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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6919261 |
Method and resulting structure for manufacturing semiconductor substrates |
Jul. 19, 2005 |
| 6916676 |
Method for producing a nitride semiconductor element |
Jul. 12, 2005 |
| 6916725 |
Method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
Jul. 12, 2005 |
| 6911392 |
Process for making contact with and housing integrated circuits |
Jun. 28, 2005 |
| 6908828 |
Support-integrated donor wafers for repeated thin donor layer separation |
Jun. 21, 2005 |
| 6905912 |
Semiconductor device and method for fabricating the same |
Jun. 14, 2005 |
| 6905946 |
Thin flip-chip method |
Jun. 14, 2005 |
| 6902989 |
Method for manufacturing gallium nitride (GaN) based single crystalline substrate that include separating from a growth substrate |
Jun. 7, 2005 |
| 6903420 |
Silicon-on-insulator comprising integrated circuitry |
Jun. 7, 2005 |
| 6902987 |
Method for low temperature bonding and bonded structure |
Jun. 7, 2005 |
| 6900113 |
Method for producing bonded wafer and bonded wafer |
May. 31, 2005 |
| 6897125 |
Methods of forming backside connections on a wafer stack |
May. 24, 2005 |
| 6893942 |
Method for separating a mask from the surface of a semiconductor wafer |
May. 17, 2005 |
| 6890834 |
Electronic device and method for manufacturing the same |
May. 10, 2005 |
| 6890835 |
Layer transfer of low defect SiGe using an etch-back process |
May. 10, 2005 |
| 6891991 |
Optical path method and apparatus |
May. 10, 2005 |
| 6888223 |
Use of photoresist in substrate vias during backside grind |
May. 3, 2005 |
| 6887769 |
Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same |
May. 3, 2005 |
| 6887770 |
Method for fabricating semiconductor device |
May. 3, 2005 |
| 6884732 |
Method of fabricating a device having a desired non-planar surface or profile and device produced thereby |
Apr. 26, 2005 |
| 6884696 |
Method for producing bonding wafer |
Apr. 26, 2005 |
| 6884695 |
Sheet resin composition and process for manufacturing semiconductor device therewith |
Apr. 26, 2005 |
| 6884694 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Apr. 26, 2005 |
| 6884693 |
Silicon-on-insulator wafer and method of manufacturing the same |
Apr. 26, 2005 |
| 6882669 |
High-power surface emitting laser and fabrication methods thereof |
Apr. 19, 2005 |
| 6881648 |
Semiconductor wafer having a thin die and tethers and methods of making the same |
Apr. 19, 2005 |
| 6881599 |
Transferring semiconductor crystal from a substrate to a resin |
Apr. 19, 2005 |
| 6878608 |
Method of manufacture of silicon based package |
Apr. 12, 2005 |
| 6875672 |
Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate |
Apr. 5, 2005 |
| 6875633 |
Process for production of SOI substrate and process for production of semiconductor device |
Apr. 5, 2005 |
| 6867110 |
Separating apparatus and processing method for plate member |
Mar. 15, 2005 |
| 6867073 |
Single mask via method and device |
Mar. 15, 2005 |
| 6864142 |
Method to produce a factory programmable IC using standard IC wafers and the structure |
Mar. 8, 2005 |
| 6864154 |
Process for lapping wafer and method for processing backside of wafer using the same |
Mar. 8, 2005 |
| 6864155 |
Methods of forming silicon-on-insulator comprising integrated circuitry, and wafer bonding methods of forming silicon-on-insulator comprising integrated circuitry |
Mar. 8, 2005 |
| 6864156 |
Semiconductor wafer with well contacts on back side |
Mar. 8, 2005 |
| 6858518 |
Method for manufacturing semiconductor integrated circuit |
Feb. 22, 2005 |
| 6846692 |
Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes |
Jan. 25, 2005 |
| 6846703 |
Three-dimensional device |
Jan. 25, 2005 |
| 6846723 |
Semiconductor substrate, semiconductor device, and processes of production of same |
Jan. 25, 2005 |
| 6846686 |
Semiconductor light-emitting device and method of manufacturing the same |
Jan. 25, 2005 |
| 6844241 |
Fabrication of semiconductor structures having multiple conductive layers in an opening |
Jan. 18, 2005 |
| 6844242 |
Method of manufacturing SOI wafer |
Jan. 18, 2005 |
| 6844244 |
Dual sided lithographic substrate imaging |
Jan. 18, 2005 |
| 6841454 |
Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
Jan. 11, 2005 |
| 6838358 |
Method of manufacturing a wafer |
Jan. 4, 2005 |
| 6833312 |
Plate member separating apparatus and method |
Dec. 21, 2004 |
| 6830985 |
Method and apparatus for producing bonded dielectric separation wafer |
Dec. 14, 2004 |
| 6828214 |
Semiconductor member manufacturing method and semiconductor device manufacturing method |
Dec. 7, 2004 |
| 6825099 |
Method and apparatus for separating member |
Nov. 30, 2004 |
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