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Class Information
Number: 438/618
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects)
Description: Processes wherein the electrical contact is formed so as to make electrical contact to plural semiconductive regions
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619309 |
Integrated connection arrangements |
Nov. 17, 2009 |
| 7615489 |
Method for forming metal interconnects and reducing metal seed layer overhang |
Nov. 10, 2009 |
| 7615486 |
Apparatus and method for integrated surface treatment and deposition for copper interconnect |
Nov. 10, 2009 |
| 7615479 |
Assembly comprising functional block deposited therein |
Nov. 10, 2009 |
| 7611986 |
Dual damascene patterning method |
Nov. 3, 2009 |
| 7611982 |
Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
Nov. 3, 2009 |
| 7608534 |
Interconnection of through-wafer vias using bridge structures |
Oct. 27, 2009 |
| 7605085 |
Method of manufacturing interconnecting structure with vias |
Oct. 20, 2009 |
| 7605072 |
Interconnect structure with a barrier-redundancy feature |
Oct. 20, 2009 |
| 7605071 |
Controlling lateral distribution of air gaps in interconnects |
Oct. 20, 2009 |
| 7601630 |
Semiconductor device and method for fabricating the same |
Oct. 13, 2009 |
| 7601604 |
Method for fabricating conducting plates for a high-Q MIM capacitor |
Oct. 13, 2009 |
| 7598169 |
Method to remove beol sacrificial materials and chemical residues by irradiation |
Oct. 6, 2009 |
| 7598166 |
Dielectric layers for metal lines in semiconductor chips |
Oct. 6, 2009 |
| 7598165 |
Methods for forming a multiplexer of a memory device |
Oct. 6, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7592247 |
Sub-lithographic local interconnects, and methods for forming same |
Sep. 22, 2009 |
| 7589012 |
Method for fabricating semiconductor memory device |
Sep. 15, 2009 |
| 7589011 |
Semiconductor device and method of forming intermetal dielectric layer |
Sep. 15, 2009 |
| 7585770 |
Method of growing carbon nanotubes and method of manufacturing field emission device having the same |
Sep. 8, 2009 |
| 7585758 |
Interconnect layers without electromigration |
Sep. 8, 2009 |
| 7582554 |
Method for manufacturing semiconductor device |
Sep. 1, 2009 |
| 7582551 |
Wiring substrate and wiring substrate manufacturing method |
Sep. 1, 2009 |
| 7579270 |
Method for manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7579269 |
Microelectronic spring contact elements |
Aug. 25, 2009 |
| 7579225 |
Method of forming semiconductor device having stacked transistors |
Aug. 25, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575995 |
Method of forming fine metal pattern and method of forming metal line using the same |
Aug. 18, 2009 |
| 7572694 |
Method of manufacturing a semiconductor device |
Aug. 11, 2009 |
| 7569475 |
Interconnect structure having enhanced electromigration reliability and a method of fabricating same |
Aug. 4, 2009 |
| 7566650 |
Integrated circuit solder bumping system |
Jul. 28, 2009 |
| 7566646 |
Three dimensional programmable device and method for fabricating the same |
Jul. 28, 2009 |
| 7566643 |
Liquid phase deposition of contacts in programmable resistance and switching devices |
Jul. 28, 2009 |
| 7560375 |
Gas dielectric structure forming methods |
Jul. 14, 2009 |
| 7560016 |
Selectively accelerated plating of metal features |
Jul. 14, 2009 |
| 7557046 |
Systems and methods for interconnect metallization using a stop-etch layer |
Jul. 7, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7557025 |
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method |
Jul. 7, 2009 |
| 7557014 |
Semiconductor system-in-package |
Jul. 7, 2009 |
| 7554145 |
Magnetic memory cells and manufacturing methods |
Jun. 30, 2009 |
| 7553755 |
Method for symmetric deposition of metal layer |
Jun. 30, 2009 |
| 7553686 |
Al.sub.2O.sub.3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices |
Jun. 30, 2009 |
| 7550394 |
Semiconductor device and fabrication process thereof |
Jun. 23, 2009 |
| 7550377 |
Method for fabricating single-damascene structure, dual damascene structure, and opening thereof |
Jun. 23, 2009 |
| 7544601 |
Semiconductor device and a method for manufacturing the same |
Jun. 9, 2009 |
| 7541277 |
Stress relaxation, selective nitride phase removal |
Jun. 2, 2009 |
| 7541276 |
Methods for forming dual damascene wiring for semiconductor devices using protective via capping layer |
Jun. 2, 2009 |
| 7540970 |
Methods of fabricating a semiconductor device |
Jun. 2, 2009 |
| 7538435 |
Wafer structure and bumping process |
May. 26, 2009 |
| 7538005 |
Semiconductor device and method for fabricating the same |
May. 26, 2009 |
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