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Class Information
Number: 438/464
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > With attachment to temporary support or carrier
Description: Process including a step of attaching the semiconductor substrate to a temporary holder to facilitate the handling of the substrate.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710683 Method of forming wafer level mold using glass fiber and wafer structure formed by the same Apr. 29, 2014
8710458 UV exposure method for reducing residue in de-taping process Apr. 29, 2014
8703583 Fabrication method of semiconductor device Apr. 22, 2014
8703584 Dicing tape-integrated film for semiconductor back surface Apr. 22, 2014
8703585 Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device Apr. 22, 2014
8691702 Method and apparatus for plasma dicing a semi-conductor wafer Apr. 8, 2014
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8658436 Method for separating and transferring IC chips Feb. 25, 2014
8658515 Method of manufacturing film for semiconductor device Feb. 25, 2014
8652942 Method for manufacturing electronic parts Feb. 18, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8647901 Method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate Feb. 11, 2014
8642445 Method and apparatus for reducing package warpage Feb. 4, 2014
8643177 Wafers including patterned back side layers thereon Feb. 4, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8633086 Power devices having reduced on-resistance and methods of their manufacture Jan. 21, 2014
8628998 Annealing methods for backside illumination image sensor chips Jan. 14, 2014
8629043 Methods for de-bonding carriers Jan. 14, 2014
8623744 Die singulation method Jan. 7, 2014
8618621 Semiconductor device layer structure and method of fabrication Dec. 31, 2013
8614139 Dicing film with protecting film Dec. 24, 2013
8609513 Method for manufacturing semiconductor device Dec. 17, 2013
8609514 Process for the transfer of a thin film comprising an inclusion creation step Dec. 17, 2013
8603351 Working method for cutting Dec. 10, 2013
8587130 Die-sorting sheet and method for transporting chips having adhesive layer Nov. 19, 2013
8586415 Dicing/die-bonding film, method of fixing chipped work and semiconductor device Nov. 19, 2013
8580615 Method and system for wafer level singulation Nov. 12, 2013
8573469 Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer Nov. 5, 2013
8563405 Method for manufacturing semiconductor device Oct. 22, 2013
8563402 Method and structure for fabricating solar cells using a thick layer transfer process Oct. 22, 2013
8563361 Packaging method of molded wafer level chip scale package (WLCSP) Oct. 22, 2013
8561664 Die bonder, pickup method, and pickup device Oct. 22, 2013
8557637 Method for fabricating the flexible electronic device Oct. 15, 2013
8558371 Method for wafer level package and semiconductor device fabricated using the same Oct. 15, 2013
8541289 Dicing die bonding film and dicing method Sep. 24, 2013
8541290 Optoelectronic substrate and methods of making same Sep. 24, 2013
8541291 Thermo-compression bonded electrical interconnect structure and method Sep. 24, 2013
8536445 Inverted metamorphic multijunction solar cells Sep. 17, 2013
8536023 Method of manufacturing a semiconductor device and structure Sep. 17, 2013
8524577 Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure Sep. 3, 2013
8518807 Radiation hardened SOI structure and method of making same Aug. 27, 2013
8513095 Method and system for separating photovoltaic strips Aug. 20, 2013
8513097 Plasma processing apparatus Aug. 20, 2013
8513098 Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure Aug. 20, 2013
8507367 Separation of semiconductor devices Aug. 13, 2013
8497189 Processing method for wafer Jul. 30, 2013
8486806 Method for machining wafers by cutting partway through a peripheral surplus region to form break starting points Jul. 16, 2013
8481357 Thin film solar cell with ceramic handling layer Jul. 9, 2013

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