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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.

Patents under this class:

Patent Number Title Of Patent Date Issued
8319354 Semiconductor chip with post-passivation scheme formed over passivation layer Nov. 27, 2012
8318597 Manufacturing method of semiconductor device including Au bump on seed film Nov. 27, 2012
8309856 Circuit board and manufacturing method thereof Nov. 13, 2012
8309452 Method of forming an inductor on a semiconductor wafer Nov. 13, 2012
8304919 Integrated circuit system with stress redistribution layer and method of manufacture thereof Nov. 6, 2012
8298930 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof Oct. 30, 2012
8293636 Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method Oct. 23, 2012
8293617 Gap processing Oct. 23, 2012
8283247 Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding Oct. 9, 2012
8278152 Bonding process for CMOS image sensor Oct. 2, 2012
8278144 Flip chip interconnect solder mask Oct. 2, 2012
8274160 Active area bonding compatible high current structures Sep. 25, 2012
8274150 Chip bump structure and method for forming the same Sep. 25, 2012
8269346 Semiconductor device and method of designing a wiring of a semiconductor device Sep. 18, 2012
8268718 Bonded structure and manufacturing method for bonded structure Sep. 18, 2012
8268716 Creation of lead-free solder joint with intermetallics Sep. 18, 2012
8252677 Method of forming solder bumps on substrates Aug. 28, 2012
8249736 Registration system and method Aug. 21, 2012
8247271 Formation of alpha particle shields in chip packaging Aug. 21, 2012
8242012 Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure Aug. 14, 2012
8242011 Method of forming metal pillar Aug. 14, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8236703 Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom Aug. 7, 2012
8232632 Composite contact for fine pitch electrical interconnect assembly Jul. 31, 2012
8227334 Doping minor elements into metal bumps Jul. 24, 2012
8227332 Method for fabricating electrical bonding pads on a wafer Jul. 24, 2012
8207057 Microball assembly methods, and packages using maskless microball assemblies Jun. 26, 2012
8202797 Integrated circuit system with recessed through silicon via pads and method of manufacture thereof Jun. 19, 2012
8202741 Method of bonding a semiconductor device using a compliant bonding structure Jun. 19, 2012
8198724 Integrated circuit device having a multi-layer substrate and a method of enabling signals to be routed in a multi-layer substrate Jun. 12, 2012
8188377 Circuit board having electrically connecting structure and fabrication method thereof May. 29, 2012
8183693 Electronic device, method of producing the same, and semiconductor device May. 22, 2012
8183467 Wiring board and method of producing the same May. 22, 2012
8183144 Method of manufacturing semiconductor device May. 22, 2012
8183142 Semiconductor device and a method of manufacturing the same May. 22, 2012
8181845 Electrical bond connection system May. 22, 2012
8168527 Semiconductor chip and method for fabricating the same May. 1, 2012
8163641 System for modifying small structures Apr. 24, 2012
8158508 Structure and manufacturing method of a chip scale package Apr. 17, 2012
8158456 Method of forming stacked dies Apr. 17, 2012
8156643 Semiconductor device Apr. 17, 2012
8148805 Forming compliant contact pads for semiconductor packages Apr. 3, 2012
8148257 Semiconductor structure and method for making same Apr. 3, 2012
8148256 Copper bonding method Apr. 3, 2012
8148254 Method of manufacturing semiconductor device Apr. 3, 2012
8143158 Method and device of preventing delamination of semiconductor layers Mar. 27, 2012
8143101 Semiconductor package and the method of making the same Mar. 27, 2012
8138576 Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy Mar. 20, 2012
8138079 Method of wire bonding over active area of a semiconductor circuit Mar. 20, 2012
8133808 Wafer level chip package and a method of fabricating thereof Mar. 13, 2012

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