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Class Information
Number: 438/619
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Air bridge structure
Description: Processes wherein a portion of the electrical contact is suspended over the semiconductor substrate.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8674412 Contacts-first self-aligned carbon nanotube transistor with gate-all-around Mar. 18, 2014
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Feb. 25, 2014
8642252 Methods for fabrication of an air gap-containing interconnect structure Feb. 4, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8642466 Semiconductor device with air gap and method for fabricating the same Feb. 4, 2014
8643187 On-chip interconnects VIAS and method of fabrication Feb. 4, 2014
8563421 Method of fabricating semiconductor device Oct. 22, 2013
8557691 Method of fabricating semiconductor device having buried wiring and related device Oct. 15, 2013
8513111 Forming semiconductor structures Aug. 20, 2013
8497543 Semiconductor memory device and method for manufacturing same Jul. 30, 2013
8497203 Semiconductor structures and methods of manufacture Jul. 30, 2013
8492904 Semiconductor device and manufacturing method of the same Jul. 23, 2013
8481401 Component having a through-contact Jul. 9, 2013
8466055 Semiconductor device and method of manufacturing semiconductor device Jun. 18, 2013
8456009 Semiconductor structure having an air-gap region and a method of manufacturing the same Jun. 4, 2013
8435859 Methods of forming electrical contacts May. 7, 2013
8426290 Suspended-membrane/suspended-substrate monolithic microwave integrated circuit modules Apr. 23, 2013
8420524 Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same Apr. 16, 2013
8399350 Formation of air gap with protection of metal lines Mar. 19, 2013
8399349 Materials and methods of forming controlled void Mar. 19, 2013
8394656 Method of creating MEMS device cavities by a non-etching process Mar. 12, 2013
8383506 Method of forming a compliant monopolar micro device transfer head with silicon electrode Feb. 26, 2013
8377731 Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds Feb. 19, 2013
8367451 Method and structures for fabricating MEMS devices on compliant layers Feb. 5, 2013
8344517 Integrated circuit devices including air spacers separating conductive structures and contact plugs and methods of fabricating the same Jan. 1, 2013
8310053 Method of manufacturing a device with a cavity Nov. 13, 2012
8288268 Microelectronic structure including air gap Oct. 16, 2012
8283248 Methods of manufacturing semiconductor devices Oct. 9, 2012
8274155 Semiconductor device and method of manufacturing semiconductor device Sep. 25, 2012
8247902 Semiconductor device and manufacturing method of the same Aug. 21, 2012
8241992 Method for air gap interconnect integration using photo-patternable low k material Aug. 14, 2012
8237287 Semiconductor device Aug. 7, 2012
8231797 Process for producing air gaps in microstructures Jul. 31, 2012
8216931 Methods for forming multi-layer three-dimensional structures Jul. 10, 2012
8198174 Air channel interconnects for 3-D integration Jun. 12, 2012
8198189 Methods of fabricating integrated circuit devices including air spacers separating conductive structures and contact plugs Jun. 12, 2012
8153503 Protection of cavities opening onto a face of a microstructured element Apr. 10, 2012
8138068 Method to form nanopore array Mar. 20, 2012
8129264 Method of fabricating a semiconductor device Mar. 6, 2012
8120184 Semiconductor constructions and methods of forming layers Feb. 21, 2012
8097540 Method of opening pad in semiconductor device Jan. 17, 2012
8097949 Control of localized air gap formation in an interconnect stack Jan. 17, 2012
8084352 Method of manufacturing semiconductor device Dec. 27, 2011
8053861 Diffusion barrier layers Nov. 8, 2011
8039392 Resistor random access memory cell with reduced active area and reduced contact areas Oct. 18, 2011
8030202 Temporary etchable liner for forming air gap Oct. 4, 2011
8026165 Process for producing air gaps in microstructures, especially of the air gap interconnect structure type for integrated circuits Sep. 27, 2011
8022455 Method of fabricating semiconductor device for reducing parasitic capacitance between bit lines and semiconductor device fabricated thereby Sep. 20, 2011
8003537 Method for the production of planar structures Aug. 23, 2011
8004087 Semiconductor device with dual damascene wirings and method for manufacturing same Aug. 23, 2011

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