductor integrated circuit for reducing leak current through MOS transistors |
Aug. 18, 2009 |
| 7576382 |
Semiconductor integrated device and method of providing shield interconnection therein |
Aug. 18, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575995 |
Method of forming fine metal pattern and method of forming metal line using the same |
Aug. 18, 2009 |
| 7575981 |
Method for fabricating isolation layer in semiconductor device |
Aug. 18, 2009 |
| 7572710 |
Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
Aug. 11, 2009 |
| 7569845 |
Phase-change memory and fabrication method thereof |
Aug. 4, 2009 |
| 7569477 |
Method for fabricating fine pattern in semiconductor device |
Aug. 4, 2009 |
| 7569476 |
Semiconductor integrated circuit device and a method of manufacturing the same |
Aug. 4, 2009 |
| 7566650 |
Integrated circuit solder bumping system |
Jul. 28, 2009 |
| 7563730 |
Hafnium lanthanide oxynitride films |
Jul. 21, 2009 |
| 7563728 |
Methods of modifying interlayer adhesion |
Jul. 21, 2009 |
| 7563705 |
Manufacturing method of semiconductor device |
Jul. 21, 2009 |
| 7563704 |
Method of forming an interconnect including a dielectric cap having a tensile stress |
Jul. 21, 2009 |
| 7563701 |
Self-aligned contacts for transistors |
Jul. 21, 2009 |
| 7560376 |
Method for adjoining adjacent coatings on a processing element |
Jul. 14, 2009 |
| 7560375 |
Gas dielectric structure forming methods |
Jul. 14, 2009 |
| 7560307 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
Jul. 14, 2009 |
| 7557447 |
Semiconductor device and method for manufacturing same |
Jul. 7, 2009 |
| 7557025 |
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method |
Jul. 7, 2009 |
| 7554176 |
Integrated circuits having a multi-layer structure with a seal ring |
Jun. 30, 2009 |
| 7554145 |
Magnetic memory cells and manufacturing methods |
Jun. 30, 2009 |
| 7553756 |
Process for producing semiconductor integrated circuit device |
Jun. 30, 2009 |
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