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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5872025 |
Method for stacked three dimensional device manufacture |
Feb. 16, 1999 |
| 5872024 |
Method for manufacturing a mechanical force sensing semiconductor device |
Feb. 16, 1999 |
| 5869354 |
Method of making dielectrically isolated integrated circuit |
Feb. 9, 1999 |
| 5869386 |
Method of fabricating a composite silicon-on-insulator substrate |
Feb. 9, 1999 |
| 5869387 |
Process for producing semiconductor substrate by heating to flatten an unpolished surface |
Feb. 9, 1999 |
| 5863829 |
Process for fabricating SOI substrate |
Jan. 26, 1999 |
| 5856229 |
Process for production of semiconductor substrate |
Jan. 5, 1999 |
| 5854122 |
Epitaxial layer for dissolved wafer micromachining process |
Dec. 29, 1998 |
| 5851894 |
Method of vertically integrating microelectronic systems |
Dec. 22, 1998 |
| 5851902 |
Semiconductor layer structure and recording medium for a large capacity memory |
Dec. 22, 1998 |
| 5840616 |
Method for preparing semiconductor member |
Nov. 24, 1998 |
| 5840614 |
Method of producing a semiconductor wafer using ultraviolet sensitive tape |
Nov. 24, 1998 |
| 5830800 |
Packaging method for a ball grid array integrated circuit without utilizing a base plate |
Nov. 3, 1998 |
| 5827755 |
Liquid crystal image display unit and method for fabricating semiconductor optical member |
Oct. 27, 1998 |
| 5824595 |
Method of separating electronic elements |
Oct. 20, 1998 |
| 5807783 |
Surface mount die by handle replacement |
Sep. 15, 1998 |
| 5804495 |
Method of making SOI structure |
Sep. 8, 1998 |
| 5801084 |
Bonded wafer processing |
Sep. 1, 1998 |
| 5798293 |
Method for producing a semiconductor layer of SiC of the 3C-polytype and a semiconductor device having an insulator between a carrier and the active semiconductor layer |
Aug. 25, 1998 |
| 5798294 |
Semiconductor substrate having a serious effect of gettering heavy metal and method of manufacturing the same |
Aug. 25, 1998 |
| 5786236 |
Backside thinning using ion-beam figuring |
Jul. 28, 1998 |
| 5786242 |
Method of manufacturing SOI semiconductor integrated circuit |
Jul. 28, 1998 |
| 5780354 |
Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
Jul. 14, 1998 |
| 5773352 |
Fabrication process of bonded total dielectric isolation substrate |
Jun. 30, 1998 |
| 5773330 |
Semiconductor device and method for fabricating the same |
Jun. 30, 1998 |
| 5773354 |
Method of forming SOI substrate |
Jun. 30, 1998 |
| 5773355 |
Method for manufacturing semiconductor substrate |
Jun. 30, 1998 |
| 5770487 |
Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization |
Jun. 23, 1998 |
| 5770511 |
Silicon-on-insulator substrate and a method for fabricating the same |
Jun. 23, 1998 |
| 5767001 |
Process for producing semiconductor components between which contact is made vertically |
Jun. 16, 1998 |
| 5753562 |
Methods of forming semiconductor devices in substrates having inverted-trench isolation regions therein |
May. 19, 1998 |
| 5750000 |
Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
May. 12, 1998 |
| 5741733 |
Method for the production of a three-dimensional circuit arrangement |
Apr. 21, 1998 |
| 5728624 |
Bonded wafer processing |
Mar. 17, 1998 |
| 5712190 |
Process for controlling distance between integrated circuit chips in an electronic module |
Jan. 27, 1998 |
| 5705421 |
A SOI substrate fabricating method |
Jan. 6, 1998 |
| 5688714 |
Method of fabricating a semiconductor device having a top layer and base layer joined by wafer bonding |
Nov. 18, 1997 |
| 5686364 |
Method for producing substrate to achieve semiconductor integrated circuits |
Nov. 11, 1997 |
| 5686319 |
Method for producing a diode |
Nov. 11, 1997 |
| 5681775 |
Soi fabrication process |
Oct. 28, 1997 |
| 5672112 |
Zero clearance locking mechanism for a disconnect coupling device |
Sep. 30, 1997 |
| 5670411 |
Process of making semiconductor-on-insulator substrate |
Sep. 23, 1997 |
| 5670387 |
Process for forming semiconductor-on-insulator device |
Sep. 23, 1997 |
| 5670388 |
Method of making contacted body silicon-on-insulator field effect transistor |
Sep. 23, 1997 |
| 5668045 |
Process for stripping outer edge of BESOI wafers |
Sep. 16, 1997 |
| 5665631 |
SOI substrate manufacturing method |
Sep. 9, 1997 |
| 5661063 |
Semiconductor memory device provided with capacitors formed above and below a cell transistor and method for manufacturing the same |
Aug. 26, 1997 |
| 5656528 |
Method of forming a dynamic random access memory |
Aug. 12, 1997 |
| 5656552 |
Method of making a thin conformal high-yielding multi-chip module |
Aug. 12, 1997 |
| 5654226 |
Wafer bonding for power devices |
Aug. 5, 1997 |
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