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Class Information
Number: 438/463
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > By electromagnetic irradiation (e.g., electron, laser, etc.)
Description: Process utilizing electromagnetic radiation for dividing the semiconductor substrate into plural distinct bodies.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618878 |
Wafer dividing method |
Nov. 17, 2009 |
| 7615499 |
Method for oxidizing a layer, and associated holding devices for a substrate |
Nov. 10, 2009 |
| 7615721 |
Laser processing method and laser processing apparatus |
Nov. 10, 2009 |
| 7611968 |
Wafer laser processing method and laser beam processing machine |
Nov. 3, 2009 |
| 7605057 |
Semiconductor device and manufacturing method thereof |
Oct. 20, 2009 |
| 7605344 |
Laser beam machining method, laser beam machining apparatus, and laser beam machining product |
Oct. 20, 2009 |
| 7601616 |
Wafer laser processing method |
Oct. 13, 2009 |
| 7598120 |
Method for holding semiconductor wafer |
Oct. 6, 2009 |
| 7592237 |
Laser processing method and object to be processed |
Sep. 22, 2009 |
| 7592238 |
Laser processing method and laser processing apparatus |
Sep. 22, 2009 |
| 7585751 |
Wafer dividing method using laser beam with an annular spot |
Sep. 8, 2009 |
| 7582541 |
Wafer laser processing method |
Sep. 1, 2009 |
| 7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7569840 |
Alignment method of a laser beam processing machine |
Aug. 4, 2009 |
| 7566638 |
Method of dicing a semiconductor device into plural chips |
Jul. 28, 2009 |
| 7566639 |
Manufacturing method for nitride semiconductor device and nitride semiconductor light emitting device obtained with the same |
Jul. 28, 2009 |
| 7563732 |
Method and apparatus for forming polycrystalline layer using laser crystallization |
Jul. 21, 2009 |
| 7563695 |
Method and system for high-speed precise laser trimming and scan lens for use therein |
Jul. 21, 2009 |
| 7560362 |
Cutting method for substrate |
Jul. 14, 2009 |
| 7549560 |
Wafer dividing method |
Jun. 23, 2009 |
| 7550367 |
Method for separating semiconductor substrate |
Jun. 23, 2009 |
| 7547613 |
Laser processing method and laser processing apparatus |
Jun. 16, 2009 |
| 7544590 |
Wafer laser processing method |
Jun. 9, 2009 |
| 7544589 |
Wafer dividing method |
Jun. 9, 2009 |
| 7544588 |
Laser processing method for wafer |
Jun. 9, 2009 |
| 7528055 |
Method of producing a nitride semiconductor device and nitride semiconductor device |
May. 5, 2009 |
| 7521337 |
Wafer laser processing method |
Apr. 21, 2009 |
| 7517423 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Apr. 14, 2009 |
| 7510950 |
Method for manufacturing semiconductor device |
Mar. 31, 2009 |
| 7507639 |
Wafer dividing method |
Mar. 24, 2009 |
| 7498238 |
Chip and method for dicing wafer into chips |
Mar. 3, 2009 |
| 7491288 |
Method of cutting laminate with laser and laminate |
Feb. 17, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7482604 |
Electron beam lithography apparatus, lithography method, lithography program, and manufacturing method of a semiconductor device |
Jan. 27, 2009 |
| 7473866 |
Laser processing apparatus |
Jan. 6, 2009 |
| 7469831 |
Laser-based method and system for processing targeted surface material and article produced thereby |
Dec. 30, 2008 |
| 7470602 |
Crystalline film and its manufacture method using laser |
Dec. 30, 2008 |
| 7468310 |
Method of machining substrate and method of manufacturing element |
Dec. 23, 2008 |
| 7459378 |
Wafer dividing method |
Dec. 2, 2008 |
| 7456082 |
Method for producing silicon single crystal and silicon single crystal |
Nov. 25, 2008 |
| 7449396 |
Wafer dividing method |
Nov. 11, 2008 |
| 7446022 |
Wafer laser processing method |
Nov. 4, 2008 |
| 7442625 |
Apparatus for annealing, method for annealing, and method for manufacturing a semiconductor device |
Oct. 28, 2008 |
| 7435607 |
Method of wafer laser processing using a gas permeable protective tape |
Oct. 14, 2008 |
| 7410831 |
Method and device for dividing plate-like member |
Aug. 12, 2008 |
| 7407861 |
Method and system for high-speed, precise micromachining an array of devices |
Aug. 5, 2008 |
| 7405376 |
Processing apparatus using laser beam |
Jul. 29, 2008 |
| 7399682 |
Wafer processing method |
Jul. 15, 2008 |
| 7396742 |
Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object |
Jul. 8, 2008 |
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