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Class Information
Number: 438/462
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)
Description: Process wherein the region of the semiconductor substrate delineating the separating boundary between adjacent die possesses a specified structure.










Patents under this class:

Patent Number Title Of Patent Date Issued
8712575 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder Apr. 29, 2014
8709909 Method for manufacturing a substrate for a display device Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8704336 Selective removal of on-die redistribution interconnects from scribe-lines Apr. 22, 2014
8703581 Water soluble mask for substrate dicing by laser and plasma etch Apr. 22, 2014
8692357 Semiconductor wafer and processing method therefor Apr. 8, 2014
8691602 Method for producing semiconductor light-emitting chip Apr. 8, 2014
8685838 Laser beam machining method Apr. 1, 2014
8677592 Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools Mar. 25, 2014
8673744 Wiring substrate, manufacturing method thereof, and semiconductor package Mar. 18, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673742 Method for manufacturing semiconductor device Mar. 18, 2014
8673741 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layer Mar. 18, 2014
8673662 Light-emitting diode cutting method and product thereof Mar. 18, 2014
8669166 Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon Mar. 11, 2014
8664090 Electronic component package fabrication method Mar. 4, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8664042 Method for fabrication of configurable systems Mar. 4, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8658908 Multiple patterning wiring board, wiring board and electronic apparatus Feb. 25, 2014
8658436 Method for separating and transferring IC chips Feb. 25, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8652941 Wafer dicing employing edge region underfill removal Feb. 18, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8643177 Wafers including patterned back side layers thereon Feb. 4, 2014
8642448 Wafer dicing using femtosecond-based laser and plasma etch Feb. 4, 2014
8642447 Semiconductor wafer and manufacturing method of semiconductor device Feb. 4, 2014
8642446 Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer Feb. 4, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8633091 Chip package and fabrication method thereof Jan. 21, 2014
8633086 Power devices having reduced on-resistance and methods of their manufacture Jan. 21, 2014
8633048 Method for fabricating package structure having MEMS elements Jan. 21, 2014
8628998 Annealing methods for backside illumination image sensor chips Jan. 14, 2014
8624351 Package structure and method for making the same Jan. 7, 2014
8624153 Laser processing method and device Jan. 7, 2014
8623700 Inter-chip communication Jan. 7, 2014
8617963 Integrated circuit wafer dicing method Dec. 31, 2013
8610238 Crack stop trenches Dec. 17, 2013
8603351 Working method for cutting Dec. 10, 2013
8598016 In-situ deposited mask layer for device singulation by laser scribing and plasma etch Dec. 3, 2013
8597967 Method and system for dicing substrates containing gallium and nitrogen material Dec. 3, 2013
8593001 Patterned semiconductor bases Nov. 26, 2013
8592950 Semiconductor device and method of forming through vias with reflowed conductive material Nov. 26, 2013
8592287 Overlay alignment mark and method of detecting overlay alignment error using the mark Nov. 26, 2013
8592252 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Nov. 26, 2013
8592107 Method and apparatus of providing overlay Nov. 26, 2013
8587089 Seal ring structure with polyimide layer adhesion Nov. 19, 2013
8580657 Protecting sidewalls of semiconductor chips using insulation films Nov. 12, 2013











 
 
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