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Class Information
Number: 438/612
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad
Description: Processes for making an ohmic electrical contact to a semiconductor region which contact also serves as a solder contact or bonding pad.










Sub-classes under this class:

Class Number Class Name Patents
438/613 Bump electrode 1,872


Patents under this class:

Patent Number Title Of Patent Date Issued
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8709934 Electronic system with vertical intermetallic compound Apr. 29, 2014
8709933 Interposer having molded low CTE dielectric Apr. 29, 2014
8709932 Integrated circuit packaging system with interconnects and method of manufacture thereof Apr. 29, 2014
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8704385 Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device Apr. 22, 2014
8703600 Electronic component and method of connecting with multi-profile bumps Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8691684 Layout and pad floor plan of power transistor for good performance of SPU and STOG Apr. 8, 2014
8691683 Flip-chip mounting method and bump formation method Apr. 8, 2014
8691610 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask Mar. 18, 2014
8673761 Reflow method for lead-free solder Mar. 18, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8673659 Method of fabricating semiconductor device including process monitoring pattern having overlapping input/output pad array area Mar. 18, 2014
8669179 Through-wafer interconnects for photoimager and memory wafers Mar. 11, 2014
8669173 Methods of fluxless micro-piercing of solder balls, and resulting devices Mar. 11, 2014
8664106 Method of manufacturing semiconductor device Mar. 4, 2014
8658911 Through-hole-vias in multi-layer printed circuit boards Feb. 25, 2014
8658528 Bumping process and structure thereof Feb. 25, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8653657 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device Feb. 18, 2014
8647982 Methods of forming interconnects in a semiconductor structure Feb. 11, 2014
8647974 Method of fabricating a semiconductor chip with supportive terminal pad Feb. 11, 2014
8647973 Semiconductor device capable of reducing electrical defects and method of fabricating the same Feb. 11, 2014
8647961 Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Feb. 11, 2014
8642461 Side wettable plating for semiconductor chip package Feb. 4, 2014
8642389 Method of manufacturing a semiconductor device Feb. 4, 2014
8637994 Microfeature workpieces having alloyed conductive structures, and associated methods Jan. 28, 2014
8637990 Semiconductor device and method for fabricating the same Jan. 28, 2014
8637986 Semiconductor device and method for manufacturing thereof Jan. 28, 2014
8637393 Methods and structures for capping a structure with a protective coating Jan. 28, 2014
8637379 Device including a semiconductor chip and a carrier and fabrication method Jan. 28, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8633100 Method of manufacturing integrated circuit packaging system with support structure Jan. 21, 2014
8629052 Methods of forming semiconductor devices having narrow conductive line patterns Jan. 14, 2014
8624404 Integrated circuit package having offset vias Jan. 7, 2014
8624402 Mock bump system for flip chip integrated circuits Jan. 7, 2014
8623753 Stackable protruding via package and method Jan. 7, 2014
8610264 Compliant interconnects in wafers Dec. 17, 2013
8603910 Method of processing a contact pad Dec. 10, 2013
8603909 Integrated circuit packaging system with core region and bond pad and method of manufacture thereof Dec. 10, 2013
8598720 Semiconductor device and manufacturing method thereof Dec. 3, 2013
8598029 Method for fabricating flip-attached and underfilled semiconductor devices Dec. 3, 2013
8597982 Methods of fabricating electronics assemblies Dec. 3, 2013











 
 
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