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Class Information
Number: 438/461
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing > Beam lead formation
Description: Process for separating a semiconductor substrate into plural individual bodies wherein the resultant bodies possess electrical leads which extend beyond the edges of the body (i.e., cantilevered).










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8703598 Manufacturing method of lead frame substrate Apr. 22, 2014
8673745 Method of cutting object to be processed Mar. 18, 2014
8603351 Working method for cutting Dec. 10, 2013
8603861 Alpha shielding techniques and configurations Dec. 10, 2013
8575006 Process to form semiconductor packages with external leads Nov. 5, 2013
8551865 Method of cutting an object to be processed Oct. 8, 2013
8543324 Watercraft automation and aquatic effort data utilization Sep. 24, 2013
8518800 Substrate dividing method Aug. 27, 2013
8518801 Substrate dividing method Aug. 27, 2013
8513095 Method and system for separating photovoltaic strips Aug. 20, 2013
8515661 Watercraft automation and aquatic effort data utilization Aug. 20, 2013
8515660 Watercraft automation and aquatic effort data utilization Aug. 20, 2013
8513822 Thin overlay mark for imaging based metrology Aug. 20, 2013
8510028 Watercraft automation and aquatic effort data utilization Aug. 13, 2013
8502352 Semiconductor device with conductive vias between saw streets Aug. 6, 2013
8501541 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Aug. 6, 2013
8461021 Multiple seal ring structure Jun. 11, 2013
8450187 Method of cutting semiconductor substrate May. 28, 2013
8435867 Method of manufacturing semiconductor device and method of manufacturing electronic device May. 7, 2013
8426249 Chip part manufacturing method and chip parts Apr. 23, 2013
8389380 Method for making a substrate of the semiconductor on insulator type with an integrated ground plane Mar. 5, 2013
8383436 Manufacturing method for semiconductor chips, and semiconductor chip Feb. 26, 2013
8361883 Laser processing method Jan. 29, 2013
8338917 Multiple seal ring structure Dec. 25, 2012
8324714 Semiconductor device and method for making the same Dec. 4, 2012
8314013 Semiconductor chip manufacturing method Nov. 20, 2012
8307521 Method for manufacturing acceleration sensing unit Nov. 13, 2012
8304325 Substrate dividing method Nov. 6, 2012
8298919 Manufacturing method of semiconductor device and semiconductor device Oct. 30, 2012
8278186 Wafer cleaning method and wafer bonding method using the same Oct. 2, 2012
8268704 Method for dicing substrate Sep. 18, 2012
8263479 Method for cutting semiconductor substrate Sep. 11, 2012
8258014 Method of manufacturing a power transistor module and package with integrated bus bar Sep. 4, 2012
8247773 Method and apparatus for reading identification mark on surface of wafer Aug. 21, 2012
8236613 Wafer level chip scale package method using clip array Aug. 7, 2012
8193072 Semiconductor wafer coat layers and methods therefor Jun. 5, 2012
8173522 Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer May. 8, 2012
8168458 Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices May. 1, 2012
8143141 Laser beam machining method and semiconductor chip Mar. 27, 2012
8119501 Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity Feb. 21, 2012
8093694 Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures Jan. 10, 2012
8080859 Reducing stress between a substrate and a projecting electrode on the substrate Dec. 20, 2011
8067295 Manufacturing method of solar cell module, and solar cell and solar cell module Nov. 29, 2011
8039367 Scribe line structure and method for dicing a wafer Oct. 18, 2011
8030136 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Oct. 4, 2011
8022501 Semiconductor device and method for isolating the same Sep. 20, 2011
7981727 Electronic device wafer level scale packages and fabrication methods thereof Jul. 19, 2011
7955952 Crackstop structures and methods of making same Jun. 7, 2011
7954215 Method for manufacturing acceleration sensing unit Jun. 7, 2011
7923350 Method of manufacturing a semiconductor device including etching to etch stop regions Apr. 12, 2011

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