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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7008860 |
Substrate manufacturing method |
Mar. 7, 2006 |
| 7005324 |
Method of fabricating stacked semiconductor chips |
Feb. 28, 2006 |
| 7005319 |
Global planarization of wafer scale package with precision die thickness control |
Feb. 28, 2006 |
| 7001827 |
Semiconductor wafer front side protection |
Feb. 21, 2006 |
| 7001825 |
Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
Feb. 21, 2006 |
| 7001826 |
Wafer with a relaxed useful layer and method of forming the wafer |
Feb. 21, 2006 |
| 6998327 |
Thin film transfer join process and multilevel thin film module |
Feb. 14, 2006 |
| 6998282 |
Method of manufacturing a semiconductor device |
Feb. 14, 2006 |
| 6998328 |
Method for creating neo-wafers from singulated integrated circuit die and a device made according to the method |
Feb. 14, 2006 |
| 6995075 |
Process for forming a fragile layer inside of a single crystalline substrate |
Feb. 7, 2006 |
| 6993826 |
Method of manufacturing a probe array |
Feb. 7, 2006 |
| 6991944 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials |
Jan. 31, 2006 |
| 6991995 |
Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer |
Jan. 31, 2006 |
| 6989299 |
Method of fabricating on-chip spacers for a TFT panel |
Jan. 24, 2006 |
| 6984571 |
Three dimensional device integration method and integrated device |
Jan. 10, 2006 |
| 6984570 |
Wafer bonding method of forming silicon-on-insulator comprising integrated circuitry |
Jan. 10, 2006 |
| 6982210 |
Method for manufacturing a multilayer semiconductor structure that includes an irregular layer |
Jan. 3, 2006 |
| 6982184 |
Method of fabricating MEMS devices on a silicon wafer |
Jan. 3, 2006 |
| 6982208 |
Method for producing high throughput strained-Si channel MOSFETS |
Jan. 3, 2006 |
| 6982185 |
Single crystal, dual wafer, tunneling sensor or switch with silicon on insulator substrate and a method of making same |
Jan. 3, 2006 |
| 6979630 |
Method and apparatus for transferring a thin layer of semiconductor material |
Dec. 27, 2005 |
| 6979659 |
Silicon fixture supporting silicon wafers during high temperature processing |
Dec. 27, 2005 |
| 6975022 |
Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof |
Dec. 13, 2005 |
| 6974760 |
Methods for transferring a useful layer of silicon carbide to a receiving substrate |
Dec. 13, 2005 |
| 6974759 |
Method for making a stacked comprising a thin film adhering to a target substrate |
Dec. 13, 2005 |
| 6974757 |
Method of forming silicon-on-insulator comprising integrated circuitry |
Dec. 13, 2005 |
| 6967145 |
Method of maintaining photolithographic precision alignment after wafer bonding process |
Nov. 22, 2005 |
| 6967149 |
Storage structure with cleaved layer |
Nov. 22, 2005 |
| 6964881 |
Multi-chip wafer level system packages and methods of forming same |
Nov. 15, 2005 |
| 6964914 |
Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material |
Nov. 15, 2005 |
| 6960490 |
Method and resulting structure for manufacturing semiconductor substrates |
Nov. 1, 2005 |
| 6958285 |
Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openings |
Oct. 25, 2005 |
| 6958284 |
Method of smoothing the outline of a useful layer of material transferred onto a support substrate |
Oct. 25, 2005 |
| 6958298 |
Method for thinning wafer by grinding |
Oct. 25, 2005 |
| 6955971 |
Semiconductor structure and methods for fabricating same |
Oct. 18, 2005 |
| 6953704 |
Systems with high density packing of micromachines |
Oct. 11, 2005 |
| 6951811 |
Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer |
Oct. 4, 2005 |
| 6949158 |
Using backgrind wafer tape to enable wafer mounting of bumped wafers |
Sep. 27, 2005 |
| 6946312 |
Semiconductor light emitting device and its manufacture |
Sep. 20, 2005 |
| 6940181 |
Thinned, strengthened semiconductor substrates and packages including same |
Sep. 6, 2005 |
| 6939782 |
Method for producing thin layers on a specific support and an application thereof |
Sep. 6, 2005 |
| 6936497 |
Method of forming electronic dies wherein each die has a layer of solid diamond |
Aug. 30, 2005 |
| 6936524 |
Ultrathin form factor MEMS microphones and microspeakers |
Aug. 30, 2005 |
| 6936894 |
Silicon-on-insulator comprising integrated circuitry |
Aug. 30, 2005 |
| 6933212 |
Apparatus and method for dicing semiconductor wafers |
Aug. 23, 2005 |
| 6933160 |
Method for manufacturing of a vertical light emitting device structure |
Aug. 23, 2005 |
| 6930023 |
Semiconductor wafer thinning method, and thin semiconductor wafer |
Aug. 16, 2005 |
| 6927146 |
Chemical thinning of epitaxial silicon layer over buried oxide |
Aug. 9, 2005 |
| 6927147 |
Coplanar integration of lattice-mismatched semiconductor with silicon via wafer bonding virtual substrates |
Aug. 9, 2005 |
| 6919284 |
Protective tape applying method and apparatus, and protective tape separating method |
Jul. 19, 2005 |
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