Resources Contact Us Home
Browse by Category: Main > Engineering
Class Information
Number: 438/621
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.)
Description: Processes wherein at least one electrical contact is formed to a semiconductive region which is diversely doped (more heavily doped, oppositely doped, etc.) with respect to the semiconductive region contacted by another electrical contact.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8669582 Light emitting diode Mar. 11, 2014
8633105 Method of fabricating a self-aligning damascene memory structure Jan. 21, 2014
8633591 Electronic device Jan. 21, 2014
8551818 Method of manufacturing electronic device and display Oct. 8, 2013
8507375 Alignment tolerant semiconductor contact and method Aug. 13, 2013
8450216 Contact etch stop layers of a field effect transistor May. 28, 2013
8435876 Method of manufacturing semiconductor device May. 7, 2013
8409949 Non-volatile semiconductor memory device and method of manufacturing the same Apr. 2, 2013
8389399 Method of fabricating a self-aligning damascene memory structure Mar. 5, 2013
8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Feb. 19, 2013
8354340 Electronic device and method of manufacturing the same Jan. 15, 2013
8319264 Semiconductor device and method for manufacturing the same Nov. 27, 2012
8278721 Contact hole, semiconductor device and method for forming the same Oct. 2, 2012
8247286 Semiconductor device having transistor and method of manufacturing the same Aug. 21, 2012
8158473 Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy Apr. 17, 2012
8097535 Fabrication of self-assembled nanowire-type interconnects on a semiconductor device Jan. 17, 2012
8048689 Semiconductor chip with backside conductor structure Nov. 1, 2011
8017471 Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry Sep. 13, 2011
8004087 Semiconductor device with dual damascene wirings and method for manufacturing same Aug. 23, 2011
7884002 Method of fabricating self aligned Schottky junctions for semiconductor devices Feb. 8, 2011
7863180 Through substrate via including variable sidewall profile Jan. 4, 2011
7829449 Process for fabricating an electronic integrated circuit and electronic integrated circuit thus obtained Nov. 9, 2010
7825398 Memory cell having improved mechanical stability Nov. 2, 2010
7804158 Electronic device with shielding structure and method of manufacturing the same Sep. 28, 2010
7781802 Semiconductor device and manufacturing method thereof Aug. 24, 2010
7749890 Low contact resistance metal contact Jul. 6, 2010
7745323 Metal interconnection of a semiconductor device and method of fabricating the same Jun. 29, 2010
7700418 Method for production of thin-film semiconductor device Apr. 20, 2010
7655563 Method for preventing the formation of dentrites in a semiconductor Feb. 2, 2010
7629247 Method of fabricating a self-aligning damascene memory structure Dec. 8, 2009
7595232 CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors Sep. 29, 2009
7579270 Method for manufacturing a semiconductor device Aug. 25, 2009
7572723 Micropad for bonding and a method therefor Aug. 11, 2009
7566651 Low contact resistance metal contact Jul. 28, 2009
7541277 Stress relaxation, selective nitride phase removal Jun. 2, 2009
7445958 Semiconductor device having a leading wiring layer Nov. 4, 2008
7442635 Method for producing a semiconductor device and resulting device Oct. 28, 2008
7422965 Methods of fabricating p-type transistors including germanium channel regions Sep. 9, 2008
7410817 Liquid crystal display device including driving circuit and method of fabricating the same Aug. 12, 2008
7358131 Methods of forming SRAM constructions Apr. 15, 2008
7323785 Semiconductor device Jan. 29, 2008
7307012 Post vertical interconnects formed with silicide etch stop and method of making Dec. 11, 2007
7256143 Semiconductor device having self-aligned contact plug and method for fabricating the same Aug. 14, 2007
7247550 Silicon carbide-based device contact and contact fabrication method Jul. 24, 2007
7183194 Method of forming socket contacts Feb. 27, 2007
7098128 Method for filling electrically different features Aug. 29, 2006
6902998 Methods of manufacturing semiconductor devices having storage nodes Jun. 7, 2005
6897145 Method for fabricating semiconductor device by forming damascene interconnections May. 24, 2005
6838772 Semiconductor device Jan. 4, 2005
6815351 Method for contacting a semiconductor configuration Nov. 9, 2004

1 2 3 4

  Recently Added Patents
Amplitude-shift-keying (ASK) envelope detector and demodulation circuits
Cell reselection and handover with multimedia broadcast/multicast service
Automated gate system
Cell transport system comprising a homogeneous mixture of agarose and agarase
Active pulse blood constituent monitoring
Spatially pre-processed target-to-jammer ratio weighted filter and method thereof
Topical antibiotic composition for the prevention of Lyme disease
  Randomly Featured Patents
Application initiated negotiations for resources meeting a performance parameter in a virtualized computing environment
Flutation process for the flutation of coarse fractions of potash ores
Combination of analog to digital converter and error correction circuit
Digital arrangement for determining average current of a circuit by monitoring a voltage
Soybean cultivar S07-03JR108674
Base oil blends for conveyor chain lubricating compositions
System and method for continuous software configuration, test and build management
Navigation system for transmitting real-time information allowing instant judgement of next action
Fuel cell system with cathode-side water separating devices