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Class Information
Number: 438/615
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Including fusion of conductor
Description: Processes wherein at least a portion of the conductive material forming the bump electrode is molten during formation of the bump.










Sub-classes under this class:

Class Number Class Name Patents
438/616 By transcription from auxiliary substrate 165
438/617 By wire bonding 572


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8691685 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures Apr. 8, 2014
8679964 Prevention and control of intermetallic alloy inclusions Mar. 25, 2014
8673762 Solder, soldering method, and semiconductor device Mar. 18, 2014
8633103 Semiconductor device and manufacturing method of the same Jan. 21, 2014
8603911 Semiconductor device and fabrication method thereof Dec. 10, 2013
8586467 Method of mounting electronic component and mounting substrate Nov. 19, 2013
8574959 Semiconductor device and method of forming bump-on-lead interconnection Nov. 5, 2013
8563357 Method of packaging a die Oct. 22, 2013
8558378 Bump-on-lead flip chip interconnection Oct. 15, 2013
RE44524 Bump-on-lead flip chip interconnection Oct. 8, 2013
RE44500 Semiconductor device and method of forming composite bump-on-lead interconnection Sep. 17, 2013
8492171 Techniques and structures for testing integrated circuits in flip-chip assemblies Jul. 23, 2013
8482104 Method for growth of indium-containing nitride films Jul. 9, 2013
8476762 Ni plating of a BLM edge for Pb-free C4 undercut control Jul. 2, 2013
8450849 Robust FBEOL and UBM structure of C4 interconnects May. 28, 2013
8420444 Semiconductor device and method of manufacturing the same Apr. 16, 2013
8415795 Semiconductor device and assembling method thereof Apr. 9, 2013
8354301 Packaged microdevices and methods for manufacturing packaged microdevices Jan. 15, 2013
8338287 Semiconductor device and method for manufacturing the same Dec. 25, 2012
8309395 Method of fabricating a high-temperature compatible power semiconductor module Nov. 13, 2012
8278143 Manufacturing method for electronic devices Oct. 2, 2012
8274161 Flux-free chip to substrate joint serial linear thermal processor arrangement Sep. 25, 2012
8268716 Creation of lead-free solder joint with intermetallics Sep. 18, 2012
8269346 Semiconductor device and method of designing a wiring of a semiconductor device Sep. 18, 2012
8252677 Method of forming solder bumps on substrates Aug. 28, 2012
8252678 Flux-free chip to wafer joint serial thermal processor arrangement Aug. 28, 2012
8247271 Formation of alpha particle shields in chip packaging Aug. 21, 2012
8242010 Electrical interconnect forming method Aug. 14, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8232632 Composite contact for fine pitch electrical interconnect assembly Jul. 31, 2012
8202762 Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same Jun. 19, 2012
8198131 Stackable semiconductor device packages Jun. 12, 2012
8188598 Bump-on-lead flip chip interconnection May. 29, 2012
8177862 Thermal compressive bond head May. 15, 2012
8156643 Semiconductor device Apr. 17, 2012
8153517 Processes and structures for IC fabrication Apr. 10, 2012
8148255 Techniques for forming solder bump interconnects Apr. 3, 2012
8148258 Method for fabricating electrical bonding pads on a wafer Apr. 3, 2012
8143095 Sequential fabrication of vertical conductive interconnects in capped chips Mar. 27, 2012
8138576 Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy Mar. 20, 2012
8132709 Semiconductor device and method for manufacturing same Mar. 13, 2012
8119450 Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Feb. 21, 2012
8105933 Localized alloying for improved bond reliability Jan. 31, 2012
8088684 Apparatus and method for semiconductor wafer bumping via injection molded solder Jan. 3, 2012
8084348 Contact pads for silicon chip packages Dec. 27, 2011
8076232 Semiconductor device and method of forming composite bump-on-lead interconnection Dec. 13, 2011
8071471 Packaging conductive structure and method for manufacturing the same Dec. 6, 2011
8071472 Semiconductor device with solder balls having high reliability Dec. 6, 2011
8064221 Electronic devices for surface mount Nov. 22, 2011
8048794 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport Nov. 1, 2011

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