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Class Information
Number: 438/461
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Beam lead formation
Description: Process for separating a semiconductor substrate into plural individual bodies wherein the resultant bodies possess electrical leads which extend beyond the edges of the body (i.e., cantilevered).
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605057 |
Semiconductor device and manufacturing method thereof |
Oct. 20, 2009 |
| 7588999 |
Method of forming a leaded molded array package |
Sep. 15, 2009 |
| 7569411 |
Metal MEMS devices and methods of making same |
Aug. 4, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7482251 |
Etch before grind for semiconductor die singulation |
Jan. 27, 2009 |
| 7482249 |
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer |
Jan. 27, 2009 |
| 7459377 |
Method for dividing substrate |
Dec. 2, 2008 |
| 7459376 |
Dissociated fabrication of packages and chips of integrated circuits |
Dec. 2, 2008 |
| 7416963 |
Manufacturing method of semiconductor device |
Aug. 26, 2008 |
| 7399683 |
Manufacturing method of semiconductor device |
Jul. 15, 2008 |
| 7371663 |
Three dimensional IC device and alignment methods of IC device substrates |
May. 13, 2008 |
| 7351641 |
Structure and method of forming capped chips |
Apr. 1, 2008 |
| 7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof |
Feb. 26, 2008 |
| 7316939 |
Semiconductor device manufacturing method and manufacturing apparatus |
Jan. 8, 2008 |
| 7285479 |
Semiconductor device and method for manufacturing multilayered substrate for semiconductor device |
Oct. 23, 2007 |
| 7256106 |
Method of dividing a substrate into a plurality of individual chip parts |
Aug. 14, 2007 |
| 7235463 |
Method for fabricating an electrical insulator |
Jun. 26, 2007 |
| 7232741 |
Wafer dividing method |
Jun. 19, 2007 |
| 7211471 |
Exposed lead QFP package fabricated through the use of a partial saw process |
May. 1, 2007 |
| 7198969 |
Semiconductor chip assemblies, methods of making same and components for same |
Apr. 3, 2007 |
| 7141443 |
Semiconductor wafer dividing method utilizing laser beam |
Nov. 28, 2006 |
| 7125744 |
High-frequency module and method for manufacturing the same |
Oct. 24, 2006 |
| 7118935 |
Bump style MEMS switch |
Oct. 10, 2006 |
| 7087501 |
Manufacture of probe unit having lead probes extending beyond edge of substrate |
Aug. 8, 2006 |
| 7087462 |
Method for forming leadless semiconductor packages |
Aug. 8, 2006 |
| 7071031 |
Three-dimensional integrated CMOS-MEMS device and process for making the same |
Jul. 4, 2006 |
| 6973722 |
Release height adjustment of stressy metal devices by annealing before and after release |
Dec. 13, 2005 |
| 6972243 |
Fabrication of semiconductor dies with micro-pins and structures produced therewith |
Dec. 6, 2005 |
| 6900110 |
Chip scale package with compliant leads |
May. 31, 2005 |
| 6897127 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
May. 24, 2005 |
| 6897571 |
Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
May. 24, 2005 |
| 6852608 |
Production method for semiconductor chip |
Feb. 8, 2005 |
| 6846696 |
Method for manufacturing solar battery |
Jan. 25, 2005 |
| 6844244 |
Dual sided lithographic substrate imaging |
Jan. 18, 2005 |
| 6835589 |
Three-dimensional integrated CMOS-MEMS device and process for making the same |
Dec. 28, 2004 |
| 6833312 |
Plate member separating apparatus and method |
Dec. 21, 2004 |
| 6821866 |
Method of identifying wafer cutting positions of different size partial wafers |
Nov. 23, 2004 |
| 6759311 |
Fan out of interconnect elements attached to semiconductor wafer |
Jul. 6, 2004 |
| 6750083 |
Method of masking microelectronic semiconductor chips with protective caps |
Jun. 15, 2004 |
| 6713368 |
Etching mask and magnetic head device |
Mar. 30, 2004 |
| 6699774 |
Wafer splitting method using cleavage |
Mar. 2, 2004 |
| 6690081 |
Compliant wafer-level packaging devices and methods of fabrication |
Feb. 10, 2004 |
| 6667193 |
Semiconductor device and a method of manufacturing the same |
Dec. 23, 2003 |
| 6661080 |
Structure for backside saw cavity protection |
Dec. 9, 2003 |
| 6649441 |
Method for fabricating a microcontact spring on a substrate |
Nov. 18, 2003 |
| 6635553 |
Microelectronic assemblies with multiple leads |
Oct. 21, 2003 |
| 6602762 |
System and method of laser sintering dies and dies sintered by laser sintering |
Aug. 5, 2003 |
| 6577013 |
Chip size semiconductor packages with stacked dies |
Jun. 10, 2003 |
| 6573156 |
Low defect method for die singulation and for structural support for handling thin film devices |
Jun. 3, 2003 |
| 6489183 |
Method of manufacturing a taped semiconductor device |
Dec. 3, 2002 |
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