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Class Information
Number: 438/465
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having a perfecting coating
Description: Process including a step of coating the semiconductor substrate with a coating which enhances the dicing operation.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8679870 Method of manufacturing semiconductor element Mar. 25, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8658515 Method of manufacturing film for semiconductor device Feb. 25, 2014
8658908 Multiple patterning wiring board, wiring board and electronic apparatus Feb. 25, 2014
8643177 Wafers including patterned back side layers thereon Feb. 4, 2014
8642446 Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer Feb. 4, 2014
8643147 Seal ring structure with improved cracking protection and reduced problems Feb. 4, 2014
8624348 Chips with high fracture toughness through a metal ring Jan. 7, 2014
8614139 Dicing film with protecting film Dec. 24, 2013
8609515 Dicing die bonding film, semiconductor wafer, and semiconductor device Dec. 17, 2013
8598015 Laser processing method Dec. 3, 2013
8580657 Protecting sidewalls of semiconductor chips using insulation films Nov. 12, 2013
8569108 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die Oct. 29, 2013
8569877 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Oct. 29, 2013
8563339 System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices Oct. 22, 2013
8551817 Semiconductor substrate cutting method Oct. 8, 2013
8519511 Substrate dividing method Aug. 27, 2013
8518805 Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby Aug. 27, 2013
8518801 Substrate dividing method Aug. 27, 2013
8476109 Semiconductor workpiece carriers and methods for processing semiconductor workpieces Jul. 2, 2013
8461024 Methods and apparatus for thinning, testing and singulating a semiconductor wafer Jun. 11, 2013
8461025 Protective film forming method and apparatus Jun. 11, 2013
8450187 Method of cutting semiconductor substrate May. 28, 2013
8450189 Film for flip chip type semiconductor back surface May. 28, 2013
8442362 Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system May. 14, 2013
8440545 Method of manufacturing semiconductor device with spraying fluid May. 14, 2013
8435869 Method for manufacturing semiconductor device May. 7, 2013
8420509 Film for flip chip type semiconductor back surface Apr. 16, 2013
8420510 Method of manufacturing semiconductor device Apr. 16, 2013
8389380 Method for making a substrate of the semiconductor on insulator type with an integrated ground plane Mar. 5, 2013
8383436 Manufacturing method for semiconductor chips, and semiconductor chip Feb. 26, 2013
8361883 Laser processing method Jan. 29, 2013
8357567 Manufacturing method of semiconductor device Jan. 22, 2013
8314013 Semiconductor chip manufacturing method Nov. 20, 2012
8309434 Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon Nov. 13, 2012
8310032 Wafer and method of manufacturing semiconductor device Nov. 13, 2012
8309403 Method for encapsulating electronic components on a wafer Nov. 13, 2012
8304325 Substrate dividing method Nov. 6, 2012
8298919 Manufacturing method of semiconductor device and semiconductor device Oct. 30, 2012
8298864 Manufacturing method for semiconductor device Oct. 30, 2012
8299581 Passivation layer extension to chip edge Oct. 30, 2012
8288842 Method for dicing semiconductor wafers Oct. 16, 2012
8278186 Wafer cleaning method and wafer bonding method using the same Oct. 2, 2012
8268704 Method for dicing substrate Sep. 18, 2012
8252665 Protection layer for adhesive material at wafer edge Aug. 28, 2012
8222083 Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same Jul. 17, 2012
8198175 Processing method for package substrate Jun. 12, 2012
8173522 Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer May. 8, 2012
8168458 Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices May. 1, 2012

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