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Class Information
Number: 438/55
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Thermally responsive > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8709850 Method for production of a thermoelectric apparatus Apr. 29, 2014
8692349 Semiconductor devices and methods of controlling temperature thereof Apr. 8, 2014
8669141 Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps Mar. 11, 2014
8664602 Wafer-level intrapixel getter reflector whole die encapsulation device and method Mar. 4, 2014
8652866 Sensor device and method Feb. 18, 2014
8629541 Semiconductor package for controlling warpage Jan. 14, 2014
8624370 Integrated circuit packaging system with an interposer and method of manufacture thereof Jan. 7, 2014
8609466 Cap and substrate electrical connection at wafer level Dec. 17, 2013
8604605 Microelectronic assembly with multi-layer support structure Dec. 10, 2013
8586408 Contact and method of formation Nov. 19, 2013
8586395 Method and apparatus for reducing thermopile variations Nov. 19, 2013
8580127 Method of manufacturing RFID based thermal bubble type accelerometer Nov. 12, 2013
8569082 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame Oct. 29, 2013
8546903 Ionic isolation ring Oct. 1, 2013
8546262 Solid-state image pickup device, method of manufacturing the same and electronic apparatus Oct. 1, 2013
8546153 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same Oct. 1, 2013
8524541 Processes for manufacturing an LED package with top and bottom electrodes Sep. 3, 2013
8525217 Method and device for resin coating Sep. 3, 2013
8481842 Process for producing Peltier modules, and Peltier module Jul. 9, 2013
8466539 MRAM device and method of assembling same Jun. 18, 2013
8465998 Thermoelectric conversion module and method for manufacturing thermoelectric conversion module Jun. 18, 2013
8465666 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive compositi Jun. 18, 2013
8455907 Semiconductor light emitting device having an optical plate including a meniscus control structure and method of manufacturing Jun. 4, 2013
8440488 Manufacturing method and structure for wafer level image sensor module with fixed focal length May. 14, 2013
8435822 Patterning electrode materials free from berm structures for thin film photovoltaic cells May. 7, 2013
8420430 Fabrication method of package structure having MEMS element Apr. 16, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8415760 Sensor for detecting thermal radiation Apr. 9, 2013
8395249 Sealed cavity Mar. 12, 2013
8357560 Package of MEMS device and method for fabricating the same Jan. 22, 2013
8338205 Method of fabricating and encapsulating MEMS devices Dec. 25, 2012
8334150 Wafer level laser marking system for ultra-thin wafers using support tape Dec. 18, 2012
8318525 Gas sensing device Nov. 27, 2012
8314008 Method of mounting MEMS integrated circuits directly from wafer film frame Nov. 20, 2012
8304277 Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking Nov. 6, 2012
8293572 Injection molding system and method of chip package Oct. 23, 2012
8283194 Method for applying layers onto thermoelectric materials Oct. 9, 2012
8258016 Semiconductor package having increased resistance to electrostatic discharge Sep. 4, 2012
8247771 Device for detection and/or emission of electromagnetic radiation and method for fabricating such a device Aug. 21, 2012
8237043 Integrated parallel Peltier/Seebeck element chip and production method therefor, connection method Aug. 7, 2012
8232127 Thermo-electric semiconductor device and method for manufacturing the same Jul. 31, 2012
8222086 Integrated semiconductor substrate structure using incompatible processes Jul. 17, 2012
8216931 Methods for forming multi-layer three-dimensional structures Jul. 10, 2012
8211730 Nanophotonic transceiver Jul. 3, 2012
8201326 Method of manufacturing a semiconductor device Jun. 19, 2012
8183079 Semiconductor device and method of manufacturing the same May. 22, 2012
8178936 Double-side mountable MEMS package May. 15, 2012
8173473 Laser system for processing solar wafers in a carrier May. 8, 2012
8143689 Sensor device Mar. 27, 2012

1 2 3 4 5 6

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