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Class Information
Number: 438/616
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Including fusion of conductor > By transcription from auxiliary substrate
Description: Processes wherein the bump electrode is formed by transcription of conductive material from an auxiliary substrate to the semiconductor substrate.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8607446 Method of manufacturing an electronic component Dec. 17, 2013
8563417 Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process Oct. 22, 2013
8547701 Electronics module and method for manufacturing the same Oct. 1, 2013
8541299 Electrical interconnect forming method Sep. 24, 2013
8476773 Electrical interconnect structure Jul. 2, 2013
8476762 Ni plating of a BLM edge for Pb-free C4 undercut control Jul. 2, 2013
8304337 Integrated circuit packaging system with bond wire pads and method of manufacture thereof Nov. 6, 2012
8288209 Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Oct. 16, 2012
8269346 Semiconductor device and method of designing a wiring of a semiconductor device Sep. 18, 2012
8268719 Sprocket opening alignment process and apparatus for multilayer solder decal Sep. 18, 2012
8240545 Methods for minimizing component shift during soldering Aug. 14, 2012
8242010 Electrical interconnect forming method Aug. 14, 2012
8222529 Ceramic substrate and manufacturing method thereof Jul. 17, 2012
8183093 Method of manufacturing a semiconductor device by lamination May. 22, 2012
8148255 Techniques for forming solder bump interconnects Apr. 3, 2012
8138576 Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy Mar. 20, 2012
8132775 Solder mold plates used in packaging process and method of manufacturing solder mold plates Mar. 13, 2012
8124457 Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element Feb. 28, 2012
8119451 Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package Feb. 21, 2012
8048794 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport Nov. 1, 2011
8033016 Method for manufacturing an electrode and electrode component mounted body Oct. 11, 2011
8012866 Method of bonding semiconductor devices utilizing solder balls Sep. 6, 2011
8008786 Dynamic pad size to reduce solder fatigue Aug. 30, 2011
8003512 Structure of UBM and solder bumps and methods of fabrication Aug. 23, 2011
7993970 Semiconductor device and fabrication method thereof Aug. 9, 2011
7955966 Injection molded solder ball method Jun. 7, 2011
7932599 Semiconductor component of semiconductor chip size with flip-chip-like external contacts Apr. 26, 2011
7915088 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Mar. 29, 2011
7911064 Mounted body and method for manufacturing the same Mar. 22, 2011
7842599 Bumping electronic components using transfer substrates Nov. 30, 2010
7829985 BGA package having half-etched bonding pad and cut plating line and method of fabricating same Nov. 9, 2010
7795118 Gallium nitride based compound semiconductor device including compliant substrate and method for manufacturing the same Sep. 14, 2010
7790597 Solder cap application process on copper bump using solder powder film Sep. 7, 2010
7786001 Electrical interconnect structure and method Aug. 31, 2010
7772695 Semiconductor component of semiconductor chip size with flip-chip-like external contacts Aug. 10, 2010
7727813 Method for making a device including placing a semiconductor chip on a substrate Jun. 1, 2010
7721422 Methods of making microelectronic assemblies May. 25, 2010
7713860 Method of forming metallic bump on I/O pad May. 11, 2010
7713861 Method of forming metallic bump and seal for semiconductor device May. 11, 2010
7666780 Alignment verification for C4NP solder transfer Feb. 23, 2010
7582551 Wiring substrate and wiring substrate manufacturing method Sep. 1, 2009
7569474 Method and apparatus for soldering modules to substrates Aug. 4, 2009
7546681 Manufacturing method for wiring circuit substrate Jun. 16, 2009
7547579 Underfill process Jun. 16, 2009
7521797 Method of manufacturing substrate joint body, substrate joint body and electrooptical device Apr. 21, 2009
7504728 Integrated circuit having bond pad with improved thermal and mechanical properties Mar. 17, 2009
7485562 Method of making multichip wafer level packages and computing systems incorporating same Feb. 3, 2009
7454832 Method of forming metal plate pattern and circuit board Nov. 25, 2008
7414313 Polymeric conductor donor and transfer method Aug. 19, 2008

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