Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8709912 Semiconductor device manufacturing method and device for same Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8704358 Method for forming an integrated circuit Apr. 22, 2014
8704238 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Apr. 22, 2014
8703591 Method for fabricating black silicon by using plasma immersion ion implantation Apr. 22, 2014
8692371 Semiconductor apparatus and manufacturing method thereof Apr. 8, 2014
8691665 Method for producing bonded wafer Apr. 8, 2014
8691664 Backside process for a substrate Apr. 8, 2014
8685806 Silicon-on-insulator substrate with built-in substrate junction Apr. 1, 2014
8683674 Method for stacking microelectronic devices Apr. 1, 2014
8679946 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Mar. 25, 2014
8679945 Backgrind process for integrated circuit wafers Mar. 25, 2014
8679944 Progressive trimming method Mar. 25, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8669166 Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereon Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8664087 Method of manufacturing a semiconductor structure and separating the semiconductor from a substrate Mar. 4, 2014
8664086 Semiconductor wafer, semiconductor thin film, and method for manufacturing semiconductor thin film devices Mar. 4, 2014
8664084 Method for making a thin-film element Mar. 4, 2014
8664082 Combination of a substrate and a wafer Mar. 4, 2014
8664081 Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier Mar. 4, 2014
8664078 Manufacturing method of semiconductor device on cavities Mar. 4, 2014
8652937 Methods of fabricating back-illuminated imaging sensors Feb. 18, 2014
8652925 Method of fabricating isolated capacitors and structure thereof Feb. 18, 2014
8647965 Radiographic image detector, method of producing the same, and protective member Feb. 11, 2014
8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera Feb. 4, 2014
8642390 Tape residue-free bump area after wafer back grinding Feb. 4, 2014
8637970 Chip package and fabrication method thereof Jan. 28, 2014
8637383 Strain relaxation using metal materials and related structures Jan. 28, 2014
8637381 High-k dielectric and silicon nitride box region Jan. 28, 2014
8633570 Method for manufacturing SOI substrate and SOI substrate Jan. 21, 2014
8633086 Power devices having reduced on-resistance and methods of their manufacture Jan. 21, 2014
8629482 Method for manufacturing semiconductor device Jan. 14, 2014
8629042 Method for stacking semiconductor dies Jan. 14, 2014
8623740 Method of detaching semi-conductor layers at low temperature Jan. 7, 2014
8617962 Method for finishing a substrate of the semiconductor-on-insulator type Dec. 31, 2013
8609511 Semiconductor device manufacturing method, semiconductor device, and camera module Dec. 17, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8609461 Semiconductor epitaxy on diamond for heat spreading applications Dec. 17, 2013
8603897 Method for manufacturing bonded wafer Dec. 10, 2013
8598013 Method for manufacturing SOI substrate and semiconductor device Dec. 3, 2013
8592952 Semiconductor chip and semiconductor package with stack chip structure Nov. 26, 2013
8592286 Ultra-thin wafer system and method of manufacture thereof Nov. 26, 2013
8586451 Flexible electronic device and method for the fabrication of same Nov. 19, 2013
8586450 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias Nov. 19, 2013
8580655 Processing method for bump-included device wafer Nov. 12, 2013
8580593 Epitaxial formation structures and associated methods of manufacturing solid state lighting devices Nov. 12, 2013
8575722 Semiconductor substrate having multilayer film and method to reuse the substrate by delaminating a porous layer Nov. 5, 2013
8575688 Trench device structure and fabrication Nov. 5, 2013











 
 
  Recently Added Patents
Apparatus with a local timing circuit that generates a multi-phase timing signal for a digital signal processing circuit
Bamboo scrimber and manufacturing method thereof
Sperm factor sequences
Circuit and method for generating an AC voltage from a plurality of voltage sources having a temporally variable DC output voltage
Memory device and method for dynamic random access memory having serial interface and integral instruction buffer
Liquid crystal display device and driving method thereof
Method and apparatus for communication channel error rate estimation
  Randomly Featured Patents
Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device
Thermal ink jet print device having phase change cooling
Hair grooming attachment
Skin permeation enhancer compositions
Separation of simultaneous events in a laser firing unit using a polarization technique
Polyether polyesters having anionic functionality
Nectar feeder access device
Vehicle with closed liftglass assembly
Pipe holder
Process for the purification of para-nitrophenol