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Class Information
Number: 438/620
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Forming contacts of differing depths into semiconductor substrate
Description: Processes wherein at least one electrical contact is formed at a depth into the semiconductive substrate which differs from that of another electrical contact.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622378 |
Multi-step system and method for curing a dielectric film |
Nov. 24, 2009 |
| 7601630 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7598174 |
Feature patterning methods |
Oct. 6, 2009 |
| 7592263 |
Method of manufacturing semiconductor device |
Sep. 22, 2009 |
| 7585758 |
Interconnect layers without electromigration |
Sep. 8, 2009 |
| 7582560 |
Method for fabricating semiconductor device |
Sep. 1, 2009 |
| 7579278 |
Topography directed patterning |
Aug. 25, 2009 |
| 7579270 |
Method for manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7566651 |
Low contact resistance metal contact |
Jul. 28, 2009 |
| 7563709 |
Pattern formation method and method for forming semiconductor device |
Jul. 21, 2009 |
| 7563714 |
Low resistance and inductance backside through vias and methods of fabricating same |
Jul. 21, 2009 |
| 7560016 |
Selectively accelerated plating of metal features |
Jul. 14, 2009 |
| 7560375 |
Gas dielectric structure forming methods |
Jul. 14, 2009 |
| 7557039 |
Method for fabricating contact hole of semiconductor device |
Jul. 7, 2009 |
| 7553754 |
Electronic device, method of manufacture of the same, and sputtering target |
Jun. 30, 2009 |
| 7553755 |
Method for symmetric deposition of metal layer |
Jun. 30, 2009 |
| 7547594 |
Metal-oxide-semiconductor transistor and method of forming the same |
Jun. 16, 2009 |
| 7545034 |
Thermal energy removal structure and method |
Jun. 9, 2009 |
| 7541277 |
Stress relaxation, selective nitride phase removal |
Jun. 2, 2009 |
| 7534722 |
Back-to-front via process |
May. 19, 2009 |
| 7531445 |
Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane |
May. 12, 2009 |
| 7528066 |
Structure and method for metal integration |
May. 5, 2009 |
| 7528895 |
Liquid crystal display device and method for making the same |
May. 5, 2009 |
| 7524751 |
Method for forming contact hole in semiconductor device |
Apr. 28, 2009 |
| 7514352 |
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases |
Apr. 7, 2009 |
| 7511939 |
Layered capacitor architecture and fabrication method |
Mar. 31, 2009 |
| 7510960 |
Bridge for semiconductor internal node |
Mar. 31, 2009 |
| 7507664 |
Tungsten plug corrosion prevention method using ionized air |
Mar. 24, 2009 |
| 7504287 |
Methods for fabricating an integrated circuit |
Mar. 17, 2009 |
| 7498622 |
Latchup robust gate array using through wafer via |
Mar. 3, 2009 |
| 7494867 |
Semiconductor device having MIM capacitive elements and manufacturing method for the same |
Feb. 24, 2009 |
| 7473631 |
Method of forming contact holes in a semiconductor device having first and second metal layers |
Jan. 6, 2009 |
| 7470616 |
Damascene wiring fabrication methods incorporating dielectric cap etch process with hard mask retention |
Dec. 30, 2008 |
| 7465662 |
Method of making semiconductor device |
Dec. 16, 2008 |
| 7462536 |
Method of forming bit line of semiconductor memory device |
Dec. 9, 2008 |
| 7449099 |
Selectively accelerated plating of metal features |
Nov. 11, 2008 |
| 7439173 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via |
Oct. 21, 2008 |
| 7405151 |
Method for forming a semiconductor device |
Jul. 29, 2008 |
| 7396751 |
Method for manufacturing semiconductor device |
Jul. 8, 2008 |
| 7393773 |
Method and apparatus for producing co-planar bonding pads on a substrate |
Jul. 1, 2008 |
| 7390741 |
Method for fabricating semiconductor device |
Jun. 24, 2008 |
| 7378339 |
Barrier for use in 3-D integration of circuits |
May. 27, 2008 |
| 7378330 |
Cleaving process to fabricate multilayered substrates using low implantation doses |
May. 27, 2008 |
| 7365004 |
Method for manufacturing semiconductor device |
Apr. 29, 2008 |
| 7365384 |
Trench buried bit line memory devices and methods thereof |
Apr. 29, 2008 |
| 7354852 |
Method of forming interconnection in semiconductor device |
Apr. 8, 2008 |
| 7354851 |
Method for fabricating semiconductor device |
Apr. 8, 2008 |
| 7348279 |
Method of making an integrated circuit, including forming a contact |
Mar. 25, 2008 |
| 7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof |
Feb. 26, 2008 |
| 7326642 |
Method of fabricating semiconductor device using low dielectric constant material film |
Feb. 5, 2008 |
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