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Class Information
Number: 438/614
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode > Plural conductive layers
Description: Processes wherein the bump electrode is composed of multiple conductive layers.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8709936 Method and structure of forming backside through silicon via connections Apr. 29, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8659174 Semiconductor device Feb. 25, 2014
8659173 Isolated wire structures with reduced stress, methods of manufacturing and design structures Feb. 25, 2014
8659155 Mechanisms for forming copper pillar bumps Feb. 25, 2014
8658528 Bumping process and structure thereof Feb. 25, 2014
8652960 Active area bonding compatible high current structures Feb. 18, 2014
8652862 Method for etching insulating film and method for manufacturing semiconductor optical device Feb. 18, 2014
8642463 Routing layer for mitigating stress in a semiconductor die Feb. 4, 2014
8642462 Interconnection designs and materials having improved strength and fatigue life Feb. 4, 2014
8637393 Methods and structures for capping a structure with a protective coating Jan. 28, 2014
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Jan. 28, 2014
8633103 Semiconductor device and manufacturing method of the same Jan. 21, 2014
8624404 Integrated circuit package having offset vias Jan. 7, 2014
8624403 Semiconductor device and a method of manufacturing the same Jan. 7, 2014
8624362 IC wafer having electromagnetic shielding effects and method for making the same Jan. 7, 2014
8623756 Reflow system and method for conductive connections Jan. 7, 2014
8622020 Simultaneous electroless plating of two substrates Jan. 7, 2014
8618676 Method of assembly of a semiconductor package for the improvement of the electrical testing yield on the packages so obtained Dec. 31, 2013
8617997 Selective wet etching of gold-tin based solder Dec. 31, 2013
8617970 Method of manufacturing semiconductor device Dec. 31, 2013
8609539 Embedded semiconductor device substrate and production method thereof Dec. 17, 2013
8609526 Preventing UBM oxidation in bump formation processes Dec. 17, 2013
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8603911 Semiconductor device and fabrication method thereof Dec. 10, 2013
8598030 Process for making conductive post with footing profile Dec. 3, 2013
8592300 Interface structure for copper-copper peeling integrity Nov. 26, 2013
8587135 Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing Nov. 19, 2013
8586467 Method of mounting electronic component and mounting substrate Nov. 19, 2013
8581423 Double solid metal pad with reduced area Nov. 12, 2013
8581420 Under-bump metallization (UBM) structure and method of forming the same Nov. 12, 2013
8580672 Methods of forming bump structures that include a protection layer Nov. 12, 2013
8575754 Micro-bump structure Nov. 5, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
8569897 Protection layer for preventing UBM layer from chemical attack and oxidation Oct. 29, 2013
8569896 Active area bonding compatible high current structures Oct. 29, 2013
8569735 Semiconductor light-emitting element, electrode and manufacturing method for the element, and lamp Oct. 29, 2013
8563418 Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces Oct. 22, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8547167 Die power structure Oct. 1, 2013
8546254 Mechanisms for forming copper pillar bumps using patterned anodes Oct. 1, 2013
8541893 Semiconductor memory device and power line arrangement method thereof Sep. 24, 2013
8541300 Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus Sep. 24, 2013
8536047 Methods and systems for material bonding Sep. 17, 2013
8530351 Semiconductor package and fabrication method Sep. 10, 2013
8524596 Techniques for improving bond pad performance Sep. 3, 2013
8518815 Methods, devices, and materials for metallization Aug. 27, 2013
8513818 Semiconductor device and method for fabricating the same Aug. 20, 2013
8513814 Buffer pad in solder bump connections and methods of manufacture Aug. 20, 2013











 
 
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