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Class Information
Number: 438/618
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects)
Description: Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions










Sub-classes under this class:

Class Number Class Name Patents
438/619 Air bridge structure 512
438/621 Contacting diversely doped semiconductive regions (e.g., p-type and n-type regions, etc.) 190
438/642 Diverse conductors 261
438/620 Forming contacts of differing depths into semiconductor substrate 405
438/622 Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) 2,472


Patents under this class:
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Patent Number Title Of Patent Date Issued
7538005 Semiconductor device and method for fabricating the same May. 26, 2009
7531894 Method of electrically connecting a microelectronic component May. 12, 2009
7531863 Semiconductor device and method of fabricating the same May. 12, 2009
7531443 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors May. 12, 2009
7531439 Method for forming an integrated semiconductor circuit arrangement May. 12, 2009
7531380 Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof May. 12, 2009
7528895 Liquid crystal display device and method for making the same May. 5, 2009
7528494 Accessible chip stack and process of manufacturing thereof May. 5, 2009
7528066 Structure and method for metal integration May. 5, 2009
7528053 Three-dimensional package and method of making the same May. 5, 2009
7524751 Method for forming contact hole in semiconductor device Apr. 28, 2009
7521808 Wiring paterns formed by selective metal plating Apr. 21, 2009
7521358 Process integration scheme to lower overall dielectric constant in BEoL interconnect structures Apr. 21, 2009
7521350 Manufacturing method of a semiconductor device Apr. 21, 2009
7521347 Method for forming contact hole in semiconductor device Apr. 21, 2009
7517794 Method for fabricating nanoscale features Apr. 14, 2009
7517754 Methods of forming semiconductor constructions Apr. 14, 2009
7514352 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases Apr. 7, 2009
7510982 Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles Mar. 31, 2009
7510960 Bridge for semiconductor internal node Mar. 31, 2009
7507666 Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition Mar. 24, 2009
7507660 Deposition processes for tungsten-containing barrier layers Mar. 24, 2009
7504699 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections Mar. 17, 2009
7504287 Methods for fabricating an integrated circuit Mar. 17, 2009
7501689 Upper-layer metal power standard cell Mar. 10, 2009
7501342 Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same Mar. 10, 2009
7498255 Post passivation interconnection schemes on top of the IC chips Mar. 3, 2009
7498254 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement Mar. 3, 2009
7498253 Local interconnection method and structure for use in semiconductor device Mar. 3, 2009
7498252 Dual layer dielectric stack for microelectronics having thick metal lines Mar. 3, 2009
7494916 Design structures incorporating interconnect structures with liner repair layers Feb. 24, 2009
7494912 Terminal pad structures and methods of fabricating same Feb. 24, 2009
7491639 Method of manufacturing a semiconductor device and semiconductor obtained by means of such a method Feb. 17, 2009
7491636 Methods for forming flexible column die interconnects and resulting structures Feb. 17, 2009
7488678 Method of manufacturing interconnect substrate Feb. 10, 2009
7488677 Interconnect structures with encasing cap and methods of making thereof Feb. 10, 2009
7488676 Manufacturing method of a multi-layered circuit board Feb. 10, 2009
7485569 Printed circuit board including embedded chips and method of fabricating the same Feb. 3, 2009
7485566 Method of manufacturing semiconductor device Feb. 3, 2009
7482272 Through chip connection Jan. 27, 2009
7476605 Method of manufacturing semiconductor device Jan. 13, 2009
7473632 Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap Jan. 6, 2009
7473630 Semiconductor device and method for manufacturing same Jan. 6, 2009
7470620 Microcircuit fabrication and interconnection Dec. 30, 2008
7470619 Interconnect with high aspect ratio plugged vias Dec. 30, 2008
7470586 Memory cell having bar-shaped storage node contact plugs and methods of fabricating same Dec. 30, 2008
7465656 Semiconductor device and method for fabricating the same Dec. 16, 2008
7462558 Method for fabricating a circuit component Dec. 9, 2008
7462555 Ball grid array substrate having window and method of fabricating same Dec. 9, 2008
7462523 Semiconductor memory device and method for manufacturing the same Dec. 9, 2008

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