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Class Information
Number: 438/613
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad > Bump electrode
Description: Processes wherein the electrical contact is in the shape of an abrupt protuberance elevated relative to the main surface of the substrate.










Sub-classes under this class:

Class Number Class Name Patents
438/615 Including fusion of conductor 346
438/614 Plural conductive layers 1,038


Patents under this class:

Patent Number Title Of Patent Date Issued
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8709934 Electronic system with vertical intermetallic compound Apr. 29, 2014
8704370 Semiconductor package structure having an air gap and method for forming Apr. 22, 2014
8703601 Method for applying liquid material, application device and program Apr. 22, 2014
8703600 Electronic component and method of connecting with multi-profile bumps Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8679963 Fan-out chip scale package Mar. 25, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask Mar. 18, 2014
8674477 Semiconductor package with embedded spiral inductor Mar. 18, 2014
8669174 Multi-die stacking using bumps with different sizes Mar. 11, 2014
8669173 Methods of fluxless micro-piercing of solder balls, and resulting devices Mar. 11, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8664761 Semiconductor structure and manufacturing method of the same Mar. 4, 2014
8664041 Method for designing a package and substrate layout Mar. 4, 2014
8659170 Semiconductor device having conductive pads and a method of manufacturing the same Feb. 25, 2014
8658528 Bumping process and structure thereof Feb. 25, 2014
8653657 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device Feb. 18, 2014
8652941 Wafer dicing employing edge region underfill removal Feb. 18, 2014
RE44761 Solder joint flip chip interconnection having relief structure Feb. 11, 2014
8647926 Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Feb. 11, 2014
8643196 Structure and method for bump to landing trace ratio Feb. 4, 2014
8642463 Routing layer for mitigating stress in a semiconductor die Feb. 4, 2014
8642390 Tape residue-free bump area after wafer back grinding Feb. 4, 2014
8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Feb. 4, 2014
8637994 Microfeature workpieces having alloyed conductive structures, and associated methods Jan. 28, 2014
8637986 Semiconductor device and method for manufacturing thereof Jan. 28, 2014
8637394 Integrated circuit package system with flex bump Jan. 28, 2014
8637391 Flip chip semiconductor assembly with variable volume solder bumps Jan. 28, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8633586 Mock bump system for flip chip integrated circuits Jan. 21, 2014
8633582 Chip package and fabrication method thereof Jan. 21, 2014
8633102 Module comprising a semiconductor chip Jan. 21, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8629053 Plasma treatment for semiconductor devices Jan. 14, 2014
8624620 Test system and write wafer Jan. 7, 2014
8624403 Semiconductor device and a method of manufacturing the same Jan. 7, 2014
8624393 Methods and designs for localized wafer thinning Jan. 7, 2014
8624362 IC wafer having electromagnetic shielding effects and method for making the same Jan. 7, 2014
8624351 Package structure and method for making the same Jan. 7, 2014
8623756 Reflow system and method for conductive connections Jan. 7, 2014
8623755 Self-aligned protection layer for copper post structure Jan. 7, 2014
8623754 Repairing anomalous stiff pillar bumps Jan. 7, 2014
8623753 Stackable protruding via package and method Jan. 7, 2014
8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Jan. 7, 2014
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof Dec. 17, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8607446 Method of manufacturing an electronic component Dec. 17, 2013











 
 
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