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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:

Patent Number Title Of Patent Date Issued
7498251 Redistribution circuit structure Mar. 3, 2009
7498196 Structure and manufacturing method of chip scale package Mar. 3, 2009
7488675 Method for fabricating IC board without ring structure Feb. 10, 2009
7485564 Undercut-free BLM process for Pb-free and Pb-reduced C4 Feb. 3, 2009
7485562 Method of making multichip wafer level packages and computing systems incorporating same Feb. 3, 2009
7482259 Chip structure and process for forming the same Jan. 27, 2009
7482200 Process for fabricating chip package structure Jan. 27, 2009
7468316 Low fabrication cost, fine pitch and high reliability solder bump Dec. 23, 2008
7465654 Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures Dec. 16, 2008
7465653 Reliable metal bumps on top of I/O pads after removal of test probe marks Dec. 16, 2008
7462942 Die pillar structures and a method of their formation Dec. 9, 2008
7459785 Electrical interconnection structure formation Dec. 2, 2008
7459387 Semiconductor electronic device and method of manufacturing thereof Dec. 2, 2008
7456092 Self-releasing spring structures and methods Nov. 25, 2008
7452799 Ball film for integrated circuit fabrication and testing Nov. 18, 2008
7446028 Multi-component integrated circuit contacts Nov. 4, 2008
7439170 Design structure for final via designs for chip stress reduction Oct. 21, 2008
7439169 Integrated circuit and methods of redistributing bondpad locations Oct. 21, 2008
7435624 Method of reducing mechanical stress on a semiconductor die during fabrication Oct. 14, 2008
7432188 Structure of bumps forming on an under metallurgy layer and method for making the same Oct. 7, 2008
7413974 Copper-metallized integrated circuits having electroless thick copper bond pads Aug. 19, 2008
7407878 Method of providing solder bumps on a substrate using localized heating Aug. 5, 2008
7407877 Self-coplanarity bumping shape for flip-chip Aug. 5, 2008
7405146 Electroplating method by transmitting electric current from a ball side Jul. 29, 2008
7396754 Method of making wafer level ball grid array Jul. 8, 2008
7396753 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same Jul. 8, 2008
7390734 Thin film transistor substrate and manufacturing method thereof Jun. 24, 2008
7390732 Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip Jun. 24, 2008
7390692 Semiconductor device and method for manufacturing the same Jun. 24, 2008
7384863 Semiconductor device and method for manufacturing the same Jun. 10, 2008
7382005 Circuit component with bump formed over chip Jun. 3, 2008
7381636 Planar bond pad design and method of making the same Jun. 3, 2008
7381634 Integrated circuit system for bonding Jun. 3, 2008
7375429 Integrated circuit component and mounting method thereof May. 20, 2008
7368824 Diffusion solder position, and process for producing it May. 6, 2008
7364999 Method for interconnecting semiconductor components with substrates and contact means Apr. 29, 2008
7361581 High surface area aluminum bond pad for through-wafer connections to an electronic package Apr. 22, 2008
7358177 Fabrication method of under bump metallurgy structure Apr. 15, 2008
7358173 Bumping process of light emitting diode Apr. 15, 2008
7351648 Methods for forming uniform lithographic features Apr. 1, 2008
7348270 Techniques for forming interconnects Mar. 25, 2008
7338891 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof Mar. 4, 2008
7338890 Low fabrication cost, high performance, high reliability chip scale package Mar. 4, 2008
7338889 Method of improving copper interconnects of semiconductor devices for bonding Mar. 4, 2008
7335582 Component Feb. 26, 2008
7329563 Method for fabrication of wafer level package incorporating dual compliant layers Feb. 12, 2008
7326636 Method and circuit structure employing a photo-imaged solder mask Feb. 5, 2008
7323780 Electrical interconnection structure formation Jan. 29, 2008
7321140 Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier Jan. 22, 2008
7320933 Double bumping of flexible substrate for first and second level interconnects Jan. 22, 2008











 
 
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