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Class Information
Number: 438/51
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Physical stress responsive > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process including (a) multiple










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709849 Wafer level packaging Apr. 29, 2014
8710599 Micromachined devices and fabricating the same Apr. 29, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8687030 Exposing device, method of manufacturing the same, and image forming apparatus Apr. 1, 2014
8680665 Encapsulation, MEMS and encapsulation method Mar. 25, 2014
8674496 System and method for fine pitch PoP structure Mar. 18, 2014
8674359 TFT, array substrate for display apparatus including TFT, and methods of manufacturing TFT and array substrate Mar. 18, 2014
8673670 Micro-electro-mechanical system (MEMS) structures and design structures Mar. 18, 2014
8664029 Process for fabricating a capacitance type tri-axial accelerometer Mar. 4, 2014
8658452 Low temperature ceramic microelectromechanical structures Feb. 25, 2014
8659099 Method for manufacturing a micromechanical structure, and micromechanical structure Feb. 25, 2014
8659167 Sensor packaging method and sensor packages Feb. 25, 2014
8653634 EMI-shielded semiconductor devices and methods of making Feb. 18, 2014
8652866 Sensor device and method Feb. 18, 2014
8652865 Attaching a MEMS to a bonding wafer Feb. 18, 2014
8646335 Contact stress sensor Feb. 11, 2014
8647908 Semiconductor pressure sensor and method of manufacturing semiconductor pressure sensor Feb. 11, 2014
8647962 Wafer level packaging bond Feb. 11, 2014
8648430 Microelectromechanical system having movable element integrated into substrate-based package Feb. 11, 2014
8643127 Sensor device packaging Feb. 4, 2014
8643125 Structure and process for microelectromechanical system-based sensor Feb. 4, 2014
8642370 Cavity open process to improve undercut Feb. 4, 2014
8637943 Multi-axis integrated MEMS devices with CMOS circuits and method therefor Jan. 28, 2014
8633049 Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom Jan. 21, 2014
8629541 Semiconductor package for controlling warpage Jan. 14, 2014
8624370 Integrated circuit packaging system with an interposer and method of manufacture thereof Jan. 7, 2014
8618619 Top port with interposer MEMS microphone package and method Dec. 31, 2013
8617943 Method for making a semiconductor device on a flexible substrate Dec. 31, 2013
8614110 Method for fabricating a dual-crystalline silicon suspension system using pre-fabricated cavities Dec. 24, 2013
8614492 Nanowire stress sensors, stress sensor integrated circuits, and design structures for a stress sensor integrated circuit Dec. 24, 2013
8610223 Embedded microelectromechanical systems sensor and related devices and methods Dec. 17, 2013
8609466 Cap and substrate electrical connection at wafer level Dec. 17, 2013
8604566 Sensor module and semiconductor chip Dec. 10, 2013
8604605 Microelectronic assembly with multi-layer support structure Dec. 10, 2013
8597964 Manufacturing method of LED package structure Dec. 3, 2013
8592926 Substrate bonding with metal germanium silicon material Nov. 26, 2013
8592241 Method for packaging an electronic device assembly having a capped device interconnect Nov. 26, 2013
8587012 LED package and mold of manufacturing the same Nov. 19, 2013
8569090 Wafer level structures and methods for fabricating and packaging MEMS Oct. 29, 2013
8564115 Package structure having micro-electromechanical element Oct. 22, 2013
8557623 Methods and apparatuses for integrated packaging of microelectromechanical devices Oct. 15, 2013
8551799 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer Oct. 8, 2013
8546153 Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same Oct. 1, 2013
8546169 Pressure sensor device and method of assembling same Oct. 1, 2013
8546170 MEMS process and device Oct. 1, 2013
8546895 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Oct. 1, 2013
8541851 MEMS package Sep. 24, 2013
8535966 Horizontal coplanar switches and methods of manufacture Sep. 17, 2013
8536663 Metal mesh lid MEMS package and method Sep. 17, 2013
8530258 Method and apparatus for MEMS oscillator Sep. 10, 2013

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