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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5650353 |
Method for production of SOI substrate |
Jul. 22, 1997 |
| 5647932 |
Method of processing a piezoelectric device |
Jul. 15, 1997 |
| 5633176 |
Method of producing a semiconductor device for a light valve |
May. 27, 1997 |
| 5631186 |
Method for making a dynamic random access memory using silicon-on-insulator techniques |
May. 20, 1997 |
| 5627106 |
Trench method for three dimensional chip connecting during IC fabrication |
May. 6, 1997 |
| 5618745 |
Method of manufacturing a one transistor one-capacitor memory cell structure with a trench containing a conductor penetrating a buried insulating film |
Apr. 8, 1997 |
| 5618739 |
Method of making light valve device using semiconductive composite substrate |
Apr. 8, 1997 |
| 5616512 |
Power semiconductor devices |
Apr. 1, 1997 |
| 5616523 |
Method of manufacturing sensor |
Apr. 1, 1997 |
| 5602052 |
Method of forming dummy island capacitor |
Feb. 11, 1997 |
| 5593915 |
Method of manufacturing semiconductor device |
Jan. 14, 1997 |
| 5591678 |
Process of manufacturing a microelectric device using a removable support substrate and etch-stop |
Jan. 7, 1997 |
| 5589083 |
Method of manufacturing microstructure by the anisotropic etching and bonding of substrates |
Dec. 31, 1996 |
| 5585661 |
Sub-micron bonded SOI by trench planarization |
Dec. 17, 1996 |
| 5585304 |
Method of making semiconductor device with multiple transparent layers |
Dec. 17, 1996 |
| 5580802 |
Silicon-on-insulator gate-all-around mosfet fabrication methods |
Dec. 3, 1996 |
| 5573972 |
Method for manufacturing a silicon bonded wafer |
Nov. 12, 1996 |
| 5573960 |
Method of manufacturing semiconductor layers by bonding without defects created by bonding |
Nov. 12, 1996 |
| 5571730 |
Semiconductor device having vertical metal oxide semiconductors and a method for manufacturing the same |
Nov. 5, 1996 |
| 5569620 |
Bonded wafer processing with metal silicidation |
Oct. 29, 1996 |
| 5563084 |
Method of making a three-dimensional integrated circuit |
Oct. 8, 1996 |
| 5536361 |
Process for preparing semiconductor substrate by bonding to a metallic surface |
Jul. 16, 1996 |
| 5529947 |
Semiconductor device with clad substrate and fabrication process therefor |
Jun. 25, 1996 |
| 5523610 |
Photodiode array and method for manufacturing the same |
Jun. 4, 1996 |
| 5506163 |
Method of making a semiconductor device |
Apr. 9, 1996 |
| 5506153 |
Method for manufacture of a controllable power semiconductor element with buffer zone |
Apr. 9, 1996 |
| 5504036 |
Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material provided on a support slice |
Apr. 2, 1996 |
| 5496743 |
Method of making an article comprising a semiconductor device |
Mar. 5, 1996 |
| 5496764 |
Process for forming a semiconductor region adjacent to an insulating layer |
Mar. 5, 1996 |
| 5494849 |
Single-etch stop process for the manufacture of silicon-on-insulator substrates |
Feb. 27, 1996 |
| 5492859 |
Method for producing semiconductor device substrate by bonding a porous layer and an amorphous layer |
Feb. 20, 1996 |
| 5488012 |
Silicon on insulator with active buried regions |
Jan. 30, 1996 |
| 5484738 |
Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
Jan. 16, 1996 |
| 5478408 |
SOI substrate and manufacturing method therefor |
Dec. 26, 1995 |
| 5476813 |
Method of manufacturing a bonded semiconductor substrate and a dielectric isolated bipolar transistor |
Dec. 19, 1995 |
| 5468674 |
Method for forming low and high minority carrier lifetime layers in a single semiconductor structure |
Nov. 21, 1995 |
| 5466631 |
Method for producing semiconductor articles |
Nov. 14, 1995 |
| 5466631 |
Method for producing semiconductor articles |
Nov. 14, 1995 |
| 5462883 |
Method of fabricating defect-free silicon on an insulating substrate |
Oct. 31, 1995 |
| 5459104 |
Process for production of semiconductor substrate |
Oct. 17, 1995 |
| 5455193 |
Method of forming a silicon-on-insulator (SOI) material having a high degree of thickness uniformity |
Oct. 3, 1995 |
| 5455202 |
Method of making a microelectric device using an alternate substrate |
Oct. 3, 1995 |
| 5449638 |
Process on thickness control for silicon-on-insulator technology |
Sep. 12, 1995 |
| 5444014 |
Method for fabricating semiconductor device |
Aug. 22, 1995 |
| 5439843 |
Method for preparing a semiconductor substrate using porous silicon |
Aug. 8, 1995 |
| 5437762 |
Method and apparatus for semiconductor memory |
Aug. 1, 1995 |
| 5436171 |
Photodiode array device and method for producing same |
Jul. 25, 1995 |
| 5427052 |
Method and apparatus for production of extremely thin SOI film substrate |
Jun. 27, 1995 |
| 5424235 |
Semiconductor memory device |
Jun. 13, 1995 |
| 5413951 |
Composite semiconductor substrate and a fabrication process thereof |
May. 9, 1995 |
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