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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6472254 |
Integrated photovoltaic switch with integrated power device including etching backside of substrate |
Oct. 29, 2002 |
| 6472293 |
Method for manufacturing an interconnect structure for stacked semiconductor device |
Oct. 29, 2002 |
| 6468880 |
Method for fabricating complementary silicon on insulator devices using wafer bonding |
Oct. 22, 2002 |
| 6468879 |
Method and device for separating a plate of material, in particular semiconductor material, into two wafers |
Oct. 22, 2002 |
| 6468902 |
Semiconductor device and its manufacturing method |
Oct. 22, 2002 |
| 6465328 |
Semiconductor wafer manufacturing method |
Oct. 15, 2002 |
| 6461939 |
SOI wafers and methods for producing SOI wafer |
Oct. 8, 2002 |
| 6458619 |
Process for producing an isolated planar high speed pin photodiode with improved capacitance |
Oct. 1, 2002 |
| 6459107 |
Photodetector having a mixed crystal layer of SiGeC |
Oct. 1, 2002 |
| 6455429 |
Method of producing large-area membrane masks |
Sep. 24, 2002 |
| 6455396 |
SOI semiconductor device capable of preventing floating body effect |
Sep. 24, 2002 |
| 6455393 |
Air bridge/dielectric fill inductors |
Sep. 24, 2002 |
| 6455398 |
Silicon on III-V semiconductor bonding for monolithic optoelectronic integration |
Sep. 24, 2002 |
| 6448153 |
Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
Sep. 10, 2002 |
| 6448152 |
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer |
Sep. 10, 2002 |
| 6444493 |
Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method |
Sep. 3, 2002 |
| 6444491 |
Composite semiconductor devices and method for manufacture thereof |
Sep. 3, 2002 |
| 6444487 |
Flexible silicon strain gage |
Sep. 3, 2002 |
| 6440820 |
Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer |
Aug. 27, 2002 |
| 6436794 |
Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer |
Aug. 20, 2002 |
| 6429096 |
Method of making thinned, stackable semiconductor device |
Aug. 6, 2002 |
| 6428620 |
Substrate processing method and apparatus and SOI substrate |
Aug. 6, 2002 |
| 6426270 |
Substrate processing method and method of manufacturing semiconductor substrate |
Jul. 30, 2002 |
| 6425971 |
Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes |
Jul. 30, 2002 |
| 6420266 |
Methods for creating elements of predetermined shape and apparatuses using these elements |
Jul. 16, 2002 |
| 6420243 |
Method for producing SOI wafers by delamination |
Jul. 16, 2002 |
| 6420199 |
Methods for fabricating light emitting devices having aluminum gallium indium nitride structures and mirror stacks |
Jul. 16, 2002 |
| 6417075 |
Method for producing thin substrate layers |
Jul. 9, 2002 |
| 6417030 |
Leaky lower interface for reduction of floating body effect in SOI devices |
Jul. 9, 2002 |
| 6413798 |
Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
Jul. 2, 2002 |
| 6410371 |
Method of fabrication of semiconductor-on-insulator (SOI) wafer having a Si/SiGe/Si active layer |
Jun. 25, 2002 |
| 6410436 |
Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
Jun. 25, 2002 |
| 6406942 |
Flip chip type semiconductor device and method for manufacturing the same |
Jun. 18, 2002 |
| 6403447 |
Reduced substrate capacitance high performance SOI process |
Jun. 11, 2002 |
| 6403449 |
Method of relieving surface tension on a semiconductor wafer |
Jun. 11, 2002 |
| 6399464 |
Packaging die preparation |
Jun. 4, 2002 |
| 6399997 |
High performance system-on-chip using post passivation process and glass substrates |
Jun. 4, 2002 |
| 6391740 |
Generic layer transfer methodology by controlled cleavage process |
May. 21, 2002 |
| 6391744 |
Method of fabricating a non-SOI device on an SOI starting wafer and thinning the same |
May. 21, 2002 |
| 6391741 |
Fabrication process for microstructure protection systems related to hard disk reading unit |
May. 21, 2002 |
| 6388290 |
Single crystal silicon on polycrystalline silicon integrated circuits |
May. 14, 2002 |
| 6383849 |
Semiconductor device and method for fabricating the same |
May. 7, 2002 |
| 6384422 |
Method for manufacturing semiconductor device and ultrathin semiconductor device |
May. 7, 2002 |
| 6372608 |
Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring met |
Apr. 16, 2002 |
| 6372609 |
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method |
Apr. 16, 2002 |
| 6368942 |
Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer |
Apr. 9, 2002 |
| 6365918 |
Method and device for interconnected radio frequency power SiC field effect transistors |
Apr. 2, 2002 |
| 6365513 |
Method of making a semiconductor device including testing before thinning the semiconductor substrate |
Apr. 2, 2002 |
| 6362512 |
Microelectromechanical structures defined from silicon on insulator wafers |
Mar. 26, 2002 |
| 6362078 |
Dynamic threshold voltage device and methods for fabricating dynamic threshold voltage devices |
Mar. 26, 2002 |
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