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Class Information
Number: 438/462
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)
Description: Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.










Patents under this class:

Patent Number Title Of Patent Date Issued
7830020 Integrated circuit package system employing device stacking Nov. 9, 2010
7829440 Method of separating semiconductor dies Nov. 9, 2010
7829439 Laser beam processing method for making a semiconductor device Nov. 9, 2010
7829438 Edge connect wafer level stacking Nov. 9, 2010
7829360 Vertical indent production repair Nov. 9, 2010
7825008 Method of fabricating light emitting device and thus-fabricated light emitting device Nov. 2, 2010
7825000 Method for integration of magnetic random access memories with improved lithographic alignment to magnetic tunnel junctions Nov. 2, 2010
7821142 Intermediate semiconductor device structures Oct. 26, 2010
7820486 Method of fabricating a semiconductor device having a heat sink with an exposed surface Oct. 26, 2010
7820484 Wafer level packaging Oct. 26, 2010
7820468 Stack type surface acoustic wave package, and method for manufacturing the same Oct. 26, 2010
7816184 Micromachine device processing method Oct. 19, 2010
7807552 Method of inspecting defect of semiconductor device Oct. 5, 2010
7807544 Solar cell fabrication using extrusion mask Oct. 5, 2010
7807479 Method and apparatus for improving force control in wafer scribing Oct. 5, 2010
7803696 Wafer dividing method Sep. 28, 2010
7795132 Self-aligned cross-point memory fabrication Sep. 14, 2010
7790577 Crackstop structures and methods of making same Sep. 7, 2010
7790576 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Sep. 7, 2010
7790506 Method of manufacturing semiconductor devices encapsulated in chip size packages Sep. 7, 2010
7786607 Overlay correction by reducing wafer slipping after alignment Aug. 31, 2010
7786551 Integrated circuit system with wafer trimming Aug. 31, 2010
7785990 Semiconductor device and method of fabricating the same Aug. 31, 2010
7785980 Method of manufacturing semiconductor device using alignment mark and mark hole Aug. 31, 2010
7781901 Semiconductor device and processing method of the same Aug. 24, 2010
7781310 Semiconductor die singulation method Aug. 24, 2010
7781299 Leadframe semiconductor package stand and method for making the same Aug. 24, 2010
7777304 Semiconductor device Aug. 17, 2010
7776655 Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Aug. 17, 2010
7776649 Method for fabricating wafer level chip scale packages Aug. 17, 2010
7776647 Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors Aug. 17, 2010
7776495 Semiconductor device and manufacturing method thereof Aug. 17, 2010
7772710 Zero-order overlay targets Aug. 10, 2010
7772091 Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions Aug. 10, 2010
7772090 Methods for laser scribing wafers Aug. 10, 2010
7767595 Manufacturing method of semiconductor device Aug. 3, 2010
7767554 Method of manufacturing semicondictor chip Aug. 3, 2010
7767553 Method and apparatus for printing conductive ink Aug. 3, 2010
7767551 Method for fabricating semiconductor chip Aug. 3, 2010
7759808 Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device Jul. 20, 2010
7759223 Semiconductor wafer and manufacturing process for semiconductor device Jul. 20, 2010
7759222 Solid-state imaging device and method for fabricating the same Jul. 20, 2010
7755207 Wafer, reticle, and exposure method using the wafer and reticle Jul. 13, 2010
7754584 Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device Jul. 13, 2010
7754534 Semiconductor device and manufacturing method thereof Jul. 13, 2010
7754511 Laser lift-off method Jul. 13, 2010
7749867 Method of cutting processed object Jul. 6, 2010
7745301 Methods and apparatus for high-density chip connectivity Jun. 29, 2010
7741701 Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment Jun. 22, 2010
7741652 Alignment device and application thereof Jun. 22, 2010











 
 
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