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Class Information
Number: 438/462
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)
Description: Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7618878 |
Wafer dividing method |
Nov. 17, 2009 |
| 7618877 |
Semiconductor wafer, method of manufacturing the same, and method of manufacturing a semiconductor device |
Nov. 17, 2009 |
| 7618875 |
Marking method for product information |
Nov. 17, 2009 |
| 7618846 |
Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device |
Nov. 17, 2009 |
| 7615469 |
Edge seal for a semiconductor device and method therefor |
Nov. 10, 2009 |
| 7615391 |
Solar cell and method of fabricating the same |
Nov. 10, 2009 |
| 7612419 |
Wafer, semiconductor chip, and semiconductor device |
Nov. 3, 2009 |
| 7611967 |
Wafer sawing method |
Nov. 3, 2009 |
| 7608525 |
Method for manufacturing nitride semiconductor substrate |
Oct. 27, 2009 |
| 7608523 |
Wafer processing method and adhesive tape used in the wafer processing method |
Oct. 27, 2009 |
| 7608468 |
Apparatus and methods for determining overlay and uses of same |
Oct. 27, 2009 |
| 7605057 |
Semiconductor device and manufacturing method thereof |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7605016 |
CMOS image sensor and method of manufacturing the same |
Oct. 20, 2009 |
| 7602072 |
Substrate having alignment marks and method of obtaining alignment information using the same |
Oct. 13, 2009 |
| 7601616 |
Wafer laser processing method |
Oct. 13, 2009 |
| 7601605 |
Method for manufacturing semiconductor device, method for forming alignment mark, and semiconductor device |
Oct. 13, 2009 |
| 7598157 |
Wafer dicing method |
Oct. 6, 2009 |
| 7598156 |
Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension |
Oct. 6, 2009 |
| 7598155 |
Method of manufacturing an overlay mark |
Oct. 6, 2009 |
| 7598154 |
Manufacturing method of semiconductor device |
Oct. 6, 2009 |
| 7595258 |
Overlay vernier of semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7592636 |
Radiation-emitting semiconductor component and method for the production thereof |
Sep. 22, 2009 |
| 7592237 |
Laser processing method and object to be processed |
Sep. 22, 2009 |
| 7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips |
Sep. 22, 2009 |
| 7588993 |
Alignment for backside illumination sensor |
Sep. 15, 2009 |
| 7585751 |
Wafer dividing method using laser beam with an annular spot |
Sep. 8, 2009 |
| 7585750 |
Semiconductor package having through-hole via on saw streets formed with partial saw |
Sep. 8, 2009 |
| 7583834 |
Laser etched fiducials in roll-roll display |
Sep. 1, 2009 |
| 7582899 |
Semiconductor device having overlay measurement mark and method of fabricating the same |
Sep. 1, 2009 |
| 7582546 |
Device with damaged breakdown layer |
Sep. 1, 2009 |
| 7582541 |
Wafer laser processing method |
Sep. 1, 2009 |
| 7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7575954 |
Ceramic substrate and method of breaking same |
Aug. 18, 2009 |
| 7572350 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Aug. 11, 2009 |
| 7569840 |
Alignment method of a laser beam processing machine |
Aug. 4, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7569421 |
Through-hole via on saw streets |
Aug. 4, 2009 |
| 7566638 |
Method of dicing a semiconductor device into plural chips |
Jul. 28, 2009 |
| 7566637 |
Method of inhibition of metal diffusion arising from laser dicing |
Jul. 28, 2009 |
| 7566636 |
Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
Jul. 28, 2009 |
| 7566635 |
Substrate dividing method |
Jul. 28, 2009 |
| 7566634 |
Method for chip singulation |
Jul. 28, 2009 |
| 7563694 |
Scribe based bond pads for integrated circuits |
Jul. 21, 2009 |
| 7560801 |
Rewiring substrate strip with several semiconductor component positions |
Jul. 14, 2009 |
| 7560787 |
Trench field plate termination for power devices |
Jul. 14, 2009 |
| 7560362 |
Cutting method for substrate |
Jul. 14, 2009 |
| 7557017 |
Method of manufacturing semiconductor device with two-step etching of layer |
Jul. 7, 2009 |
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