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Class Information
Number: 438/618
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects)
Description: Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions










Sub-classes under this class:

Class Number Class Name Patents
438/619 Air bridge structure 512
438/621 Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.) 190
438/642 Diverse conductors 261
438/620 Forming contacts of differing depths into semiconductor substrate 405
438/622 Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) 2,472


Patents under this class:

Patent Number Title Of Patent Date Issued
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013
8592327 Formation of SiOCl-containing layer on exposed low-k surfaces to reduce low-k damage Nov. 26, 2013
8592304 Method for filling metal Nov. 26, 2013
8592303 Wiring structure and method for manufacturing the same Nov. 26, 2013
8592302 Patterning method for fabrication of a semiconductor device Nov. 26, 2013
8592301 Template wafer fabrication process for small pitch flip-chip interconnect hybridization Nov. 26, 2013
8587131 Through-silicon via and fabrication method thereof Nov. 19, 2013
8586476 Fabrication method for circuit substrate having post-fed die side power supply connections Nov. 19, 2013
8586470 Multilevel interconnect structures and methods of fabricating same Nov. 19, 2013
8586469 Metal layer end-cut flow Nov. 19, 2013
8586468 Integrated circuit chip stack employing carbon nanotube interconnects Nov. 19, 2013
8581413 Semiconductor device and method for manufacturing the same Nov. 12, 2013
8580688 Copper interconnection structure and method for forming copper interconnections Nov. 12, 2013
8580687 Semiconductor structure and method for making same Nov. 12, 2013
8580674 Fabrication of atomic scale devices Nov. 12, 2013
8575019 Metal interconnection structure and method for forming metal interlayer via and metal interconnection line Nov. 5, 2013
8569165 Self-aligned barrier and capping layers for interconnects Oct. 29, 2013
8564133 Chip package and method for forming the same Oct. 22, 2013
8563427 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same Oct. 22, 2013
8563420 Multilayer printed wiring board Oct. 22, 2013
8563419 Method of manufacturing an interconnect structure and design structure thereof Oct. 22, 2013
8551805 Methods of manufacturing phase-change memory devices Oct. 8, 2013
8546241 Semiconductor device with stress trench isolation and method for forming the same Oct. 1, 2013
8546186 Planar interconnect structure for hybrid circuits Oct. 1, 2013
8541893 Semiconductor memory device and power line arrangement method thereof Sep. 24, 2013
8541301 Reduction of pore fill material dewetting Sep. 24, 2013
8536042 Method of forming a topside contact to a backside terminal of a semiconductor device Sep. 17, 2013
8530997 Double seal ring Sep. 10, 2013
8530347 Electronic device including interconnects with a cavity therebetween and a process of forming the same Sep. 10, 2013
8518816 Method for making electrical interconnections with carbon nanotubes Aug. 27, 2013
8518746 Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die Aug. 27, 2013
8513110 Processes and structures for beveled slope integrated circuits for interconnect fabrication Aug. 20, 2013
8507988 High voltage devices, systems, and methods for forming the high voltage devices Aug. 13, 2013
8507341 Integrated circuit fabrication Aug. 13, 2013
8507316 Protecting T-contacts of chip scale packages from moisture Aug. 13, 2013
8502378 Package unit and stacking structure thereof Aug. 6, 2013
8502352 Semiconductor device with conductive vias between saw streets Aug. 6, 2013
8501606 Methods of forming wiring structures Aug. 6, 2013
8501583 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Aug. 6, 2013
8501541 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Aug. 6, 2013
8499434 Method of making a capacitive sensor Aug. 6, 2013
8497202 Interconnect structures and methods of manufacturing of interconnect structures Jul. 30, 2013
8497201 Self-assembly pattern for semiconductor integrated circuit Jul. 30, 2013
8492265 Pad bonding employing a self-aligned plated liner for adhesion enhancement Jul. 23, 2013
8492264 Method for forming interconnection levels of an integrated circuit Jul. 23, 2013
8492249 Methods of forming catalytic nanopads Jul. 23, 2013
8492196 Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Jul. 23, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8486824 Enhancing metal/low-K interconnect reliability using a protection layer Jul. 16, 2013
8486822 Semiconductor device having dummy pattern and the method for fabricating the same Jul. 16, 2013











 
 
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