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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
5773359 Interconnect system and method of fabrication Jun. 30, 1998
5766972 Method of making resin encapsulated semiconductor device with bump electrodes Jun. 16, 1998
5767009 Structure of chip on chip mounting preventing from crosstalk noise Jun. 16, 1998
5767010 Solder bump fabrication methods and structure including a titanium barrier layer Jun. 16, 1998
5759910 Process for fabricating a solder bump for a flip chip integrated circuit Jun. 2, 1998
5757071 C4 substrate contact pad which has a layer of Ni-B plating May. 26, 1998
5744382 Method of packaging electronic chip component and method of bonding of electrode thereof Apr. 28, 1998
5736456 Method of forming conductive bumps on die for flip chip applications Apr. 7, 1998
5726075 Method for fabricating microbump interconnect for bare semiconductor dice Mar. 10, 1998
5719070 Metallization composite having nickel intermediate/interface Feb. 17, 1998
5719071 Method of forming a landing pad sturcture in an integrated circuit Feb. 17, 1998
5707894 Bonding pad structure and method thereof Jan. 13, 1998
5707902 Composite bump structure and methods of fabrication Jan. 13, 1998
5705427 Method of forming a landing pad structure in an integrated circuit Jan. 6, 1998
5702979 Method of forming a landing pad structure in an integrated circuit Dec. 30, 1997
5698465 Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating Dec. 16, 1997
5693565 Semiconductor chips suitable for known good die testing Dec. 2, 1997
5691210 Method for fabrication of probe structure and circuit substrate therefor Nov. 25, 1997
5686317 Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die Nov. 11, 1997
5677203 Method for providing known good bare semiconductor die Oct. 14, 1997
5670418 Method of joining an electrical contact element to a substrate Sep. 23, 1997
5665639 Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal Sep. 9, 1997
5646067 Method of bonding wafers having vias including conductive material Jul. 8, 1997
5633204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip May. 27, 1997
5631191 Method for connecting a die to electrically conductive traces on a flexible lead-frame May. 20, 1997
5620611 Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads Apr. 15, 1997
5597737 Method for testing and burning-in a semiconductor wafer Jan. 28, 1997
5587336 Bump formation on yielded semiconductor dies Dec. 24, 1996
5583073 Method for producing electroless barrier layer and solder bump on chip Dec. 10, 1996
5565379 Method of manufacturing a semiconductor device having a bump electrode by a proximity exposure method Oct. 15, 1996
5565385 Semiconductor bond pad structure and increased bond pad count per die Oct. 15, 1996
5563102 Method of sealing integrated circuits Oct. 8, 1996
5551627 Alloy solder connect assembly and method of connection Sep. 3, 1996
5550083 Process of wirebond pad repair and reuse Aug. 27, 1996
5542174 Method and apparatus for forming solder balls and solder columns Aug. 6, 1996
5538920 Method of fabricating semiconductor device Jul. 23, 1996
5538920 Method of fabricating semiconductor device Jul. 23, 1996
5536362 Wire interconnect structures for connecting an integrated circuit to a substrate Jul. 16, 1996
5518957 Method for making a thin profile semiconductor package May. 21, 1996
5508228 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same Apr. 16, 1996
5508229 Method for forming solder bumps in semiconductor devices Apr. 16, 1996
5503286 Electroplated solder terminal Apr. 2, 1996
5502002 Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip Mar. 26, 1996
5496775 Semiconductor device having ball-bonded pads Mar. 5, 1996
5492235 Process for single mask C4 solder bump fabrication Feb. 20, 1996
5486282 Electroetching process for seed layer removal in electrochemical fabrication of wafers Jan. 23, 1996
5483741 Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice Jan. 16, 1996
5482897 Integrated circuit with on-chip ground plane Jan. 9, 1996
5480834 Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent Jan. 2, 1996
5480835 Electrical interconnect and method for forming the same Jan. 2, 1996

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