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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6596569 |
Thin film transistors |
Jul. 22, 2003 |
| 6596610 |
Method for reclaiming delaminated wafer and reclaimed delaminated wafer |
Jul. 22, 2003 |
| 6593644 |
System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face |
Jul. 15, 2003 |
| 6593213 |
Synthesis of layers, coatings or films using electrostatic fields |
Jul. 15, 2003 |
| 6589818 |
Method for mounting a thin semiconductor device |
Jul. 8, 2003 |
| 6586161 |
Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device |
Jul. 1, 2003 |
| 6583031 |
Method of making a MEMS element having perpendicular portion formed from substrate |
Jun. 24, 2003 |
| 6582991 |
Semiconductor device and method for fabricating the same |
Jun. 24, 2003 |
| 6583030 |
Method for producing an integrated circuit processed on both sides |
Jun. 24, 2003 |
| 6582223 |
Pickup apparatus for semiconductor chips |
Jun. 24, 2003 |
| 6579748 |
Fabrication method of an electronic component |
Jun. 17, 2003 |
| 6576494 |
Recessed encapsulated microelectronic devices and methods for formation |
Jun. 10, 2003 |
| 6566158 |
Method of preparing a semiconductor using ion implantation in a SiC layer |
May. 20, 2003 |
| 6566255 |
SOI annealing method and SOI manufacturing method |
May. 20, 2003 |
| 6566267 |
Inexpensive process for producing a multiplicity of semiconductor wafers |
May. 20, 2003 |
| 6562701 |
Method of manufacturing nitride semiconductor substrate |
May. 13, 2003 |
| 6562658 |
Method of making semiconductor device having first and second sealing resins |
May. 13, 2003 |
| 6558975 |
Process for producing semiconductor device |
May. 6, 2003 |
| 6559058 |
Method of fabricating three-dimensional components using endpoint detection |
May. 6, 2003 |
| 6555405 |
Method for forming a semiconductor device having a metal substrate |
Apr. 29, 2003 |
| 6555444 |
Device and method for core buildup using a separator |
Apr. 29, 2003 |
| 6555446 |
Body contact silicon-on-insulator transistor and method |
Apr. 29, 2003 |
| 6551905 |
Wafer adhesive for semiconductor dry etch applications |
Apr. 22, 2003 |
| 6551851 |
Production of diaphragms over a cavity by grinding to reduce wafer thickness |
Apr. 22, 2003 |
| 6548376 |
Methods of thinning microelectronic workpieces |
Apr. 15, 2003 |
| 6544863 |
Method of fabricating semiconductor wafers having multiple height subsurface layers |
Apr. 8, 2003 |
| 6541352 |
Semiconductor die with contoured bottom surface and method for making same |
Apr. 1, 2003 |
| 6534385 |
Method of fusion for heteroepitaxial layers and overgrowth thereon |
Mar. 18, 2003 |
| 6534384 |
Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere |
Mar. 18, 2003 |
| 6534382 |
Process for producing semiconductor article |
Mar. 18, 2003 |
| 6528391 |
Controlled cleavage process and device for patterned films |
Mar. 4, 2003 |
| 6528344 |
Chip scale surface-mountable packaging method for electronic and MEMS devices |
Mar. 4, 2003 |
| 6524932 |
Method of fabricating group-III nitride-based semiconductor device |
Feb. 25, 2003 |
| 6524890 |
Method for manufacturing semiconductor device having element isolation structure |
Feb. 25, 2003 |
| 6524933 |
Methods of manufacturing semiconductor devices that protect interconnect wirings during processing of back substrate surface |
Feb. 25, 2003 |
| 6521512 |
Method for fabricating a thin, free-standing semiconductor device layer and for making a three-dimensionally integrated circuit |
Feb. 18, 2003 |
| 6521479 |
Repackaging semiconductor IC devices for failure analysis |
Feb. 18, 2003 |
| 6514796 |
Method for mounting a thin semiconductor device |
Feb. 4, 2003 |
| 6511895 |
Semiconductor wafer turning process |
Jan. 28, 2003 |
| 6511896 |
Method of etching a substantially amorphous TA2O5 comprising layer |
Jan. 28, 2003 |
| 6511899 |
Controlled cleavage process using pressurized fluid |
Jan. 28, 2003 |
| 6506664 |
Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device |
Jan. 14, 2003 |
| 6506681 |
Thin flip--chip method |
Jan. 14, 2003 |
| 6500732 |
Cleaving process to fabricate multilayered substrates using low implantation doses |
Dec. 31, 2002 |
| 6500733 |
Synthesis of layers, coatings or films using precursor layer exerted pressure containment |
Dec. 31, 2002 |
| 6498073 |
Back illuminated imager with enhanced UV to near IR sensitivity |
Dec. 24, 2002 |
| 6492195 |
Method of thinning a semiconductor substrate using a perforated support substrate |
Dec. 10, 2002 |
| 6486008 |
Manufacturing method of a thin film on a substrate |
Nov. 26, 2002 |
| 6482725 |
Gate formation method for reduced poly-depletion and boron penetration |
Nov. 19, 2002 |
| 6472294 |
Semiconductor processing method for processing discrete pieces of substrate to form electronic devices |
Oct. 29, 2002 |
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