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Class Information
Number: 438/459
Name: Semiconductor device manufacturing: process > Bonding of plural semiconductor substrates > Thinning of semiconductor substrate
Description: Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
7371660 Controlled cleaving process May. 13, 2008
7371662 Method for forming a 3D interconnect and resulting structures May. 13, 2008
7368062 Method and apparatus for a low parasitic capacitance butt-joined passive waveguide connected to an active structure May. 6, 2008
7368310 Light generating semiconductor device and method of making the same May. 6, 2008
7364954 Method for manufacturing semiconductor device Apr. 29, 2008
7364974 Double gate FET and fabrication process Apr. 29, 2008
7361528 Germanium infrared sensor for CMOS imagers Apr. 22, 2008
7358593 Microfabricated miniature grids Apr. 15, 2008
7358152 Wafer bonding of thinned electronic materials and circuits to high performance substrate Apr. 15, 2008
7354798 Three-dimensional device fabrication method Apr. 8, 2008
7348252 Method of forming silicon-on-insulator wafer having reentrant shape dielectric trenches Mar. 25, 2008
7348261 Wafer scale thin film package Mar. 25, 2008
7348262 Method for fabricating module of semiconductor chip Mar. 25, 2008
7348275 Processing method for semiconductor wafer Mar. 25, 2008
7344936 Semiconductor wafer with a wiring structure, a semiconductor component, and methods for their production Mar. 18, 2008
7344959 Metal filled through via structure for providing vertical wafer-to-wafer interconnection Mar. 18, 2008
7338896 Formation of deep via airgaps for three dimensional wafer to wafer interconnect Mar. 4, 2008
7338882 Method of fabricating nano SOI wafer and nano SOI wafer fabricated by the same Mar. 4, 2008
7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device Mar. 4, 2008
7335572 Method for low temperature bonding and bonded structure Feb. 26, 2008
7335574 Semiconductor device and manufacturing method of the same Feb. 26, 2008
7335575 Semiconductor constructions and semiconductor device fabrication methods Feb. 26, 2008
7332413 Semiconductor wafers including one or more reinforcement structures and methods of forming the same Feb. 19, 2008
7329588 Forming a reticle for extreme ultraviolet radiation and structures formed thereby Feb. 12, 2008
7326629 Method of stacking thin substrates by transfer bonding Feb. 5, 2008
7323396 Signal and/or ground planes with double buried insulator layers and fabrication process Jan. 29, 2008
7323355 Method of forming a microelectronic device Jan. 29, 2008
7323397 Method and apparatus of fabricating a semiconductor device by back grinding and dicing Jan. 29, 2008
7320929 Method of fabricating SOI wafer Jan. 22, 2008
7316964 Active matrix substrate, a manufacturing method of the active matrix substrate Jan. 8, 2008
7312134 Dual stressed SOI substrates Dec. 25, 2007
7307005 Wafer bonding with highly compliant plate having filler material enclosed hollow core Dec. 11, 2007
7307010 Method for processing a thin semiconductor substrate Dec. 11, 2007
7300853 Thin layer semi-conductor structure comprising a heat distribution layer Nov. 27, 2007
7300857 Through-wafer interconnects for photoimager and memory wafers Nov. 27, 2007
7297612 Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes Nov. 20, 2007
7297614 Method for fabricating circuitry component Nov. 20, 2007
7297624 Semiconductor device and method for fabricating the same Nov. 20, 2007
7294564 Method for forming a layered semiconductor technology structure and corresponding layered semiconductor technology structure Nov. 13, 2007
7291542 Semiconductor wafer and manufacturing method thereof Nov. 6, 2007
7291538 Semiconductor memory device and manufacturing method of the same Nov. 6, 2007
7291543 Thin flip-chip method Nov. 6, 2007
7288465 Semiconductor wafer front side protection Oct. 30, 2007
7288471 Bumping electronic components using transfer substrates Oct. 30, 2007
7288489 Process for thinning a semiconductor workpiece Oct. 30, 2007
7285471 Process for transfer of a thin layer formed in a substrate with vacancy clusters Oct. 23, 2007
7279751 Semiconductor laser device and manufacturing method thereof Oct. 9, 2007
7276430 Manufacturing method of silicon on insulator wafer Oct. 2, 2007
7273797 Methods of forming semiconductor-on-insulator constructions Sep. 25, 2007
7271076 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device Sep. 18, 2007

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