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Class Information
Number: 438/462
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)
Description: Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.

Patents under this class:

Patent Number Title Of Patent Date Issued
7781310 Semiconductor die singulation method Aug. 24, 2010
7781299 Leadframe semiconductor package stand and method for making the same Aug. 24, 2010
7777304 Semiconductor device Aug. 17, 2010
7776655 Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Aug. 17, 2010
7776649 Method for fabricating wafer level chip scale packages Aug. 17, 2010
7776647 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors Aug. 17, 2010
7776495 Semiconductor device and manufacturing method thereof Aug. 17, 2010
7772710 Zero-order overlay targets Aug. 10, 2010
7772091 Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions Aug. 10, 2010
7772090 Methods for laser scribing wafers Aug. 10, 2010
7767595 Manufacturing method of semiconductor device Aug. 3, 2010
7767554 Method of manufacturing semicondictor chip Aug. 3, 2010
7767553 Method and apparatus for printing conductive ink Aug. 3, 2010
7767551 Method for fabricating semiconductor chip Aug. 3, 2010
7759808 Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device Jul. 20, 2010
7759223 Semiconductor wafer and manufacturing process for semiconductor device Jul. 20, 2010
7759222 Solid-state imaging device and method for fabricating the same Jul. 20, 2010
7755207 Wafer, reticle, and exposure method using the wafer and reticle Jul. 13, 2010
7754584 Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device Jul. 13, 2010
7754534 Semiconductor device and manufacturing method thereof Jul. 13, 2010
7754511 Laser lift-off method Jul. 13, 2010
7749867 Method of cutting processed object Jul. 6, 2010
7745301 Methods and apparatus for high-density chip connectivity Jun. 29, 2010
7741701 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment Jun. 22, 2010
7741652 Alignment device and application thereof Jun. 22, 2010
7741196 Semiconductor wafer with improved crack protection Jun. 22, 2010
7741195 Method of stimulating die circuitry and structure therefor Jun. 22, 2010
7741137 Method of manufacturing electro-optical device Jun. 22, 2010
7737002 Wafer dividing method Jun. 15, 2010
7737001 Semiconductor manufacturing method Jun. 15, 2010
7736944 Semiconductor device with improved design freedom of external terminal Jun. 15, 2010
7727861 Method and device for contacting semiconductor chips Jun. 1, 2010
7727852 Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate Jun. 1, 2010
7723213 Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips May. 25, 2010
7723211 Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer May. 25, 2010
7718512 Integrated circuit wafer with inter-die metal interconnect lines traversing scribe-line boundaries May. 18, 2010
7718504 Semiconductor device having align key and method of fabricating the same May. 18, 2010
7713845 Laser processing method for wafer May. 11, 2010
7713844 Nitride semiconductor substrate, and method for working nitride semiconductor substrate May. 11, 2010
7709823 Group-III nitride vertical-rods substrate May. 4, 2010
7709355 Method of producing electronic component comprising electrodes and ring residues May. 4, 2010
7704857 Method of manufacturing semiconductor device Apr. 27, 2010
7704796 Semiconductor device and method of forming recessed conductive vias in saw streets Apr. 27, 2010
7700383 Manufacturing method for semiconductor device and determination method for position of semiconductor element Apr. 20, 2010
7696607 Semiconductor device Apr. 13, 2010
7696069 Wafer dividing method Apr. 13, 2010
7696067 Method of manufacturing device Apr. 13, 2010
7696066 Method of fabricating intergrated circuit chip Apr. 13, 2010
7696014 Method for breaking adhesive film mounted on back of wafer Apr. 13, 2010
7691726 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components Apr. 6, 2010

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