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Class Information
Number: 438/617
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Including fusion of conductor > By wire bonding
Description: Processes wherein the bump electrode is formed by a process which includes a step of utilizing a metallic wire to form the elevated structure.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8652961 Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits Feb. 18, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8637394 Integrated circuit package system with flex bump Jan. 28, 2014
8629054 Packaged semiconductor assemblies and methods for manufacturing such assemblies Jan. 14, 2014
8623704 Adhesive/spacer island structure for multiple die package Jan. 7, 2014
8618677 Wirebonded semiconductor package Dec. 31, 2013
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Dec. 31, 2013
8614513 Semiconductor device including a buffer layer structure for reducing stress Dec. 24, 2013
8609463 Integrated circuit package system employing multi-package module techniques Dec. 17, 2013
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof Dec. 17, 2013
8609527 Method of manufacturing semiconductor device Dec. 17, 2013
8586417 Isostress grid array and method of fabrication thereof Nov. 19, 2013
8587098 Integrated circuit protruding pad package system and method for manufacturing thereof Nov. 19, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8574961 Method of marking a low profile packaged semiconductor device Nov. 5, 2013
8569112 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof Oct. 29, 2013
8569163 Ultrasonic wire bonding method for a semiconductor device Oct. 29, 2013
8558398 Bond wire arrangement for minimizing crosstalk Oct. 15, 2013
8551820 Routable single layer substrate and semiconductor package including same Oct. 8, 2013
8541892 Bonding connection between a bonding wire and a power semiconductor chip Sep. 24, 2013
8535986 Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame Sep. 17, 2013
8536688 Integrated circuit leadframe and fabrication method therefor Sep. 17, 2013
8536689 Integrated circuit package system with multi-surface die attach pad Sep. 17, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8530278 Semiconductor device and a manufacturing method of the same Sep. 10, 2013
8525352 Short and low loop wire bonding Sep. 3, 2013
8513810 Semiconductor device and method of manufacturing same Aug. 20, 2013
8507318 Method for manufacturing microelectronic devices Aug. 13, 2013
8481420 Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof Jul. 9, 2013
8476762 Ni plating of a BLM edge for Pb-free C4 undercut control Jul. 2, 2013
8450849 Robust FBEOL and UBM structure of C4 interconnects May. 28, 2013
8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof Apr. 30, 2013
8420430 Fabrication method of package structure having MEMS element Apr. 16, 2013
8420523 Chip packaging method and structure thereof Apr. 16, 2013
RE44148 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Apr. 16, 2013
8415245 Method of manufacturing semiconductor device and semiconductor device Apr. 9, 2013
8410603 Semiconductor device and package Apr. 2, 2013
8387238 Processes and structures for IC fabrication Mar. 5, 2013
8389398 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers Mar. 5, 2013
8378507 Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate Feb. 19, 2013
8372741 Method for package-on-package assembly with wire bonds to encapsulation surface Feb. 12, 2013
8373177 Light emitting diode (LED) light source and manufacturing method for the same Feb. 12, 2013
8373281 Semiconductor module and portable apparatus provided with semiconductor module Feb. 12, 2013
8373283 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device Feb. 12, 2013
8357563 Stitch bump stacking design for overall package size reduction for multiple stack Jan. 22, 2013
8337735 Solder mold plates used in packaging process and method of manufacturing solder mold plates Dec. 25, 2012
8334201 Semiconductor device and inspection method therefor Dec. 18, 2012

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