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Class Information
Number: 438/611
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Beam lead formation
Description: Processes wherein the electrical contact leads extend beyond the edge of the semiconductor substrate.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8703598 Manufacturing method of lead frame substrate Apr. 22, 2014
8686574 Semiconductor device Apr. 1, 2014
8603861 Alpha shielding techniques and configurations Dec. 10, 2013
8586417 Isostress grid array and method of fabrication thereof Nov. 19, 2013
8535986 Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame Sep. 17, 2013
8530276 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured Sep. 10, 2013
8524593 Arrangement for solder bump formation on wafers Sep. 3, 2013
8519534 Microsprings partially embedded in a laminate structure and methods for producing same Aug. 27, 2013
8426963 Power semiconductor package structure and manufacturing method thereof Apr. 23, 2013
8409924 Flexible interconnect pattern on semiconductor package Apr. 2, 2013
8409978 Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe Apr. 2, 2013
8390126 Method and arrangement for reduced thermal stress between substrates Mar. 5, 2013
8384230 Semiconductor device Feb. 26, 2013
8258014 Method of manufacturing a power transistor module and package with integrated bus bar Sep. 4, 2012
8237270 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Aug. 7, 2012
8198131 Stackable semiconductor device packages Jun. 12, 2012
8179692 Board having connection terminal May. 15, 2012
8158508 Structure and manufacturing method of a chip scale package Apr. 17, 2012
8132709 Semiconductor device and method for manufacturing same Mar. 13, 2012
8080859 Reducing stress between a substrate and a projecting electrode on the substrate Dec. 20, 2011
8034644 Light emitting device Oct. 11, 2011
8026600 Controlled impedance structures for high density interconnections Sep. 27, 2011
8017452 Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method Sep. 13, 2011
7985631 Semiconductor assembly with one metal layer after base metal removal Jul. 26, 2011
7982320 Arrangement for solder bump formation on wafers Jul. 19, 2011
RE42542 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board Jul. 12, 2011
7960211 Semiconductor system-in-package and method for making the same Jun. 14, 2011
7923304 Integrated circuit packaging system with conductive pillars and method of manufacture thereof Apr. 12, 2011
7915081 Flexible interconnect pattern on semiconductor package Mar. 29, 2011
7915088 Wiring board manufacturing method, semiconductor device manufacturing method and wiring board Mar. 29, 2011
7884006 Method to build a wirebond probe card in a many at a time fashion Feb. 8, 2011
7838971 Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages Nov. 23, 2010
7803693 Bowed wafer hybridization compensation Sep. 28, 2010
7790491 Method for forming non-volatile memory cells and related apparatus and system Sep. 7, 2010
7763986 Semiconductor chip, film substrate, and related semiconductor chip package Jul. 27, 2010
7752738 Methods for fabricating thin complaint spring contacts Jul. 13, 2010
7713388 Out-of-plane spring structures on a substrate May. 11, 2010
7713856 Power semiconductor laser with low divergence and low astigmatism, and method for the production thereof May. 11, 2010
7704800 Semiconductor assembly with one metal layer after base metal removal Apr. 27, 2010
7691735 Method for manufacturing metal chips by plasma from a layer comprising several elements Apr. 6, 2010
7659191 Gold/silicon eutectic die bonding method Feb. 9, 2010
7651937 Bumping process and structure thereof Jan. 26, 2010
7635643 Method for forming C4 connections on integrated circuit chips and the resulting devices Dec. 22, 2009
7632750 Arrangement for solder bump formation on wafers Dec. 15, 2009
7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof Nov. 10, 2009
7569411 Metal MEMS devices and methods of making same Aug. 4, 2009
7547581 Manufacturing method of a semiconductor device to suppress generation of whiskers Jun. 16, 2009
7534652 Microelectronic elements with compliant terminal mountings and methods for making the same May. 19, 2009
7531380 Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof May. 12, 2009
7514350 Electronic device and method of manufacturing the same, circuit board, and electronic instrument Apr. 7, 2009

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