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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7371660 |
Controlled cleaving process |
May. 13, 2008 |
| 7371662 |
Method for forming a 3D interconnect and resulting structures |
May. 13, 2008 |
| 7368062 |
Method and apparatus for a low parasitic capacitance butt-joined passive waveguide connected to an active structure |
May. 6, 2008 |
| 7368310 |
Light generating semiconductor device and method of making the same |
May. 6, 2008 |
| 7364954 |
Method for manufacturing semiconductor device |
Apr. 29, 2008 |
| 7364974 |
Double gate FET and fabrication process |
Apr. 29, 2008 |
| 7361528 |
Germanium infrared sensor for CMOS imagers |
Apr. 22, 2008 |
| 7358593 |
Microfabricated miniature grids |
Apr. 15, 2008 |
| 7358152 |
Wafer bonding of thinned electronic materials and circuits to high performance substrate |
Apr. 15, 2008 |
| 7354798 |
Three-dimensional device fabrication method |
Apr. 8, 2008 |
| 7348252 |
Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches |
Mar. 25, 2008 |
| 7348261 |
Wafer scale thin film package |
Mar. 25, 2008 |
| 7348262 |
Method for fabricating module of semiconductor chip |
Mar. 25, 2008 |
| 7348275 |
Processing method for semiconductor wafer |
Mar. 25, 2008 |
| 7344936 |
Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production |
Mar. 18, 2008 |
| 7344959 |
Metal filled through via structure for providing vertical wafer-to-wafer interconnection |
Mar. 18, 2008 |
| 7338896 |
Formation of deep via airgaps for three dimensional wafer to wafer interconnect |
Mar. 4, 2008 |
| 7338882 |
Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same |
Mar. 4, 2008 |
| 7338884 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Mar. 4, 2008 |
| 7335572 |
Method for low temperature bonding and bonded structure |
Feb. 26, 2008 |
| 7335574 |
Semiconductor device and manufacturing method of the same |
Feb. 26, 2008 |
| 7335575 |
Semiconductor constructions and semiconductor device fabrication methods |
Feb. 26, 2008 |
| 7332413 |
Semiconductor wafers including one or more reinforcement structures and methods of forming the same |
Feb. 19, 2008 |
| 7329588 |
Forming a reticle for extreme ultraviolet radiation and structures formed thereby |
Feb. 12, 2008 |
| 7326629 |
Method of stacking thin substrates by transfer bonding |
Feb. 5, 2008 |
| 7323396 |
Signal and/or ground planes with double buried insulator layers and fabrication process |
Jan. 29, 2008 |
| 7323355 |
Method of forming a microelectronic device |
Jan. 29, 2008 |
| 7323397 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Jan. 29, 2008 |
| 7320929 |
Method of fabricating SOI wafer |
Jan. 22, 2008 |
| 7316964 |
Active matrix substrate, a manufacturing method of the active matrix substrate |
Jan. 8, 2008 |
| 7312134 |
Dual stressed SOI substrates |
Dec. 25, 2007 |
| 7307005 |
Wafer bonding with highly compliant plate having filler material enclosed hollow core |
Dec. 11, 2007 |
| 7307010 |
Method for processing a thin semiconductor substrate |
Dec. 11, 2007 |
| 7300853 |
Thin layer semi-conductor structure comprising a heat distribution layer |
Nov. 27, 2007 |
| 7300857 |
Through-wafer interconnects for photoimager and memory wafers |
Nov. 27, 2007 |
| 7297612 |
Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes |
Nov. 20, 2007 |
| 7297614 |
Method for fabricating circuitry component |
Nov. 20, 2007 |
| 7297624 |
Semiconductor device and method for fabricating the same |
Nov. 20, 2007 |
| 7294564 |
Method for forming a layered semiconductor technology structure and corresponding layered semiconductor technology structure |
Nov. 13, 2007 |
| 7291542 |
Semiconductor wafer and manufacturing method thereof |
Nov. 6, 2007 |
| 7291538 |
Semiconductor memory device and manufacturing method of the same |
Nov. 6, 2007 |
| 7291543 |
Thin flip-chip method |
Nov. 6, 2007 |
| 7288465 |
Semiconductor wafer front side protection |
Oct. 30, 2007 |
| 7288471 |
Bumping electronic components using transfer substrates |
Oct. 30, 2007 |
| 7288489 |
Process for thinning a semiconductor workpiece |
Oct. 30, 2007 |
| 7285471 |
Process for transfer of a thin layer formed in a substrate with vacancy clusters |
Oct. 23, 2007 |
| 7279751 |
Semiconductor laser device and manufacturing method thereof |
Oct. 9, 2007 |
| 7276430 |
Manufacturing method of silicon on insulator wafer |
Oct. 2, 2007 |
| 7273797 |
Methods of forming semiconductor-on-insulator constructions |
Sep. 25, 2007 |
| 7271076 |
Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
Sep. 18, 2007 |
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