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Class Information
Number: 438/51
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Physical stress responsive > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618837 |
Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process |
Nov. 17, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615394 |
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer |
Nov. 10, 2009 |
| 7611919 |
Bonding interface for micro-device packaging |
Nov. 3, 2009 |
| 7608470 |
Interconnection device including one or more embedded vias and method of producing the same |
Oct. 27, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7595209 |
Low stress thin film microshells |
Sep. 29, 2009 |
| 7592195 |
Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement |
Sep. 22, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7588951 |
Method of packaging a semiconductor device and a prefabricated connector |
Sep. 15, 2009 |
| 7582506 |
Precursor containing copper indium and gallium for selenide (sulfide) compound formation |
Sep. 1, 2009 |
| 7572659 |
Semiconductor dynamic sensor and method of manufacturing the same |
Aug. 11, 2009 |
| 7569410 |
Method for integrated MEMS packaging |
Aug. 4, 2009 |
| 7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer |
Aug. 4, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7563633 |
Microelectromechanical systems encapsulation process |
Jul. 21, 2009 |
| 7563635 |
Electronic device and method of manufacturing the same |
Jul. 21, 2009 |
| 7560820 |
Integrated getter for vacuum or inert gas packaged LEDs |
Jul. 14, 2009 |
| 7556990 |
CMOS image sensor having improved signal efficiency and method for manufacturing the same |
Jul. 7, 2009 |
| 7547568 |
Electrical conditioning of MEMS device and insulating layer thereof |
Jun. 16, 2009 |
| 7544531 |
Ground strap for suppressing stiction during MEMS fabrication |
Jun. 9, 2009 |
| 7541209 |
Method of forming a device package having edge interconnect pad |
Jun. 2, 2009 |
| 7524693 |
Method and apparatus for forming an electrical connection to a semiconductor substrate |
Apr. 28, 2009 |
| 7521271 |
Method of manufacturing a transponder |
Apr. 21, 2009 |
| 7521363 |
MEMS device with non-standard profile |
Apr. 21, 2009 |
| 7517712 |
Wafer-level hermetic micro-device packages |
Apr. 14, 2009 |
| 7513154 |
Semiconductor acceleration sensor device and fabrication method thereof |
Apr. 7, 2009 |
| 7514286 |
Method for forming individual semi-conductor devices |
Apr. 7, 2009 |
| 7511374 |
Microelectronic imaging units having covered image sensors |
Mar. 31, 2009 |
| 7507346 |
Method for manufacturing electronic component, and electronic component |
Mar. 24, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7491568 |
Wafer level package and method for making the same |
Feb. 17, 2009 |
| 7491567 |
MEMS device packaging methods |
Feb. 17, 2009 |
| 7489021 |
Lead frame with included passive devices |
Feb. 10, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7482193 |
Injection-molded package for MEMS inertial sensor |
Jan. 27, 2009 |
| 7476948 |
Microminiature moving device and method of making the same |
Jan. 13, 2009 |
| 7468288 |
Die-level opto-electronic device and method of making same |
Dec. 23, 2008 |
| 7465600 |
Package for a micro-electro mechanical device |
Dec. 16, 2008 |
| 7459330 |
Manufacturing method of an acceleration sensing device |
Dec. 2, 2008 |
| 7456042 |
Microelectromechanical systems having stored charge and methods for fabricating and using same |
Nov. 25, 2008 |
| 7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
Nov. 11, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7442570 |
Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom |
Oct. 28, 2008 |
| 7436054 |
MEMS microphone with a stacked PCB package and method of producing the same |
Oct. 14, 2008 |
| 7435610 |
Fabrication of array pH sensitive EGFET and its readout circuit |
Oct. 14, 2008 |
| 7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
Sep. 30, 2008 |
| 7422929 |
Wafer-level packaging of optoelectronic devices |
Sep. 9, 2008 |
| 7413920 |
Double-sided etching method using embedded alignment mark |
Aug. 19, 2008 |
| 7410820 |
MEMS passivation with phosphonate surfactants |
Aug. 12, 2008 |
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