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Class Information
Number: 438/620
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Forming contacts of differing depths into semiconductor substrate
Description: Processes wherein at least one electrical contact is formed at a depth into the semiconductive substrate which differs from that of another electrical contact.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8709937 Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the same Apr. 29, 2014
8685809 Semiconductor structures having improved contact resistance Apr. 1, 2014
8669176 BEOL integration scheme for copper CMP to prevent dendrite formation Mar. 11, 2014
8647982 Methods of forming interconnects in a semiconductor structure Feb. 11, 2014
8633099 Method for forming interlayer connectors in a three-dimensional stacked IC device Jan. 21, 2014
8633591 Electronic device Jan. 21, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8592303 Wiring structure and method for manufacturing the same Nov. 26, 2013
8592302 Patterning method for fabrication of a semiconductor device Nov. 26, 2013
8587131 Through-silicon via and fabrication method thereof Nov. 19, 2013
8580689 Plasma processing method Nov. 12, 2013
8569164 Through substrate structure, device package having the same, and methods for manufacturing the same Oct. 29, 2013
8569794 Group III nitride semiconductor device and method for manufacturing the same, group III nitride semiconductor light-emitting device and method for manufacturing the same, and lamp Oct. 29, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8551818 Method of manufacturing electronic device and display Oct. 8, 2013
8536042 Method of forming a topside contact to a backside terminal of a semiconductor device Sep. 17, 2013
8536046 Partitioned through-layer via and associated systems and methods Sep. 17, 2013
8531042 Technique for fabricating microsprings on non-planar surfaces Sep. 10, 2013
8509277 Optical device Aug. 13, 2013
8497206 Method of processing backside copper layer for semiconductor chips Jul. 30, 2013
8476160 Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall Jul. 2, 2013
8450216 Contact etch stop layers of a field effect transistor May. 28, 2013
8435859 Methods of forming electrical contacts May. 7, 2013
8420525 Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof Apr. 16, 2013
8420528 Manufacturing method of a semiconductor device having wirings Apr. 16, 2013
8409949 Non-volatile semiconductor memory device and method of manufacturing the same Apr. 2, 2013
8389396 Method for manufacture of integrated circuit package system with protected conductive layers for pads Mar. 5, 2013
8367538 Partitioned through-layer via and associated systems and methods Feb. 5, 2013
8354340 Electronic device and method of manufacturing the same Jan. 15, 2013
8334206 Method for producing metallic interconnect lines Dec. 18, 2012
8329572 Semiconductor device and method for fabricating the same Dec. 11, 2012
8324115 Semiconductor chip, semiconductor device and methods for producing the same Dec. 4, 2012
8319347 Electronic device package and fabrication method thereof Nov. 27, 2012
8319264 Semiconductor device and method for manufacturing the same Nov. 27, 2012
8298931 Dual damascene with amorphous carbon for 3D deep via/trench application Oct. 30, 2012
8293647 Bottom up plating by organic surface passivation and differential plating retardation Oct. 23, 2012
8227341 Semiconductor device and method of manufacturing the same Jul. 24, 2012
8227892 Multi-track integrated circuit inductor Jul. 24, 2012
8183147 Method of fabricating a conductive post on an electrode May. 22, 2012
8183151 Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom May. 22, 2012
8168470 Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound May. 1, 2012
8163572 Method for evaluating impurity distribution under gate electrode without damaging silicon substrate Apr. 24, 2012
8158456 Method of forming stacked dies Apr. 17, 2012
8134234 Application of Mn for damage restoration after etchback Mar. 13, 2012
8101515 Methods of manufacturing semiconductor devices having contact plugs in insulation layers Jan. 24, 2012
8097534 Method for manufacturing semiconductor device and storage medium Jan. 17, 2012
8097535 Fabrication of self-assembled nanowire-type interconnects on a semiconductor device Jan. 17, 2012
8093149 Semiconductor wafer and manufacturing method for semiconductor device Jan. 10, 2012
8080461 Method of making a thin film resistor Dec. 20, 2011
8071473 Semiconductor device manufacturing method and storage medium Dec. 6, 2011

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