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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6777335 Polishing method Aug. 17, 2004
6774026 Structure and method for low-stress concentration solder bumps Aug. 10, 2004
6774027 Semiconductor device and method for manufacturing the same Aug. 10, 2004
6767818 Method for forming electrically conductive bumps and devices formed Jul. 27, 2004
6767819 Apparatus with compliant electrical terminals, and methods for forming same Jul. 27, 2004
6767820 Chip scale surface mounted device and process of manufacture Jul. 27, 2004
6764933 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods Jul. 20, 2004
6764938 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof Jul. 20, 2004
6765277 Microelectronic fabrication with corrosion inhibited bond pad Jul. 20, 2004
6762119 Method of preventing solder wetting in an optical device using diffusion of Cr Jul. 13, 2004
6762503 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same Jul. 13, 2004
6759599 Circuit board, method for manufacturing same, and high-output module Jul. 6, 2004
6759268 Semiconductor device and manufacturing method therefor Jul. 6, 2004
6759318 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process Jul. 6, 2004
6756294 Method for improving bump reliability for flip chip devices Jun. 29, 2004
6756680 Flip chip C4 extension structure and process Jun. 29, 2004
6750133 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps Jun. 15, 2004
6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same May. 25, 2004
6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly May. 25, 2004
6740577 Method of forming a small pitch torch bump for mounting high-performance flip-flop devices May. 25, 2004
6740578 Methods of fabricating semiconductor substrate-based BGA interconnections May. 25, 2004
6737353 Semiconductor device having bump electrodes May. 18, 2004
6734092 Semiconductor device and manufacturing method thereof May. 11, 2004
6734093 Method for placing active circuits beneath active bonding pads May. 11, 2004
6730589 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument May. 4, 2004
6727116 Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods Apr. 27, 2004
6723628 Method for forming bonding pad structures in semiconductor devices Apr. 20, 2004
6720243 Bump fabrication method Apr. 13, 2004
6720245 Method of fabrication and device for electromagnetic-shielding structures in a damascene-based interconnect scheme Apr. 13, 2004
6720257 Bump with basic metallization and method for manufacturing the basic metallization Apr. 13, 2004
6716738 Method of fabricating multilayered UBM for flip chip interconnections by electroplating Apr. 6, 2004
6713377 Method of electroless plating copper on nitride barrier Mar. 30, 2004
6705512 Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding Mar. 16, 2004
6706564 Method for fabricating semiconductor package and semiconductor package Mar. 16, 2004
6706622 Bonding pad interface Mar. 16, 2004
6699782 Method of fabricating a wafer level package Mar. 2, 2004
6696305 Metal post manufacturing method Feb. 24, 2004
6687989 Method for fabricating interconnect having support members for preventing component flexure Feb. 10, 2004
6689678 Process for fabricating ball grid array package for enhanced stress tolerance Feb. 10, 2004
6689680 Semiconductor device and method of formation Feb. 10, 2004
6686650 Non-contact data carrier and IC chip Feb. 3, 2004
6673711 Solder ball fabricating process Jan. 6, 2004
6670214 Insulated bonding wire for microelectronic packaging Dec. 30, 2003
6670264 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby Dec. 30, 2003
6664128 Bump fabrication process Dec. 16, 2003
6664175 Method of forming ruthenium interconnect for an integrated circuit Dec. 16, 2003
6664176 Method of making pad-rerouting for integrated circuit chips Dec. 16, 2003
6660625 Method of electroless plating copper on nitride barrier Dec. 9, 2003
6656828 Method of forming bump electrodes Dec. 2, 2003
6657313 Dielectric interposer for chip to substrate soldering Dec. 2, 2003

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