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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:

Patent Number Title Of Patent Date Issued
8513109 Method of manufacturing an interconnect structure for a semiconductor device Aug. 20, 2013
8507376 Method to form solder deposits on substrates Aug. 13, 2013
8501617 Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication Aug. 6, 2013
8501614 Method for manufacturing fine-pitch bumps and structure thereof Aug. 6, 2013
8501613 UBM etching methods for eliminating undercut Aug. 6, 2013
8501583 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Aug. 6, 2013
8497200 Method to form solder alloy deposits on substrates Jul. 30, 2013
8492891 Cu pillar bump with electrolytic metal sidewall protection Jul. 23, 2013
8492263 Protected solder ball joints in wafer level chip-scale packaging Jul. 23, 2013
8486760 Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same Jul. 16, 2013
8481419 Method for producing a metal contact on a coated semiconductor substrate Jul. 9, 2013
8481418 Low fabrication cost, high performance, high reliability chip scale package Jul. 9, 2013
8476762 Ni plating of a BLM edge for Pb-free C4 undercut control Jul. 2, 2013
8476159 Substrate structure with compliant bump and manufacturing method thereof Jul. 2, 2013
8466552 Semiconductor device and method of manufacturing the same Jun. 18, 2013
8466547 Method for manufacturing substrate for semiconductor element, and semiconductor device Jun. 18, 2013
8461036 Multiple surface finishes for microelectronic package substrates Jun. 11, 2013
8455990 Systems and methods of tamper proof packaging of a semiconductor device Jun. 4, 2013
8455361 Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device Jun. 4, 2013
8450849 Robust FBEOL and UBM structure of C4 interconnects May. 28, 2013
8450203 Bumping process and structure thereof May. 28, 2013
8446006 Structures and methods to reduce maximum current density in a solder ball May. 21, 2013
8445375 Method for manufacturing a semiconductor component May. 21, 2013
8445374 Soft error rate mitigation by interconnect structure May. 21, 2013
8435881 Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation May. 7, 2013
8434668 Magnetic attachment structure May. 7, 2013
8431478 Solder cap bump in semiconductor package and method of manufacturing the same Apr. 30, 2013
8426303 Manufacturing method of semiconductor device, and mounting structure thereof Apr. 23, 2013
8415795 Semiconductor device and assembling method thereof Apr. 9, 2013
8415794 Semiconductor device having stable signal transmission at high speed and high frequency Apr. 9, 2013
8415243 Bumping process and structure thereof Apr. 9, 2013
8405211 Bump pad structure Mar. 26, 2013
8389398 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers Mar. 5, 2013
8389397 Method for reducing UBM undercut in metal bump structures Mar. 5, 2013
8389394 Method of making semiconductor package having redistribution layer Mar. 5, 2013
8383952 Printed compatible designs and layout schemes for printed electronics Feb. 26, 2013
8383505 Solder ball contact susceptible to lower stress Feb. 26, 2013
8373282 Wafer level chip scale package with reduced stress on solder balls Feb. 12, 2013
8373281 Semiconductor module and portable apparatus provided with semiconductor module Feb. 12, 2013
8373275 Fine pitch solder bump structure with built-in stress buffer Feb. 12, 2013
8368232 Sacrificial material to facilitate thin die attach Feb. 5, 2013
8368213 Low fabrication cost, fine pitch and high reliability solder bump Feb. 5, 2013
8368196 Micro device having a movable structure Feb. 5, 2013
8367543 Structure and method to improve current-carrying capabilities of C4 joints Feb. 5, 2013
RE43948 Formation of contacts on semiconductor substrates Jan. 29, 2013
8338288 Method of manufacturing semiconductor device Dec. 25, 2012
8338287 Semiconductor device and method for manufacturing the same Dec. 25, 2012
8330280 Bump structure and process of manufacturing the same Dec. 11, 2012
8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors Dec. 11, 2012
8324739 Semiconductor device Dec. 4, 2012











 
 
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