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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6514847 Method for making a semiconductor device Feb. 4, 2003
6509207 Soldering method and apparatus for a chip and electronic devices Jan. 21, 2003
6509256 Methods of forming electrically conductive interconnections and electrically interconnected substrates Jan. 21, 2003
6507112 Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding pads Jan. 14, 2003
6495397 Fluxless flip chip interconnection Dec. 17, 2002
6492197 Trilayer/bilayer solder bumps and fabrication methods therefor Dec. 10, 2002
6492255 Semiconductor chip and method manufacturing the same Dec. 10, 2002
6492737 Electronic device and a method of manufacturing the same Dec. 10, 2002
6489228 Integrated electronic device comprising a mechanical stress protection structure Dec. 3, 2002
6489229 Method of forming a semiconductor device having conductive bumps without using gold Dec. 3, 2002
6486052 Package having terminated plating layer and its manufacturing method Nov. 26, 2002
6486053 Semiconductor device and fabricating method therefor Nov. 26, 2002
6486054 Method to achieve robust solder bump height Nov. 26, 2002
6486551 Wired board and method of producing the same Nov. 26, 2002
6482680 Flip-chip on lead frame Nov. 19, 2002
6479376 Process improvement for the creation of aluminum contact bumps Nov. 12, 2002
6475892 Simplified method of patterning polysilicon gate in a semiconductor device Nov. 5, 2002
6472304 Wire bonding to copper Oct. 29, 2002
6472305 Method of manufacturing bonded structure of film substrate and semiconductor chip Oct. 29, 2002
6472759 Ball grid array type semiconductor device Oct. 29, 2002
6468893 Method of forming solder bumps Oct. 22, 2002
6462415 Semiconductor device as an object of thickness reduction Oct. 8, 2002
6458682 Method of manufacturing a bump electrode semiconductor device using photosensitive resin Oct. 1, 2002
6458683 Method for forming aluminum bumps by CVD and wet etch Oct. 1, 2002
6448169 Apparatus and method for use in manufacturing semiconductor devices Sep. 10, 2002
6448171 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability Sep. 10, 2002
6444562 Nickel alloy films for reduced intermetallic formation in solder Sep. 3, 2002
6444576 Three dimensional IC package module Sep. 3, 2002
6440770 Integrated circuit package Aug. 27, 2002
6436802 Method of producing contact structure Aug. 20, 2002
6436803 Manufacturing computer systems with fine line circuitized substrates Aug. 20, 2002
6432808 Method of improved bondability when using fluorinated silicon glass Aug. 13, 2002
6429112 Multi-layer substrates and fabrication processes Aug. 6, 2002
6426281 Method to form bump in bumping technology Jul. 30, 2002
6423625 Method of improving the bondability between Au wires and Cu bonding pads Jul. 23, 2002
6420255 Mounting substrate with a solder resist layer and method of forming the same Jul. 16, 2002
6413851 Method of fabrication of barrier cap for under bump metal Jul. 2, 2002
6413862 Use of palladium in IC manufacturing Jul. 2, 2002
6403399 Method of rapid wafer bumping Jun. 11, 2002
6403401 Heat spreader hole pin 1 identifier Jun. 11, 2002
6403457 Selectively coating bond pads Jun. 11, 2002
6405357 Method for positioning bond pads in a semiconductor die Jun. 11, 2002
6399475 Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops Jun. 4, 2002
6396156 Flip-chip bonding structure with stress-buffering property and method for making the same May. 28, 2002
6391758 Method of forming solder areas over a lead frame May. 21, 2002
6389691 Methods for forming integrated redistribution routing conductors and solder bumps May. 21, 2002
6387793 Method for manufacturing precision electroplated solder bumps May. 14, 2002
6387795 Wafer-level packaging May. 14, 2002
6387796 Semiconductor device and method of manufacturing the same May. 14, 2002
6388322 Article comprising a mechanically compliant bump May. 14, 2002

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