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Class Information
Number: 438/460
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing
Description: Process including the step of separating the semiconductor substrate into plural individual bodies (e.g., die, etc.) usually by removal of material therefrom or by cleavage thereof.










Sub-classes under this class:

Class Number Class Name Patents
438/461 Beam lead formation 154
438/463 By electromagnetic irradiation (e.g., electron, laser, etc.) 466
438/465 Having a perfecting coating 332
438/462 Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.) 1,339
438/464 With attachment to temporary support or carrier 947


Patents under this class:

Patent Number Title Of Patent Date Issued
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8703583 Fabrication method of semiconductor device Apr. 22, 2014
8685838 Laser beam machining method Apr. 1, 2014
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8679947 Self-formation of high-density defect-free and aligned nanostructures Mar. 25, 2014
8679945 Backgrind process for integrated circuit wafers Mar. 25, 2014
8673745 Method of cutting object to be processed Mar. 18, 2014
8673742 Method for manufacturing semiconductor device Mar. 18, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8664088 Manufacturing a heat sink material using a discharge wire Mar. 4, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8658515 Method of manufacturing film for semiconductor device Feb. 25, 2014
8658436 Method for separating and transferring IC chips Feb. 25, 2014
8653563 Semiconductor device Feb. 18, 2014
8652942 Method for manufacturing electronic parts Feb. 18, 2014
8652941 Wafer dicing employing edge region underfill removal Feb. 18, 2014
8652940 Wafer dicing used hybrid multi-step laser scribing process with plasma etch Feb. 18, 2014
8652939 Method and apparatus for die assembly Feb. 18, 2014
8652938 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device Feb. 18, 2014
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8643177 Wafers including patterned back side layers thereon Feb. 4, 2014
8642920 Wafer dividing apparatus and laser processing apparatus Feb. 4, 2014
8642447 Semiconductor wafer and manufacturing method of semiconductor device Feb. 4, 2014
8642445 Method and apparatus for reducing package warpage Feb. 4, 2014
8637970 Chip package and fabrication method thereof Jan. 28, 2014
8637967 Method for fabricating a semiconductor chip and semiconductor chip Jan. 28, 2014
8637382 Layer transfer of films utilizing thermal flux regime for energy controlled cleaving Jan. 28, 2014
8633086 Power devices having reduced on-resistance and methods of their manufacture Jan. 21, 2014
8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof Jan. 14, 2014
8629042 Method for stacking semiconductor dies Jan. 14, 2014
8624351 Package structure and method for making the same Jan. 7, 2014
8623744 Die singulation method Jan. 7, 2014
8623703 Silicon device and silicon device manufacturing method Jan. 7, 2014
8623137 Method and device for slicing a shaped silicon ingot using layer transfer Jan. 7, 2014
8617964 Laser processing method Dec. 31, 2013
8615857 Method of manufacturing piezoelectric vibrators Dec. 31, 2013
8614139 Dicing film with protecting film Dec. 24, 2013
8610238 Crack stop trenches Dec. 17, 2013
8609513 Method for manufacturing semiconductor device Dec. 17, 2013
8603351 Working method for cutting Dec. 10, 2013
8598015 Laser processing method Dec. 3, 2013
8597967 Method and system for dicing substrates containing gallium and nitrogen material Dec. 3, 2013
8597963 Manufacture of light emitting devices with phosphor wavelength conversion Dec. 3, 2013
8597074 Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces Dec. 3, 2013
8592950 Semiconductor device and method of forming through vias with reflowed conductive material Nov. 26, 2013
8586415 Dicing/die-bonding film, method of fixing chipped work and semiconductor device Nov. 19, 2013
8580656 Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor Nov. 12, 2013
8580615 Method and system for wafer level singulation Nov. 12, 2013
8575729 Semiconductor chip with linear expansion coefficients in direction parallel to sides of hexagonal semiconductor substrate and manufacturing method Nov. 5, 2013











 
 
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