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Class Information
Number: 438/618
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects)
Description: Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions










Sub-classes under this class:

Class Number Class Name Patents
438/619 Air bridge structure 512
438/621 Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.) 190
438/642 Diverse conductors 261
438/620 Forming contacts of differing depths into semiconductor substrate 405
438/622 Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) 2,472


Patents under this class:
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Patent Number Title Of Patent Date Issued
6953741 Methods of fabricating contacts for semiconductor devices utilizing a pre-flow process Oct. 11, 2005
6951804 Formation of a tantalum-nitride layer Oct. 4, 2005
6951805 Method of forming integrated circuitry, method of forming memory circuitry, and method of forming random access memory circuitry Oct. 4, 2005
6951806 Metal region for reduction of capacitive coupling between signal lines Oct. 4, 2005
6951818 Method of manufacturing an electronic device Oct. 4, 2005
6949472 Method for high kinetic energy plasma barrier deposition Sep. 27, 2005
6949480 Method for depositing silicon nitride layer of semiconductor device Sep. 27, 2005
6946381 Method of forming insulating film in semiconductor device Sep. 20, 2005
6943104 Method of etching insulating film and method of forming interconnection layer Sep. 13, 2005
6939762 Semiconductor devices and methods for manufacturing the same Sep. 6, 2005
6933222 Microcircuit fabrication and interconnection Aug. 23, 2005
6933228 Method of manufacturing of contact plug in a contact hole on a silicon substrate Aug. 23, 2005
6930033 Treating surface of low-dielectric constant material to achieve good mechanical strength Aug. 16, 2005
6930045 Cross reference to related application Aug. 16, 2005
6924207 Method of fabricating a metal-insulator-metal capacitor Aug. 2, 2005
6924221 Integrated process flow to improve copper filling in a damascene structure Aug. 2, 2005
6921713 Semiconductor chip package with interconnect structure Jul. 26, 2005
6916733 Method for fabricating contact pad of semiconductor device Jul. 12, 2005
6916734 Contact-forming method Jul. 12, 2005
6905972 Semiconductor device and method for manufacturing the same Jun. 14, 2005
6902998 Methods of manufacturing semiconductor devices having storage nodes Jun. 7, 2005
6897145 Method for fabricating semiconductor device by forming damascene interconnections May. 24, 2005
6893937 Method for preventing borderless contact to well leakage May. 17, 2005
6893949 Semiconductor devices having contact plugs and local interconnects and methods for making the same May. 17, 2005
6893953 Fabrication process of a semiconductor device including a CVD process of a metal film May. 17, 2005
6890793 Method for producing a semiconductor die package using leadframe with locating holes May. 10, 2005
6887782 Diffusion barrier and method therefor May. 3, 2005
6888248 Extended length metal line for improved ESD performance May. 3, 2005
6884712 Method of manufacturing semiconductor local interconnect and contact Apr. 26, 2005
6881659 Methods of forming self-aligned contact structures in semiconductor integrated circuit devices Apr. 19, 2005
6878615 Method to solve via poisoning for porous low-k dielectric Apr. 12, 2005
6875684 Method for forming a bit line of a semiconductor device Apr. 5, 2005
6872653 Manufacturing method of semiconductor device Mar. 29, 2005
6869810 Manufacturing method of semiconductor device Mar. 22, 2005
6869872 Method of manufacturing a semiconductor memory device having a metal contact structure Mar. 22, 2005
6867073 Single mask via method and device Mar. 15, 2005
6867121 Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction Mar. 15, 2005
6867125 Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material Mar. 15, 2005
6864585 Three dimensional device integration method and integrated device Mar. 8, 2005
6861758 Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process Mar. 1, 2005
6858153 Integrated low K dielectrics and etch stops Feb. 22, 2005
6858525 Stacked local interconnect structure and method of fabricating same Feb. 22, 2005
6858549 Method for forming wiring structure Feb. 22, 2005
6858937 Backend metallization method and device obtained therefrom Feb. 22, 2005
6859054 Probe contact system using flexible printed circuit board Feb. 22, 2005
6855625 Manufacturing method of multilayer substrate Feb. 15, 2005
6855629 Method for forming a dual damascene wiring pattern in a semiconductor device Feb. 15, 2005
6852616 Semiconductor device and method for producing the same Feb. 8, 2005
6852618 Combined barrier layer and seed layer Feb. 8, 2005
6852619 Dual damascene semiconductor devices Feb. 8, 2005

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