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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:

Patent Number Title Of Patent Date Issued
7960270 Method for fabricating circuit component Jun. 14, 2011
7956460 Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device Jun. 7, 2011
7952210 Semiconductor package and fabrication method thereof May. 31, 2011
7947593 Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure May. 24, 2011
7947592 Thick metal interconnect with metal pad caps at selective sites and process for making the same May. 24, 2011
7939373 Manufacturing method for semiconductor device containing stacked semiconductor chips May. 10, 2011
7932170 Flip chip bump structure and fabrication method Apr. 26, 2011
7932169 Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Apr. 26, 2011
7919859 Copper die bumps with electromigration cap and plated solder Apr. 5, 2011
7919407 Method of high density field induced MRAM process Apr. 5, 2011
7919406 Structure and method for forming pillar bump structure having sidewall protection Apr. 5, 2011
7915742 Determining the placement of semiconductor components on an integrated circuit Mar. 29, 2011
7915088 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Mar. 29, 2011
7915065 Wafer level sensing package and manufacturing process thereof Mar. 29, 2011
7910460 Metallic electrode forming method and semiconductor device having metallic electrode Mar. 22, 2011
7910403 Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same Mar. 22, 2011
7906425 Fluxless bumping process Mar. 15, 2011
7906422 Chip structure and process for forming the same Mar. 15, 2011
7902681 Semiconductor device, production method for the same, and substrate Mar. 8, 2011
7902060 Attachment using magnetic particle based solder composites Mar. 8, 2011
7901956 Structure for bumped wafer test Mar. 8, 2011
7897502 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers Mar. 1, 2011
7896223 Solder ball printing apparatus Mar. 1, 2011
7888259 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same Feb. 15, 2011
7884009 Semiconductor device with an improved solder joint Feb. 8, 2011
7884008 Semiconductor device fabrication method Feb. 8, 2011
7879715 Methods of forming electronic structures including conductive shunt layers and related structures Feb. 1, 2011
7879714 Semiconductor device manufacturing method Feb. 1, 2011
7879713 Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode Feb. 1, 2011
7871920 Semiconductor chips with reduced stress from underfill at edge of chip Jan. 18, 2011
7871919 Structures and methods for improving solder bump connections in semiconductor devices Jan. 18, 2011
7868452 Ultrathin semiconductor circuit having contact bumps Jan. 11, 2011
7867823 Method for fabricating a semiconductor package Jan. 11, 2011
7863096 Embedded die package and process flow using a pre-molded carrier Jan. 4, 2011
7859122 Final via structures for bond pad-solder ball interconnections Dec. 28, 2010
7858521 Fabrication for electroplating thick metal pads Dec. 28, 2010
7855144 Method of forming metal lines and bumps for semiconductor devices Dec. 21, 2010
7846831 Method of forming a metal bump on a semiconductor device Dec. 7, 2010
7846830 Semiconductor device and method for manufacturing same Dec. 7, 2010
7839003 Semiconductor device including a coupling conductor having a concave and convex Nov. 23, 2010
7830006 Structurally-enhanced integrated circuit package and method of manufacture Nov. 9, 2010
7829985 BGA package having half-etched bonding pad and cut plating line and method of fabricating same Nov. 9, 2010
7820537 Method for fabricating semiconductor device Oct. 26, 2010
7816252 Method for forming bumps on under bump metallurgy Oct. 19, 2010
7816248 Solder connector structure and method Oct. 19, 2010
7816247 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations Oct. 19, 2010
7816177 Semiconductor device and method of manufacturing the same Oct. 19, 2010
7812456 Semiconductor device and a method of manufacturing the same Oct. 12, 2010
7811932 3-D semiconductor die structure with containing feature and method Oct. 12, 2010
7811922 Method for manufacturing semiconductor device Oct. 12, 2010











 
 
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