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Class Information
Number: 438/50
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Physical stress responsive
Description: Process for making a semiconductor device or circuit responsive to physical deformation (e.g., pressure, strain, etc.).










Sub-classes under this class:

Class Number Class Name Patents
438/52 Having cantilever element 871
438/53 Having diaphragm element 772
438/51 Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor 656


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8709848 Method for etched cavity devices Apr. 29, 2014
8703516 MEMS substrates, devices, and methods of manufacture thereof Apr. 22, 2014
8703517 Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer Apr. 22, 2014
8691610 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8686519 MEMS accelerometer using capacitive sensing and production method thereof Apr. 1, 2014
8685777 Method for fabricating a fixed structure defining a volume receiving a movable element in particular of a MEMS Apr. 1, 2014
8685776 Wafer level packaged MEMS device Apr. 1, 2014
8679870 Method of manufacturing semiconductor element Mar. 25, 2014
8679886 Microelectronic device and MEMS package structure and fabricating method thereof Mar. 25, 2014
8673670 Micro-electro-mechanical system (MEMS) structures and design structures Mar. 18, 2014
8664951 MEMS gyroscope magnetic sensitivity reduction Mar. 4, 2014
8664029 Process for fabricating a capacitance type tri-axial accelerometer Mar. 4, 2014
8656776 Temperature-robust MEMS gyroscope with 2-DOF sense-mode addressing the tradeoff between bandwidth and gain Feb. 25, 2014
8658453 Capacitive micromachined ultrasonic transducer Feb. 25, 2014
8659098 Resonator and fabrication method thereof Feb. 25, 2014
8659099 Method for manufacturing a micromechanical structure, and micromechanical structure Feb. 25, 2014
8659167 Sensor packaging method and sensor packages Feb. 25, 2014
8648430 Microelectromechanical system having movable element integrated into substrate-based package Feb. 11, 2014
8647908 Semiconductor pressure sensor and method of manufacturing semiconductor pressure sensor Feb. 11, 2014
8643129 MEMS device Feb. 4, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8643128 Micro-electro-mechanical-system sensor and method for making same Feb. 4, 2014
8643127 Sensor device packaging Feb. 4, 2014
8643125 Structure and process for microelectromechanical system-based sensor Feb. 4, 2014
8642986 Integrated circuit having microelectromechanical system device and method of fabricating the same Feb. 4, 2014
8642370 Cavity open process to improve undercut Feb. 4, 2014
8637383 Strain relaxation using metal materials and related structures Jan. 28, 2014
8637943 Multi-axis integrated MEMS devices with CMOS circuits and method therefor Jan. 28, 2014
8633048 Method for fabricating package structure having MEMS elements Jan. 21, 2014
8627720 Acceleration sensor Jan. 14, 2014
8624337 Resonant body transistor and oscillator Jan. 7, 2014
8614110 Method for fabricating a dual-crystalline silicon suspension system using pre-fabricated cavities Dec. 24, 2013
8614492 Nanowire stress sensors, stress sensor integrated circuits, and design structures for a stress sensor integrated circuit Dec. 24, 2013
8610223 Embedded microelectromechanical systems sensor and related devices and methods Dec. 17, 2013
8610997 Micro-electromechanical device Dec. 17, 2013
8605920 Condenser microphone having flexure hinge diaphragm and method of manufacturing the same Dec. 10, 2013
8604564 Semiconductor structures and methods of manufacturing the same Dec. 10, 2013
8603848 Three-dimensional MEMS structure and method of manufacturing the same Dec. 10, 2013
8592876 Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures Nov. 26, 2013
8580596 Front end micro cavity Nov. 12, 2013
8580597 Making of a microelectronic device including a monocrystalline silicon NEMS component and a transistor the gate of which is made in the same layer as the mobile structure of this component Nov. 12, 2013
8581357 Package comprising an electrical circuit Nov. 12, 2013
8569089 Nano-devices formed with suspended graphene membrane Oct. 29, 2013
8569091 Integrated circuit switches, design structure and methods of fabricating the same Oct. 29, 2013
8564026 Chip, method for producing a chip and device for laser ablation Oct. 22, 2013
8563345 Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements Oct. 22, 2013
8563344 Method for producing MEMS structures, and MEMS structure Oct. 22, 2013
8563336 Method for forming thin film resistor and terminal bond pad simultaneously Oct. 22, 2013
8557698 Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops Oct. 15, 2013
8558555 Test method of microstructure body and micromachine Oct. 15, 2013

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