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Class Information
Number: 438/464
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > With attachment to temporary support or carrier
Description: Process including a step of attaching the semiconductor substrate to a temporary holder to facilitate the handling of the substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618875 |
Marking method for product information |
Nov. 17, 2009 |
| 7615392 |
Light emitting diode and method of making the same |
Nov. 10, 2009 |
| 7608523 |
Wafer processing method and adhesive tape used in the wafer processing method |
Oct. 27, 2009 |
| 7605058 |
Wafer dividing method |
Oct. 20, 2009 |
| 7605057 |
Semiconductor device and manufacturing method thereof |
Oct. 20, 2009 |
| 7605051 |
Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same |
Oct. 20, 2009 |
| 7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
Oct. 13, 2009 |
| 7598154 |
Manufacturing method of semiconductor device |
Oct. 6, 2009 |
| 7598157 |
Wafer dicing method |
Oct. 6, 2009 |
| 7598156 |
Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension |
Oct. 6, 2009 |
| 7598103 |
Liquid crystal display panel with different substrate materials and method of making the liquid crystal display panel |
Oct. 6, 2009 |
| 7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips |
Sep. 22, 2009 |
| 7588969 |
Method for manufacturing semiconductor device, and semiconductor device |
Sep. 15, 2009 |
| 7582542 |
Die attaching method |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7569421 |
Through-hole via on saw streets |
Aug. 4, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7569118 |
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method |
Aug. 4, 2009 |
| 7566640 |
Method for manufacturing thin film integrated circuit device, noncontact thin film integrated circuit device and method for manufacturing the same, and idtag and coin including the noncontact |
Jul. 28, 2009 |
| 7566638 |
Method of dicing a semiconductor device into plural chips |
Jul. 28, 2009 |
| 7563642 |
Manufacturing method of a semiconductor device |
Jul. 21, 2009 |
| 7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit fo |
Jul. 7, 2009 |
| 7557904 |
Wafer holding mechanism |
Jul. 7, 2009 |
| 7553745 |
Integrated circuit package, panel and methods of manufacturing the same |
Jun. 30, 2009 |
| 7550367 |
Method for separating semiconductor substrate |
Jun. 23, 2009 |
| 7534700 |
Method of fabricating a semiconductor device having a film in contact with a debonded layer |
May. 19, 2009 |
| 7534702 |
Method for manufacturing a semiconductor device |
May. 19, 2009 |
| 7534703 |
Method for bonding semiconductor chip |
May. 19, 2009 |
| 7531431 |
Methods for reducing contamination of semiconductor devices and materials during wafer processing |
May. 12, 2009 |
| 7531432 |
Block-molded semiconductor device singulation methods and systems |
May. 12, 2009 |
| 7531739 |
Build-in-place method of manufacturing thermoelectric modules |
May. 12, 2009 |
| 7524737 |
Method of fabricating a semiconductor chip with a nitride compound semiconductor material |
Apr. 28, 2009 |
| 7521339 |
GaN single crystal substrate and method of making the same |
Apr. 21, 2009 |
| 7521338 |
Method for sawing semiconductor wafer |
Apr. 21, 2009 |
| 7517423 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Apr. 14, 2009 |
| 7517725 |
System and method for separating and packaging integrated circuits |
Apr. 14, 2009 |
| 7514286 |
Method for forming individual semi-conductor devices |
Apr. 7, 2009 |
| 7510950 |
Method for manufacturing semiconductor device |
Mar. 31, 2009 |
| 7507639 |
Wafer dividing method |
Mar. 24, 2009 |
| 7508052 |
Crack protection for silicon die |
Mar. 24, 2009 |
| 7504317 |
Manufacturing method of semiconductor device |
Mar. 17, 2009 |
| 7504319 |
Apparatus and method of wafer dicing |
Mar. 17, 2009 |
| 7504320 |
Method for manufacturing a tag integrated circuit flexible board |
Mar. 17, 2009 |
| 7501300 |
Manufacturing method of semiconductor integrated circuit device |
Mar. 10, 2009 |
| 7497920 |
Method of manufacturing semiconductor device |
Mar. 3, 2009 |
| 7498202 |
Method for die attaching |
Mar. 3, 2009 |
| 7498239 |
Wafer processing method |
Mar. 3, 2009 |
| 7498240 |
Microfeature workpieces, carriers, and associated methods |
Mar. 3, 2009 |
| 7498241 |
Semiconductor manufacturing method of die pick-up from wafer |
Mar. 3, 2009 |
| 7494896 |
Method of forming magnetic random access memory (MRAM) devices on thermally-sensitive substrates using laser transfer |
Feb. 24, 2009 |
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