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Class Information
Number: 438/618
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects)
Description: Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions










Sub-classes under this class:

Class Number Class Name Patents
438/619 Air bridge structure 512
438/621 Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.) 190
438/642 Diverse conductors 261
438/620 Forming contacts of differing depths into semiconductor substrate 405
438/622 Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) 2,472


Patents under this class:

Patent Number Title Of Patent Date Issued
7902581 Semiconductor device comprising a contact structure based on copper and tungsten Mar. 8, 2011
7902061 Interconnect structures with encasing cap and methods of making thereof Mar. 8, 2011
7901998 Packaging substrate having pattern-matched metal layers Mar. 8, 2011
7897512 Methods of forming integrated circuit devices including a multi-layer structure with a contact extending therethrough Mar. 1, 2011
7897503 Infinitely stackable interconnect device and method Mar. 1, 2011
7892967 Semiconductor device and method for manufacturing the same Feb. 22, 2011
7892940 Device and methodology for reducing effective dielectric constant in semiconductor devices Feb. 22, 2011
7888252 Self-aligned contact Feb. 15, 2011
7888227 Integrated circuit inductor with integrated vias Feb. 15, 2011
7884013 Dual damascene with via liner Feb. 8, 2011
7884010 Wiring structure and method for fabricating the same Feb. 8, 2011
7883959 Semiconductor processing methods Feb. 8, 2011
7879718 Local interconnect having increased misalignment tolerance Feb. 1, 2011
7879713 Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode Feb. 1, 2011
7879711 Stacked structures and methods of fabricating stacked structures Feb. 1, 2011
7879626 Structure and manufacturing method of semiconductor memory device Feb. 1, 2011
7875544 Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation Jan. 25, 2011
7875506 Etching method and manufacturing method of semiconductor device Jan. 25, 2011
7871921 Methods of forming interconnection structures for semiconductor devices Jan. 18, 2011
7871837 Display panel manufacturing method Jan. 18, 2011
7867898 Method forming ohmic contact layer and metal wiring in semiconductor device Jan. 11, 2011
7863183 Method for fabricating last level copper-to-C4 connection with interfacial cap structure Jan. 4, 2011
7863180 Through substrate via including variable sidewall profile Jan. 4, 2011
7863179 Methods of fabricating a barrier layer with varying composition for copper metallization Jan. 4, 2011
7863162 Semiconductor device and manufacturing method thereof Jan. 4, 2011
7858525 Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill Dec. 28, 2010
7855138 Semiconductor device and method for manufacturing the same Dec. 21, 2010
7855137 Method of making a sidewall-protected metallic pillar on a semiconductor substrate Dec. 21, 2010
7851364 Method for forming pattern in semiconductor device Dec. 14, 2010
7851348 Routingless chip architecture Dec. 14, 2010
7851342 In-situ formation of conductive filling material in through-silicon via Dec. 14, 2010
7846831 Method of forming a metal bump on a semiconductor device Dec. 7, 2010
7846616 Lithography masks and methods Dec. 7, 2010
7843062 Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Nov. 30, 2010
7842613 Methods of forming microelectronic packaging substrates having through-substrate vias therein Nov. 30, 2010
7842608 Method for manufacturing semiconductor device having via plug Nov. 30, 2010
7838762 Solar cell Nov. 23, 2010
7838440 Method for manufacturing semiconductor device having porous low dielectric constant layer formed for insulation between metal lines Nov. 23, 2010
7838421 Method of forming metal line of semiconductor device Nov. 23, 2010
7833901 Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO.sub.2 layer Nov. 16, 2010
7833898 Method for manufacturing resistance RAM device Nov. 16, 2010
7833893 Method for forming conductive structures Nov. 16, 2010
7833847 Method of forming semiconductor device having stacked transistors Nov. 16, 2010
7833818 Integrated structure of MEMS device and CMOS image sensor device and fabricating method thereof Nov. 16, 2010
7829452 Terminal pad structures and methods of fabricating same Nov. 9, 2010
7829449 Process for fabricating an electronic integrated circuit and electronic integrated circuit thus obtained Nov. 9, 2010
7825022 Method of enabling solder deposition on a substrate and electronic package formed thereby Nov. 2, 2010
7811923 Integrated wafer processing system for integration of patternable dielectric materials Oct. 12, 2010
7811919 Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor Oct. 12, 2010
7811871 Low-capacitance contact for long gate-length devices with small contacted pitch Oct. 12, 2010











 
 
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