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Class Information
Number: 438/465
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having a perfecting coating
Description: Process including a step of coating the semiconductor substrate with a coating which enhances the dicing operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7556985 |
Method of fabricating semiconductor device |
Jul. 7, 2009 |
| 7531431 |
Methods for reducing contamination of semiconductor devices and materials during wafer processing |
May. 12, 2009 |
| 7521336 |
Crack stop for low K dielectrics |
Apr. 21, 2009 |
| 7521384 |
Method and apparatus for peeling surface protective film |
Apr. 21, 2009 |
| 7517726 |
Wire bonded chip scale package fabrication methods |
Apr. 14, 2009 |
| 7510950 |
Method for manufacturing semiconductor device |
Mar. 31, 2009 |
| 7510909 |
Fabricating method of wafer protection layers |
Mar. 31, 2009 |
| 7510908 |
Method to dispense light blocking material for wafer level CSP |
Mar. 31, 2009 |
| 7504318 |
Nanopowder coating for scribing and structures formed thereby |
Mar. 17, 2009 |
| 7495315 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Feb. 24, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7482250 |
Method for cutting printed circuit board |
Jan. 27, 2009 |
| 7482251 |
Etch before grind for semiconductor die singulation |
Jan. 27, 2009 |
| 7462504 |
Surface-emitting type light-emitting diode and fabrication method thereof |
Dec. 9, 2008 |
| 7449406 |
Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
Nov. 11, 2008 |
| 7413927 |
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
Aug. 19, 2008 |
| 7413931 |
Semiconductor device manufacturing method |
Aug. 19, 2008 |
| 7399682 |
Wafer processing method |
Jul. 15, 2008 |
| 7399683 |
Manufacturing method of semiconductor device |
Jul. 15, 2008 |
| 7371663 |
Three dimensional IC device and alignment methods of IC device substrates |
May. 13, 2008 |
| 7371664 |
Process for wafer thinning |
May. 13, 2008 |
| 7368380 |
Method of manufacturing semiconductor device |
May. 6, 2008 |
| 7361575 |
Semiconductor device and method for manufacturing the same |
Apr. 22, 2008 |
| 7350446 |
Wafer dividing apparatus |
Apr. 1, 2008 |
| 7351645 |
Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip |
Apr. 1, 2008 |
| 7335605 |
Protective tape applying and separating method |
Feb. 26, 2008 |
| 7335577 |
Crack stop for low K dielectrics |
Feb. 26, 2008 |
| 7288467 |
Wafer processing method |
Oct. 30, 2007 |
| 7273768 |
Wafer-level package and IC module assembly method for the wafer-level package |
Sep. 25, 2007 |
| 7265032 |
Protective layer during scribing |
Sep. 4, 2007 |
| 7256101 |
Methods for preparing a semiconductor assembly |
Aug. 14, 2007 |
| 7250352 |
Methods for manufacturing a hybrid integrated circuit device |
Jul. 31, 2007 |
| 7244665 |
Wafer edge ring structures and methods of formation |
Jul. 17, 2007 |
| 7244664 |
Method for dicing and singulating substrates |
Jul. 17, 2007 |
| 7232770 |
High temperature and chemical resistant process for wafer thinning and backside processing |
Jun. 19, 2007 |
| 7226812 |
Wafer support and release in wafer processing |
Jun. 5, 2007 |
| 7217638 |
Wafer back surface treating method and dicing sheet adhering apparatus |
May. 15, 2007 |
| 7217992 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 15, 2007 |
| 7198969 |
Semiconductor chip assemblies, methods of making same and components for same |
Apr. 3, 2007 |
| 7192848 |
Method for manufacturing mesa semiconductor device |
Mar. 20, 2007 |
| 7169648 |
Process for producing a semiconductor device |
Jan. 30, 2007 |
| 7157353 |
Method for fabricating encapsulated semiconductor components |
Jan. 2, 2007 |
| 7141443 |
Semiconductor wafer dividing method utilizing laser beam |
Nov. 28, 2006 |
| 7129110 |
Semiconductor device and method for manufacturing the same |
Oct. 31, 2006 |
| 7115443 |
Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
Oct. 3, 2006 |
| 7101735 |
Manufacturing method of semiconductor device |
Sep. 5, 2006 |
| 7091624 |
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same |
Aug. 15, 2006 |
| 7064010 |
Methods of coating and singulating wafers |
Jun. 20, 2006 |
| 7060531 |
Method of cutting semiconductor wafer and protective sheet used in the cutting method |
Jun. 13, 2006 |
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