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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6380060 Off-center solder ball attach and methods therefor Apr. 30, 2002
6376279 method for manufacturing a semiconductor package Apr. 23, 2002
6376352 Stud-cone bump for probe tips used in known good die carriers Apr. 23, 2002
6376353 Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects Apr. 23, 2002
6372552 Semiconductor device, ball grid array connection system, and method of making Apr. 16, 2002
6372620 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Apr. 16, 2002
6372622 Fine pitch bumping with improved device standoff and bump volume Apr. 16, 2002
6372623 Semiconductor device and method of fabrication Apr. 16, 2002
6372624 Method for fabricating solder bumps by wave soldering Apr. 16, 2002
6365500 Composite bump bonding Apr. 2, 2002
6365501 Mask repattern process Apr. 2, 2002
6362087 Method for fabricating a microelectronic fabrication having formed therein a redistribution structure Mar. 26, 2002
6362090 Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method Mar. 26, 2002
6358834 Method of forming bumps on wafers or substrates Mar. 19, 2002
6358836 Wafer level package incorporating elastomeric pads in dummy plugs Mar. 19, 2002
6352923 Method of fabricating direct contact through hole type Mar. 5, 2002
6350667 Method of improving pad metal adhesion Feb. 26, 2002
6350668 Low cost chip size package and method of fabricating the same Feb. 26, 2002
6348399 Method of making chip scale package Feb. 19, 2002
6348401 Method of fabricating solder bumps with high coplanarity for flip-chip application Feb. 19, 2002
6346469 Semiconductor device and a process for forming the semiconductor device Feb. 12, 2002
6344695 Semiconductor device to be mounted on main circuit board and process for manufacturing same device Feb. 5, 2002
6342443 Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate Jan. 29, 2002
6340630 Method for making interconnect for low temperature chip attachment Jan. 22, 2002
6332988 Rework process Dec. 25, 2001
6333104 Conductive polymer interconnection configurations Dec. 25, 2001
6330967 Process to produce a high temperature interconnection Dec. 18, 2001
6325280 Solder ball terminal Dec. 4, 2001
6306748 Bump scrub after plating Oct. 23, 2001
6306751 Apparatus and method for improving ball joints in semiconductor packages Oct. 23, 2001
6298551 Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas Oct. 9, 2001
6300164 Structure, materials, and methods for socketable ball grid Oct. 9, 2001
6297140 Method to plate C4 to copper stud Oct. 2, 2001
6291271 Method of making semiconductor chip package Sep. 18, 2001
6284639 Method for forming a structured metallization on a semiconductor wafer Sep. 4, 2001
6281106 Method of solder bumping a circuit component Aug. 28, 2001
6281107 Semiconductor device and method for manufacturing the same Aug. 28, 2001
6274474 Method of forming BGA interconnections having mixed solder profiles Aug. 14, 2001
6274935 Copper wire-bonding pad Aug. 14, 2001
6271109 Substrate for accommodating warped semiconductor devices Aug. 7, 2001
6271111 High density pluggable connector array and process thereof Aug. 7, 2001
6268275 Method of locating conductive spheres utilizing screen and hopper of solder balls Jul. 31, 2001
6264097 Method for forming a solder ball Jul. 24, 2001
6265300 Wire bonding surface and bonding method Jul. 24, 2001
6258705 Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip Jul. 10, 2001
6255208 Selective wafer-level testing and burn-in Jul. 3, 2001
6251704 Method of manufacturing semiconductor devices having solder bumps with reduced cracks Jun. 26, 2001
6251766 Method for improving attachment reliability of semiconductor chips and modules Jun. 26, 2001
6239983 Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board May. 29, 2001
6235612 Edge bond pads on integrated circuits May. 22, 2001

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