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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615394 |
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer |
Nov. 10, 2009 |
| 7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Nov. 10, 2009 |
| 7615466 |
Method for producing a semiconductor-on-insulator structure |
Nov. 10, 2009 |
| 7615467 |
Method for manufacturing SOI wafer |
Nov. 10, 2009 |
| 7615468 |
Methods for making substrates and substrates formed therefrom |
Nov. 10, 2009 |
| 7608483 |
Method of machining wafer |
Oct. 27, 2009 |
| 7605054 |
Method of forming a device wafer with recyclable support |
Oct. 20, 2009 |
| 7601615 |
Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
Oct. 13, 2009 |
| 7601217 |
Method of fabricating an epitaxially grown layer |
Oct. 13, 2009 |
| 7595257 |
Process of forming an electronic device including a barrier layer |
Sep. 29, 2009 |
| 7592235 |
Semiconductor device including semiconductor memory element and method for producing same |
Sep. 22, 2009 |
| 7592239 |
Flexible single-crystal film and method of manufacturing the same |
Sep. 22, 2009 |
| 7582540 |
Method for manufacturing SOI wafer |
Sep. 1, 2009 |
| 7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
Aug. 25, 2009 |
| 7579259 |
Simplified method of producing an epitaxially grown structure |
Aug. 25, 2009 |
| 7566631 |
Low temperature fusion bonding with high surface energy using a wet chemical treatment |
Jul. 28, 2009 |
| 7563691 |
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding |
Jul. 21, 2009 |
| 7563629 |
Method of fabricating vertical structure LEDs |
Jul. 21, 2009 |
| 7560305 |
Apparatus and method for high density multi-chip structures |
Jul. 14, 2009 |
| 7560310 |
Semiconductor constructions and semiconductor device fabrication methods |
Jul. 14, 2009 |
| 7560322 |
Method of making a semiconductor structure for high power semiconductor devices |
Jul. 14, 2009 |
| 7553695 |
Method of fabricating a package for a micro component |
Jun. 30, 2009 |
| 7553743 |
Wafer bonding method of system in package |
Jun. 30, 2009 |
| 7547609 |
Method and structure for implanting bonded substrates for electrical conductivity |
Jun. 16, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7544964 |
Method for fabricating thin layer device |
Jun. 9, 2009 |
| 7541224 |
Active matrix type display device and method of manufacturing the same |
Jun. 2, 2009 |
| 7541264 |
Temporary wafer bonding method for semiconductor processing |
Jun. 2, 2009 |
| 7541263 |
Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized |
Jun. 2, 2009 |
| 7538010 |
Method of fabricating an epitaxially grown layer |
May. 26, 2009 |
| 7534685 |
Method for fabrication of a capacitor, and a monolithically integrated circuit comprising such a capacitor |
May. 19, 2009 |
| 7534641 |
Method for manufacturing a micro-electro-mechanical device |
May. 19, 2009 |
| 7531425 |
Method of fabricating bonded wafer |
May. 12, 2009 |
| 7531430 |
Method for producing a semiconductor-on-insulator structure |
May. 12, 2009 |
| 7531428 |
Recycling the reconditioned substrates for fabricating compound material wafers |
May. 12, 2009 |
| 7528054 |
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips |
May. 5, 2009 |
| 7528053 |
Three-dimensional package and method of making the same |
May. 5, 2009 |
| 7521384 |
Method and apparatus for peeling surface protective film |
Apr. 21, 2009 |
| 7521363 |
MEMS device with non-standard profile |
Apr. 21, 2009 |
| 7521323 |
Method of fabricating a double gate field effect transistor device, and such a double gate field effect transistor device |
Apr. 21, 2009 |
| 7514341 |
Finishing process for the manufacture of a semiconductor structure |
Apr. 7, 2009 |
| 7514291 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies |
Apr. 7, 2009 |
| 7510945 |
Element formation substrate, method of manufacturing the same, and semiconductor device |
Mar. 31, 2009 |
| 7510950 |
Method for manufacturing semiconductor device |
Mar. 31, 2009 |
| 7507670 |
Silicon electrode assembly surface decontamination by acidic solution |
Mar. 24, 2009 |
| 7507638 |
Ultra-thin die and method of fabricating same |
Mar. 24, 2009 |
| 7507636 |
Amorphous Si/Au eutectic wafer bonding structure |
Mar. 24, 2009 |
| 7504277 |
Method for fabricating a high performance PIN focal plane structure using three handle wafers |
Mar. 17, 2009 |
| 7501303 |
Reflective layer buried in silicon and method of fabrication |
Mar. 10, 2009 |
| 7498234 |
Method of producing a thin layer of semiconductor material |
Mar. 3, 2009 |
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