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Class Information
Number: 438/463
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > By electromagnetic irradiation (e.g., electron, laser, etc.)
Description: Process utilizing electromagnetic radiation for dividing the semiconductor substrate into plural distinct bodies.










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8709916 Laser processing method and apparatus Apr. 29, 2014
8710458 UV exposure method for reducing residue in de-taping process Apr. 29, 2014
8709904 Method for producing semiconductor substrate, semiconductor substrate, method for manufacturing electronic device, and reaction apparatus Apr. 29, 2014
8703581 Water soluble mask for substrate dicing by laser and plasma etch Apr. 22, 2014
8703582 Laser processing method Apr. 22, 2014
8691702 Method and apparatus for plasma dicing a semi-conductor wafer Apr. 8, 2014
8685839 Workpiece dividing method Apr. 1, 2014
8685838 Laser beam machining method Apr. 1, 2014
8685860 Semiconductor structure and manufacturing method thereof Apr. 1, 2014
8679948 Method and apparatus for laser singulation of brittle materials Mar. 25, 2014
8673742 Method for manufacturing semiconductor device Mar. 18, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673745 Method of cutting object to be processed Mar. 18, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8652941 Wafer dicing employing edge region underfill removal Feb. 18, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8642448 Wafer dicing using femtosecond-based laser and plasma etch Feb. 4, 2014
8637382 Layer transfer of films utilizing thermal flux regime for energy controlled cleaving Jan. 28, 2014
8624157 Ultrashort laser pulse wafer scribing Jan. 7, 2014
8624153 Laser processing method and device Jan. 7, 2014
8617964 Laser processing method Dec. 31, 2013
8609464 Method for shielding semiconductor device Dec. 17, 2013
8609512 Method for laser singulation of chip scale packages on glass substrates Dec. 17, 2013
8610030 Laser beam processing machine Dec. 17, 2013
8604584 Semiconductor device and method of manufacturing semiconductor device Dec. 10, 2013
8604383 Laser processing method Dec. 10, 2013
8603351 Working method for cutting Dec. 10, 2013
8598490 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes Dec. 3, 2013
8598015 Laser processing method Dec. 3, 2013
8598014 Method for producing a semiconductor element Dec. 3, 2013
8597963 Manufacture of light emitting devices with phosphor wavelength conversion Dec. 3, 2013
8592717 Method of dividing a workpiece having an uneven surface Nov. 26, 2013
8581263 Laser-induced flaw formation in nitride semiconductors Nov. 12, 2013
8557684 Three-dimensional integrated circuit (3DIC) formation process Oct. 15, 2013
8552498 Semiconductor device and method for manufacturing the same Oct. 8, 2013
8551865 Method of cutting an object to be processed Oct. 8, 2013
8551864 Method of manufacturing semiconductor device Oct. 8, 2013
8551792 Dicing a semiconductor wafer Oct. 8, 2013
8541251 Method for manufacturing light-emitting device Sep. 24, 2013
8536024 Processing method for a workpiece, dividing method for a workpiece, and laser processing apparatus Sep. 17, 2013
8536025 Resized wafer with a negative photoresist ring and design structures thereof Sep. 17, 2013
8519511 Substrate dividing method Aug. 27, 2013
8518804 Semiconductor device manufacturing method and manufacturing apparatus Aug. 27, 2013
8518803 Laser processing method for semiconductor wafer Aug. 27, 2013
8518801 Substrate dividing method Aug. 27, 2013
8518800 Substrate dividing method Aug. 27, 2013
8518730 Sapphire wafer dividing method Aug. 27, 2013
8513095 Method and system for separating photovoltaic strips Aug. 20, 2013
8513097 Plasma processing apparatus Aug. 20, 2013
8513777 Method and apparatus for generating reticle data Aug. 20, 2013

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