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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6037198 |
Method of fabricating SOI wafer |
Mar. 14, 2000 |
| 6033925 |
Method for manufacturing a SOI-type semiconductor structure |
Mar. 7, 2000 |
| 6030883 |
Method of bonding substrates, detector cell produced according to this method and optical measuring apparatus having this detector cell |
Feb. 29, 2000 |
| 6027956 |
Process for producing planar dielectrically isolated high speed pin photodiode |
Feb. 22, 2000 |
| 6027949 |
Method for evaluating a semiconductor device |
Feb. 22, 2000 |
| 6025250 |
Methods including wafer grooves for reducing semiconductor wafer warping and related structure |
Feb. 15, 2000 |
| 6020215 |
Process for manufacturing microstructure |
Feb. 1, 2000 |
| 6020252 |
Method of producing a thin layer of semiconductor material |
Feb. 1, 2000 |
| 6013534 |
Method of thinning integrated circuits received in die form |
Jan. 11, 2000 |
| 6013563 |
Controlled cleaning process |
Jan. 11, 2000 |
| 6010951 |
Dual side fabricated semiconductor wafer |
Jan. 4, 2000 |
| 6010950 |
Method of manufacturing semiconductor bonded substrate |
Jan. 4, 2000 |
| 6008110 |
Semiconductor substrate and method of manufacturing same |
Dec. 28, 1999 |
| 6004866 |
Method for manufacturing bonded wafer and bonded wafer manufactured thereby |
Dec. 21, 1999 |
| 6004867 |
Chip-size packages assembled using mass production techniques at the wafer-level |
Dec. 21, 1999 |
| 6004865 |
Method of fabricating multi-layered structure having single crystalline semiconductor film formed on insulator |
Dec. 21, 1999 |
| 6001667 |
Method of manufacturing a semiconductor detector for detecting light and radiation |
Dec. 14, 1999 |
| 6001711 |
Process of fabricating semiconductor device having gettering site layer between insulating layer and active semiconductor layer |
Dec. 14, 1999 |
| 5998281 |
SOI wafer and method for the preparation thereof |
Dec. 7, 1999 |
| 5994204 |
Silicon-glass bonded wafers |
Nov. 30, 1999 |
| 5989974 |
Method of manufacturing a semiconductor device |
Nov. 23, 1999 |
| 5989981 |
Method of manufacturing SOI substrate |
Nov. 23, 1999 |
| 5985687 |
Method for making cleaved facets for lasers fabricated with gallium nitride and other noncubic materials |
Nov. 16, 1999 |
| 5985681 |
Method of producing bonded substrate with silicon-on-insulator structure |
Nov. 16, 1999 |
| 5985739 |
Semiconductor structures having advantageous high-frequency characteristics and processes for producing such semiconductor structures |
Nov. 16, 1999 |
| 5981391 |
Fabrication process of a semiconductor device including grinding of a semiconductor wafer |
Nov. 9, 1999 |
| 5980633 |
Process for producing a semiconductor substrate |
Nov. 9, 1999 |
| 5972780 |
Thin film forming apparatus and method |
Oct. 26, 1999 |
| 5970365 |
Silicon wafer including amorphous silicon layer formed by PCVD and method of manufacturing wafer |
Oct. 19, 1999 |
| 5966622 |
Process for bonding crystalline substrates with different crystal lattices |
Oct. 12, 1999 |
| 5956563 |
Method for reducing a transient thermal mismatch |
Sep. 21, 1999 |
| 5946584 |
Method for manufacturing a dielectric isolation substrate |
Aug. 31, 1999 |
| 5937312 |
Single-etch stop process for the manufacture of silicon-on-insulator wafers |
Aug. 10, 1999 |
| 5933750 |
Method of fabricating a semiconductor device with a thinned substrate |
Aug. 3, 1999 |
| 5930652 |
Semiconductor encapsulation method |
Jul. 27, 1999 |
| 5927993 |
Backside processing method |
Jul. 27, 1999 |
| 5926692 |
Method of manufacturing a support structure for a semiconductor pressure transducer |
Jul. 20, 1999 |
| 5920764 |
Process for restoring rejected wafers in line for reuse as new |
Jul. 6, 1999 |
| 5920766 |
Red and blue stacked laser diode array by wafer fusion |
Jul. 6, 1999 |
| 5918139 |
Method of manufacturing a bonding substrate |
Jun. 29, 1999 |
| 5904495 |
Interconnection technique for hybrid integrated devices |
May. 18, 1999 |
| 5902118 |
Method for production of a three-dimensional circuit arrangement |
May. 11, 1999 |
| 5899728 |
Method of forming a lithographic mask |
May. 4, 1999 |
| 5899712 |
Method for fabricating silicon-on-insulator device |
May. 4, 1999 |
| 5897333 |
Method for forming integrated composite semiconductor devices |
Apr. 27, 1999 |
| 5891298 |
Method and apparatus for peeling protective adhesive tape from semiconductor wafer |
Apr. 6, 1999 |
| 5880010 |
Ultrathin electronics |
Mar. 9, 1999 |
| 5877046 |
Methods of forming semiconductor-on-insulator substrates |
Mar. 2, 1999 |
| 5877034 |
Method of making a three-dimensional integrated circuit |
Mar. 2, 1999 |
| 5872025 |
Method for stacked three dimensional device manufacture |
Feb. 16, 1999 |
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