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Class Information
Number: 438/460
Name: Semiconductor device manufacturing: process > Semiconductor substrate dicing
Description: Process including the step of separating the semiconductor substrate into plural individual bodies (e.g., die, etc.) usually by removal of material therefrom or by cleavage thereof.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615397 |
Micro-element package and manufacturing method thereof |
Nov. 10, 2009 |
| 7611966 |
Dual pulsed beam laser micromachining method |
Nov. 3, 2009 |
| 7611967 |
Wafer sawing method |
Nov. 3, 2009 |
| 7611968 |
Wafer laser processing method and laser beam processing machine |
Nov. 3, 2009 |
| 7608481 |
Method for producing semiconductor package |
Oct. 27, 2009 |
| 7605015 |
Process for the singulation of integrated devices in thin semiconductor chips |
Oct. 20, 2009 |
| 7605057 |
Semiconductor device and manufacturing method thereof |
Oct. 20, 2009 |
| 7601642 |
Method of processing silicon wafer |
Oct. 13, 2009 |
| 7601616 |
Wafer laser processing method |
Oct. 13, 2009 |
| 7598120 |
Method for holding semiconductor wafer |
Oct. 6, 2009 |
| 7598157 |
Wafer dicing method |
Oct. 6, 2009 |
| 7595226 |
Method of packaging an integrated circuit die |
Sep. 29, 2009 |
| 7592235 |
Semiconductor device including semiconductor memory element and method for producing same |
Sep. 22, 2009 |
| 7592237 |
Laser processing method and object to be processed |
Sep. 22, 2009 |
| 7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips |
Sep. 22, 2009 |
| 7591071 |
Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate |
Sep. 22, 2009 |
| 7592203 |
Method of manufacturing an electronic protection device |
Sep. 22, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7572350 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Aug. 11, 2009 |
| 7569409 |
Isolation structures for CMOS image sensor chip scale packages |
Aug. 4, 2009 |
| 7566638 |
Method of dicing a semiconductor device into plural chips |
Jul. 28, 2009 |
| 7566585 |
Semiconductor component and method for production of a semiconductor component |
Jul. 28, 2009 |
| 7563695 |
Method and system for high-speed precise laser trimming and scan lens for use therein |
Jul. 21, 2009 |
| 7564119 |
Adhesive sheet for laser dicing and its manufacturing method |
Jul. 21, 2009 |
| 7560801 |
Rewiring substrate strip with several semiconductor component positions |
Jul. 14, 2009 |
| 7560362 |
Cutting method for substrate |
Jul. 14, 2009 |
| 7560304 |
Method of making a semiconductor device having multiple die redistribution layer |
Jul. 14, 2009 |
| 7557016 |
Dicing method using an encased dicing blade submerged in cooling water |
Jul. 7, 2009 |
| 7557017 |
Method of manufacturing semiconductor device with two-step etching of layer |
Jul. 7, 2009 |
| 7557898 |
Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit fo |
Jul. 7, 2009 |
| 7553744 |
Method for low temperature bonding and bonded structure |
Jun. 30, 2009 |
| 7553745 |
Integrated circuit package, panel and methods of manufacturing the same |
Jun. 30, 2009 |
| 7550367 |
Method for separating semiconductor substrate |
Jun. 23, 2009 |
| 7549560 |
Wafer dividing method |
Jun. 23, 2009 |
| 7547572 |
Method of protecting semiconductor chips from mechanical and ESD damage during handling |
Jun. 16, 2009 |
| 7544523 |
Method of fabricating nanodevices |
Jun. 9, 2009 |
| 7544586 |
Method of fabricating chips and an associated support |
Jun. 9, 2009 |
| 7544587 |
Wafer dividing method and wafer dividing apparatus |
Jun. 9, 2009 |
| 7535082 |
Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
May. 19, 2009 |
| 7534703 |
Method for bonding semiconductor chip |
May. 19, 2009 |
| 7534663 |
Method for manufacturing a surface mount device |
May. 19, 2009 |
| 7534657 |
Method of manufacturing a semiconductor device |
May. 19, 2009 |
| 7534656 |
Image sensor device and method of manufacturing the same |
May. 19, 2009 |
| 7531431 |
Methods for reducing contamination of semiconductor devices and materials during wafer processing |
May. 12, 2009 |
| 7531432 |
Block-molded semiconductor device singulation methods and systems |
May. 12, 2009 |
| 7524738 |
Method for manufacturing semiconductor device |
Apr. 28, 2009 |
| 7521122 |
Laminated sheet |
Apr. 21, 2009 |
| 7521337 |
Wafer laser processing method |
Apr. 21, 2009 |
| 7521338 |
Method for sawing semiconductor wafer |
Apr. 21, 2009 |
| 7517423 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Apr. 14, 2009 |
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