| |
 |
|
Class Information
Number: 438/612
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Forming solder contact or bonding pad
Description: Processes for making an ohmic electrical contact to a semiconductor region which contact also serves as a solder contact or bonding pad.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE40983 |
Method to plate C4 to copper stud |
Nov. 17, 2009 |
| 7615865 |
Standoff height improvement for bumping technology using solder resist |
Nov. 10, 2009 |
| 7615478 |
Fabrication method for electronic system modules |
Nov. 10, 2009 |
| 7615477 |
Method of fabricating a BGA package having decreased adhesion |
Nov. 10, 2009 |
| 7615476 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
Nov. 10, 2009 |
| 7608533 |
Semiconductor die attachment for high vacuum tubes |
Oct. 27, 2009 |
| 7605463 |
Interposer and method for producing the same and electronic device |
Oct. 20, 2009 |
| 7604152 |
Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same |
Oct. 20, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7601628 |
Wire and solder bond forming methods |
Oct. 13, 2009 |
| 7601626 |
Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device |
Oct. 13, 2009 |
| 7601625 |
Method for manufacturing semiconductor device having solder layer |
Oct. 13, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7598164 |
Method for direct bonding of metallic conductors to a ceramic substrate |
Oct. 6, 2009 |
| 7598124 |
System and method to increase die stand-off height |
Oct. 6, 2009 |
| 7598117 |
Method for manufacturing semiconductor module using interconnection structure |
Oct. 6, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7595227 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
Sep. 29, 2009 |
| 7592246 |
Method and semiconductor device having copper interconnect for bonding |
Sep. 22, 2009 |
| 7589009 |
Method for fabricating a top conductive layer in a semiconductor die and related structure |
Sep. 15, 2009 |
| 7589008 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
Sep. 15, 2009 |
| 7585754 |
Method of forming bonding pad opening |
Sep. 8, 2009 |
| 7582553 |
Method of bonding flying leads |
Sep. 1, 2009 |
| 7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering |
Sep. 1, 2009 |
| 7582551 |
Wiring substrate and wiring substrate manufacturing method |
Sep. 1, 2009 |
| 7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
Aug. 25, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7573115 |
Structure and method for enhancing resistance to fracture of bonding pads |
Aug. 11, 2009 |
| 7572739 |
Tape removal in semiconductor structure fabrication |
Aug. 11, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7572721 |
Method of forming a semiconductor device having an etch stop layer and related device |
Aug. 11, 2009 |
| 7572673 |
Wafer level package having a stress relief spacer and manufacturing method thereof |
Aug. 11, 2009 |
| 7569474 |
Method and apparatus for soldering modules to substrates |
Aug. 4, 2009 |
| 7569472 |
Method and apparatus of power ring positioning to minimize crosstalk |
Aug. 4, 2009 |
| 7569471 |
Method of providing mixed size solder bumps on a substrate using a solder delivery head |
Aug. 4, 2009 |
| 7566650 |
Integrated circuit solder bumping system |
Jul. 28, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7566647 |
Method of disposing and arranging dummy patterns |
Jul. 28, 2009 |
| 7563703 |
Microelectronic interconnect device comprising localised conductive pins |
Jul. 21, 2009 |
| 7560374 |
Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold |
Jul. 14, 2009 |
| 7560373 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby |
Jul. 14, 2009 |
| 7560372 |
Process for making a semiconductor device having a roughened surface |
Jul. 14, 2009 |
| 7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum |
Jul. 14, 2009 |
| 7557029 |
Semiconductor device and fabrication process thereof |
Jul. 7, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7553752 |
Method of making a wafer level integration package |
Jun. 30, 2009 |
| 7553750 |
Method for fabricating electrical conductive structure of circuit board |
Jun. 30, 2009 |
|
|
|
