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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7084046 |
Method of fabricating SOI wafer |
Aug. 1, 2006 |
| 7084008 |
Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and el |
Aug. 1, 2006 |
| 7079217 |
Method of fabricating a liquid crystal display panel |
Jul. 18, 2006 |
| 7078311 |
Substrate-embedded capacitor, production method thereof, and circuit board |
Jul. 18, 2006 |
| 7078266 |
Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts |
Jul. 18, 2006 |
| 7078320 |
Partial wafer bonding and dicing |
Jul. 18, 2006 |
| 7071572 |
Pre-back-grind and underfill layer for bumped wafers and dies |
Jul. 4, 2006 |
| 7067397 |
Method of fabricating high yield wafer level packages integrating MMIC and MEMS components |
Jun. 27, 2006 |
| 7067396 |
Method of producing a thin layer of semiconductor material |
Jun. 27, 2006 |
| 7067394 |
Manufacturing of monolithically integrated pin structures |
Jun. 27, 2006 |
| 7067392 |
Semiconductor apparatus and fabrication method of the same |
Jun. 27, 2006 |
| 7067352 |
Vertical integrated package apparatus and method |
Jun. 27, 2006 |
| 7067344 |
Method of manufacturing an external force detection sensor |
Jun. 27, 2006 |
| 7067345 |
Method of joining components |
Jun. 27, 2006 |
| 7064005 |
Semiconductor apparatus and method of manufacturing same |
Jun. 20, 2006 |
| 7064045 |
Laser based method and device for forming spacer structures for packaging optical reflection devices |
Jun. 20, 2006 |
| 7064391 |
Bond and back side etchback transistor fabrication process |
Jun. 20, 2006 |
| 7060590 |
Layer transfer method |
Jun. 13, 2006 |
| 7056811 |
Method for manufacturing semiconductor device |
Jun. 6, 2006 |
| 7056812 |
Process for strengthening semiconductor substrates following thinning |
Jun. 6, 2006 |
| 7056813 |
Methods of forming backside connections on a wafer stack |
Jun. 6, 2006 |
| 7056649 |
Process for producing a tool insert for injection molding a part with two-stage microstructures |
Jun. 6, 2006 |
| 7052974 |
Bonded wafer and method of producing bonded wafer |
May. 30, 2006 |
| 7052927 |
Pin detector apparatus and method of fabrication |
May. 30, 2006 |
| 7049208 |
Method of manufacturing of thin based substrate |
May. 23, 2006 |
| 7049175 |
Method of packaging RF MEMS |
May. 23, 2006 |
| 7049165 |
Method of manufacturing an external force detection sensor |
May. 23, 2006 |
| 7049161 |
Method of manufacturing substrate, method of manufacturing organic electroluminescent display device using the method, and organic electroluminescent display device |
May. 23, 2006 |
| 7049624 |
Member and member manufacturing method |
May. 23, 2006 |
| 7045443 |
Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
May. 16, 2006 |
| 7045442 |
Method of separating a release layer from a substrate comprising hydrogen diffusion |
May. 16, 2006 |
| 7045441 |
Method for forming a single-crystal silicon layer on a transparent substrate |
May. 16, 2006 |
| 7041178 |
Method for low temperature bonding and bonded structure |
May. 9, 2006 |
| 7037806 |
Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride |
May. 2, 2006 |
| 7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
May. 2, 2006 |
| 7033913 |
Semiconductor device and method of manufacturing the same |
Apr. 25, 2006 |
| 7033905 |
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means |
Apr. 25, 2006 |
| 7033867 |
Shallow trench antifuse and methods of making and using same |
Apr. 25, 2006 |
| 7033910 |
Method of fabricating multi layer MEMS and microfluidic devices |
Apr. 25, 2006 |
| 7029980 |
Method of manufacturing SOI template layer |
Apr. 18, 2006 |
| 7029937 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Apr. 18, 2006 |
| 7030494 |
Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof |
Apr. 18, 2006 |
| 7029960 |
Device manufacturing method |
Apr. 18, 2006 |
| 7026223 |
Hermetic electric component package |
Apr. 11, 2006 |
| 7022540 |
Cantilever sensor and fabrication method thereof |
Apr. 4, 2006 |
| 7018909 |
Forming structures that include a relaxed or pseudo-relaxed layer on a substrate |
Mar. 28, 2006 |
| 7018484 |
Semiconductor-on-insulator silicon wafer and method of formation |
Mar. 28, 2006 |
| 7008860 |
Substrate manufacturing method |
Mar. 7, 2006 |
| 7008858 |
Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof |
Mar. 7, 2006 |
| 7008859 |
Wafer and method of producing a substrate by transfer of a layer that includes foreign species |
Mar. 7, 2006 |
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