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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6653218 Method of fabricating resin-encapsulated semiconductor device Nov. 25, 2003
6649507 Dual layer photoresist method for fabricating a mushroom bumping plating structure Nov. 18, 2003
6645783 Method of producing an optoelectronic component Nov. 11, 2003
6642079 Process of fabricating flip chip interconnection structure Nov. 4, 2003
6642158 Photo-thermal induced diffusion Nov. 4, 2003
6638847 Method of forming lead-free bump interconnections Oct. 28, 2003
6639314 Solder bump structure and a method of forming the same Oct. 28, 2003
6632732 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Oct. 14, 2003
6632733 Components and methods with nested leads Oct. 14, 2003
6624059 Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond Sep. 23, 2003
6624060 Method and apparatus for pretreating a substrate prior to electroplating Sep. 23, 2003
6619536 Solder process and solder alloy therefor Sep. 16, 2003
6620720 Interconnections to copper IC's Sep. 16, 2003
6617236 Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Sep. 9, 2003
6617237 Lead-free bump fabrication process Sep. 9, 2003
6617674 Semiconductor package and method of preparing same Sep. 9, 2003
6617687 Method of forming a test insert for interfacing a device containing contact bumps with a test substrate Sep. 9, 2003
6613663 Method for forming barrier layers for solder bumps Sep. 2, 2003
6614113 Semiconductor device and method for producing the same Sep. 2, 2003
6610591 Methods of ball grid array Aug. 26, 2003
6599822 Methods of fabricating semiconductor substrate-based BGA interconnection Jul. 29, 2003
6596621 Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate Jul. 22, 2003
6593220 Elastomer plating mask sealed wafer level package method Jul. 15, 2003
6593649 Methods of IC rerouting option for multiple package system applications Jul. 15, 2003
6590283 Method for hermetic leadless device interconnect using a submount Jul. 8, 2003
6590294 Device for bump probing and method of fabrication Jul. 8, 2003
6590297 Semiconductor chip having pads with plural junctions for different assembly methods Jul. 8, 2003
6586322 Method of making a bump on a substrate using multiple photoresist layers Jul. 1, 2003
6586323 Method for dual-layer polyimide processing on bumping technology Jul. 1, 2003
6583039 Method of forming a bump on a copper pad Jun. 24, 2003
6576541 Method and structure for producing bumps on an IC package substrate Jun. 10, 2003
6569751 Low via resistance system May. 27, 2003
6569752 Semiconductor element and fabricating method thereof May. 27, 2003
6569755 Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same May. 27, 2003
6566239 Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating May. 20, 2003
6566253 Method of making electrical interconnection for attachment to a substrate May. 20, 2003
6555459 Method of manufacturing a semiconductor device Apr. 29, 2003
6555460 Methods for mask repattern process Apr. 29, 2003
6551912 Method of forming a conductive coating on a semiconductor device Apr. 22, 2003
6551916 Bond-pad with pad edge strengthening structure Apr. 22, 2003
6551917 Method of locating conductive spheres utilizing screen and hopper of solder balls Apr. 22, 2003
6544878 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties Apr. 8, 2003
6528343 Semiconductor device its manufacturing method and electronic device Mar. 4, 2003
6528417 Metal patterned structure for SiN surface adhesion enhancement Mar. 4, 2003
6524892 Method of fabricating multilayer flexible wiring boards Feb. 25, 2003
6521521 Bonding pad structure and method for fabricating the same Feb. 18, 2003
6518092 Semiconductor device and method for manufacturing Feb. 11, 2003
6518160 Method of manufacturing connection components using a plasma patterned mask Feb. 11, 2003
6518162 Method for manufacturing a semiconductor device Feb. 11, 2003
6514846 Method of fabricating soldering balls for semiconductor encapsulation Feb. 4, 2003

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